JPS5482700A - Paste compound for insulator forming - Google Patents

Paste compound for insulator forming

Info

Publication number
JPS5482700A
JPS5482700A JP15129877A JP15129877A JPS5482700A JP S5482700 A JPS5482700 A JP S5482700A JP 15129877 A JP15129877 A JP 15129877A JP 15129877 A JP15129877 A JP 15129877A JP S5482700 A JPS5482700 A JP S5482700A
Authority
JP
Japan
Prior art keywords
compound
powder
parts
bao
zno
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15129877A
Other languages
Japanese (ja)
Other versions
JPS6054721B2 (en
Inventor
Hideo Takanosawa
Masanori Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP15129877A priority Critical patent/JPS6054721B2/en
Publication of JPS5482700A publication Critical patent/JPS5482700A/en
Publication of JPS6054721B2 publication Critical patent/JPS6054721B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Glass Compositions (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Inorganic Insulating Materials (AREA)

Abstract

PURPOSE: To permit baking of compound at lower temperature and at lower dielectric constant by making a powder containing a fixed glass powder and ceramic powder into a paste compound.
CONSTITUTION: The 10 to 1 wt parts of a glass powder, consisting of more than 6 species of SiO2, B2O3, ZnO, PbO, Na2O, K2O, Li2O, BaO, Fe2O3, AL2O3 and GeO2, and O to 9 wt parts of a ceramic powder, consisting of more than one species of AL2O3, SiO2, Li2O, ZnO, ZrO2, CaO, BaO, La2O3, TiO2, Nb2O5, and Ta2O5, are mixed together to obtain a powder compound. The 1 to 9 wt parts of the powder compound and 1 to 6 wt parts of a liquid compound consisting of a binder and a dispersant are mixed to obtain a past compound. The compound of such a composition gives as insulator which is excellent in mechanical strengthy, thermal conductivity etc., when baked at low temperature.
COPYRIGHT: (C)1979,JPO&Japio
JP15129877A 1977-12-15 1977-12-15 Paste composition for forming insulators Expired JPS6054721B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15129877A JPS6054721B2 (en) 1977-12-15 1977-12-15 Paste composition for forming insulators

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15129877A JPS6054721B2 (en) 1977-12-15 1977-12-15 Paste composition for forming insulators

Publications (2)

Publication Number Publication Date
JPS5482700A true JPS5482700A (en) 1979-07-02
JPS6054721B2 JPS6054721B2 (en) 1985-12-02

Family

ID=15515618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15129877A Expired JPS6054721B2 (en) 1977-12-15 1977-12-15 Paste composition for forming insulators

Country Status (1)

Country Link
JP (1) JPS6054721B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61220203A (en) * 1985-03-25 1986-09-30 イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー Dielectric composition
JPS61220204A (en) * 1985-03-25 1986-09-30 イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー Dielectric composition
FR2636170A1 (en) * 1988-09-07 1990-03-09 Toshiba Lighting & Technology HYBRID INTEGRATED CIRCUIT IN WHICH A COPPER PLATE IS FORMED DIRECTLY ON THE CERAMIC SUBSTRATE, AND ITS MANUFACTURING METHOD
JPH0284795A (en) * 1988-09-21 1990-03-26 Nippon Denso Co Ltd Integrated circuit device
KR100496135B1 (en) * 2002-09-18 2005-06-16 (주) 알엔투테크놀로지 Low temperature cofired ceramic composition, and its use

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62243916A (en) * 1986-04-12 1987-10-24 Isuzu Motors Ltd Combustion chamber of internal combustion engine

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61220203A (en) * 1985-03-25 1986-09-30 イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー Dielectric composition
JPS61220204A (en) * 1985-03-25 1986-09-30 イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー Dielectric composition
FR2636170A1 (en) * 1988-09-07 1990-03-09 Toshiba Lighting & Technology HYBRID INTEGRATED CIRCUIT IN WHICH A COPPER PLATE IS FORMED DIRECTLY ON THE CERAMIC SUBSTRATE, AND ITS MANUFACTURING METHOD
US5036167A (en) * 1988-09-07 1991-07-30 Toshiba Lighting & Technology Corporation Board for hybrid integrated circuit
JPH0284795A (en) * 1988-09-21 1990-03-26 Nippon Denso Co Ltd Integrated circuit device
KR100496135B1 (en) * 2002-09-18 2005-06-16 (주) 알엔투테크놀로지 Low temperature cofired ceramic composition, and its use

Also Published As

Publication number Publication date
JPS6054721B2 (en) 1985-12-02

Similar Documents

Publication Publication Date Title
JPS5761642A (en) Ground coat frit composition for sheet steel enamel
JPS553329A (en) Optical glass
JPS55121925A (en) Optical glass
JPS57188431A (en) Optical glass containing thallium
JPS565348A (en) Color ceramic and color frit composition for automobile glass plate
JPS5482700A (en) Paste compound for insulator forming
JPS5777041A (en) Mixed glaze of colored frit glass
JPS5594975A (en) Low expansion powder composition for bonding use
JPS55113641A (en) Insulating glass composition
JPS55126548A (en) Glass for bead
JPS565349A (en) Color ceramic and color frit composition
JPS55100239A (en) Seal bonding glass composition
JPS565350A (en) Color ceramic and color frit composition
JPS5654251A (en) Optical glass
JPH07291656A (en) Insulating glass composition
JPS55126547A (en) Glass for bead
WO1999021803A3 (en) Dielectric glasses for low dielectric loss, low temperature cofired ceramics with medium dielectric constants
JPS5788039A (en) Frip composition for enameled substrate
JPS56149342A (en) Low-alkali frit for enamel
JPS5722139A (en) Glass composition for preparation of optical element
GB1216702A (en) Ceramic glazes
JPS5469000A (en) Electric insulator porcelain
JPS5441498A (en) Piezo-electric porcelain composition
JPS5520264A (en) Sealing glass composition
JPS5436598A (en) Ceramic dielecyric composite for temperature compensation