JPS5491180A - Mounting method of semiconductor device - Google Patents

Mounting method of semiconductor device

Info

Publication number
JPS5491180A
JPS5491180A JP16068977A JP16068977A JPS5491180A JP S5491180 A JPS5491180 A JP S5491180A JP 16068977 A JP16068977 A JP 16068977A JP 16068977 A JP16068977 A JP 16068977A JP S5491180 A JPS5491180 A JP S5491180A
Authority
JP
Japan
Prior art keywords
resin liquid
conductive layer
semiconductor device
thermo
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16068977A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5726412B2 (enrdf_load_stackoverflow
Inventor
Shiro Takeda
Yuji Nagai
Minoru Nakajima
Kunihiko Hayashi
Koji Serizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16068977A priority Critical patent/JPS5491180A/ja
Priority to US05/971,658 priority patent/US4326238A/en
Publication of JPS5491180A publication Critical patent/JPS5491180A/ja
Publication of JPS5726412B2 publication Critical patent/JPS5726412B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP16068977A 1977-12-28 1977-12-28 Mounting method of semiconductor device Granted JPS5491180A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP16068977A JPS5491180A (en) 1977-12-28 1977-12-28 Mounting method of semiconductor device
US05/971,658 US4326238A (en) 1977-12-28 1978-12-21 Electronic circuit packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16068977A JPS5491180A (en) 1977-12-28 1977-12-28 Mounting method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5491180A true JPS5491180A (en) 1979-07-19
JPS5726412B2 JPS5726412B2 (enrdf_load_stackoverflow) 1982-06-04

Family

ID=15720328

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16068977A Granted JPS5491180A (en) 1977-12-28 1977-12-28 Mounting method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5491180A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6215906U (enrdf_load_stackoverflow) * 1985-07-16 1987-01-30

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4931747A (enrdf_load_stackoverflow) * 1972-05-31 1974-03-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4931747A (enrdf_load_stackoverflow) * 1972-05-31 1974-03-22

Also Published As

Publication number Publication date
JPS5726412B2 (enrdf_load_stackoverflow) 1982-06-04

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