JPS6489498A - Liquid cooling of large computer and liquid cooling device therefor - Google Patents
Liquid cooling of large computer and liquid cooling device thereforInfo
- Publication number
- JPS6489498A JPS6489498A JP62243837A JP24383787A JPS6489498A JP S6489498 A JPS6489498 A JP S6489498A JP 62243837 A JP62243837 A JP 62243837A JP 24383787 A JP24383787 A JP 24383787A JP S6489498 A JPS6489498 A JP S6489498A
- Authority
- JP
- Japan
- Prior art keywords
- liquid cooling
- contact
- protrusions
- module
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE:To lessen contact thermal resistance, by installing a part having protrusions at a part or through the whole surface of either or both contact faces which are made between a semiconductor module and a liquid cooling module. CONSTITUTION:The mainframe 1 of a semiconductor module is equipped with a number of semiconductor chips on its substrate made of ceramic and the like. It has a structure where the semiconductor chips are covered collectively with metals or ceramics. Pipes 5 for cooled liquid are arranged at the upper part of a liquid cooling module 2 to carry out the supply and recovery of liquid. At the liquid cooling module 2 having a cooling water part 2', internal pressure is applied to the cooling water path in the liquid cooling module 2 so that more than one place of protrusions are produced along the center part of the cooling water path and this device makes faces of contact with the semiconductor module perform plastic deformation. In such a case, the monitoring of internal pressure makes it possible to control the maximum amount of plastic deformation, that is, the form of the protrusions 2. In the case of the contact faces having the protrusions at one side or both sides, a region having contact face pressure of more than a specified value which controls contact thermal resistance increases in comparison with that of contact faces which are flat on both sides and then, contact thermal resistance decreases.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62243837A JPS6489498A (en) | 1987-09-30 | 1987-09-30 | Liquid cooling of large computer and liquid cooling device therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62243837A JPS6489498A (en) | 1987-09-30 | 1987-09-30 | Liquid cooling of large computer and liquid cooling device therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6489498A true JPS6489498A (en) | 1989-04-03 |
Family
ID=17109681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62243837A Pending JPS6489498A (en) | 1987-09-30 | 1987-09-30 | Liquid cooling of large computer and liquid cooling device therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6489498A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4989668A (en) * | 1988-12-12 | 1991-02-05 | Toshin Technical Co., Ltd. | Liquid heating or cooling circulator |
| KR100778913B1 (en) * | 2001-05-21 | 2007-11-22 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor Package with Heat Spreader using Cooling Material |
| JP2012104550A (en) * | 2010-11-08 | 2012-05-31 | Nec Computertechno Ltd | Device of cooling semiconductor package |
| WO2023272473A1 (en) * | 2021-06-29 | 2023-01-05 | 华为技术有限公司 | Heat dissipation apparatus and electronic device |
-
1987
- 1987-09-30 JP JP62243837A patent/JPS6489498A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4989668A (en) * | 1988-12-12 | 1991-02-05 | Toshin Technical Co., Ltd. | Liquid heating or cooling circulator |
| KR100778913B1 (en) * | 2001-05-21 | 2007-11-22 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor Package with Heat Spreader using Cooling Material |
| JP2012104550A (en) * | 2010-11-08 | 2012-05-31 | Nec Computertechno Ltd | Device of cooling semiconductor package |
| WO2023272473A1 (en) * | 2021-06-29 | 2023-01-05 | 华为技术有限公司 | Heat dissipation apparatus and electronic device |
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