KR890003527B1

KR890003527B1 - Radiator for semiconductor

Info

Publication number: KR890003527B1
Application number: KR1019870006558A
Authority: KR
Inventors: 송태호; 방세윤
Original assignee: 한국기계연구소; 이해
Priority date: 1987-06-27
Filing date: 1987-06-27
Publication date: 1989-09-23
Also published as: KR890001184A

Abstract

A semiconductor cooling module of block type comprises a pair of upper and lower bodies (1,2). The annular passages (9) formed around the pistons (3) inserted in the lower body (2) communicate with one another via a coolant passage (7). The pressure space (8) formed over the piston (3) head in the upper body (1) communicates with the coolant passage (7) through the annular gap (6) around the piston (3) inserted therein. The O-ring (5) is used for sealing the coolant which is flowing within the cooling module.

Description

Semiconductor cooling module

제1도는 일부를 절개한 본 발명의 사시도.1 is a perspective view of the present invention with a part cut away.

제2도는 본 발명의 입면상태의 작용설명도.2 is an explanatory view of the operation of the elevation of the present invention.

제3도는 본 발명의 평면상태의 작용설명도.3 is an explanatory view of the operation of the planar state of the present invention.

제4도-제5도는 종래 냉각모듈의 구조설명도.4 to 5 is a structural diagram of a conventional cooling module.

본 발명은 전자기기에 내장된 회로중 반도체를 냉각시키는 냉각모듈(MODULE)에 있어서, 접촉 피스톤외면 전체로 냉각액을 통과 순환시켜서 냉각효율을 상승시키는 냉각모듈에 관한 것이다.The present invention relates to a cooling module (MODULE) for cooling a semiconductor in a circuit embedded in an electronic device, to increase the cooling efficiency by circulating the cooling liquid through the entire contact piston outer surface.

종래 전자기기의 냉각모듈은 접촉피스톤을 사용한 경우 반도체로부터 냉각액까지의 열유동경로가 제4도-제5도와 같이 반도체→접촉부위→피스톤몸체→냉각블럭→냉각액의 순서로 매우 길게 전달되어 전체열저항이 커서 냉각효율이 저하되는 구조이고 직접 접촉식 냉각모듈의 경우, 반도체와 냉각액 사이를 밀봉하는 접촉판이 반도체에 고착되므로 수리시에는 냉각모듈까지 바꾸어야하는 비경제적인 구조이다.In the conventional cooling module, when the contact piston is used, the heat flow path from the semiconductor to the coolant is transferred very long in the order of semiconductor → contact area → piston body → cooling block → coolant as shown in FIGS. Since the resistance is large, the cooling efficiency is deteriorated. In the case of the direct contact cooling module, the contact plate sealing the semiconductor and the cooling liquid is fixed to the semiconductor.

본 발명은 피스톤아래에 10㎝ 내외의 곡률밤경을 갖는 반도체 접촉면을 가공하고 피스톤의 외면주위에 냉각액이 직접싸고 흐르도록 냉각모듈의 냉각액 유로를 설치함으로서 냉각한다. 피스톤의 다른쪽 원형단면은 압력을 받는 냉각액에 노출시켜 반도체에 적절한 힘을 가하여 접촉되도록하며 피스톤을 오링으로 기밀을 유지하여 냉각액의 누설을 방지시키게한 것이다.The present invention processes the semiconductor contact surface having a curvature night diameter of about 10 cm below the piston and cools by installing a cooling liquid flow path of the cooling module so that the cooling liquid flows directly around the outer surface of the piston. The other circular section of the piston is exposed to the pressured coolant so that it comes into contact with an appropriate force on the semiconductor and the piston is kept airtight to prevent leakage of the coolant.

이하 발명의 요지를 첨부도면에 연계시켜 설명하면 다음과 같다. 상부체(1)와 하부체(2)로된 냉각블럭(B)에 있어서, 각 피스톤(3)의 하단 외면에 오링(5)을 끼우고 각 피스톤이 삽입되는 하부체(2)에 환형통로(9)를 형성하여 오링(5) 상단위치에서 냉각액통로(7)를 연통하고 각 피스톤이 삽입되는 상부체(1)에 압력공간(8)을 형성하여 환형통로(9)와 냉각액통로(7)로서 연통시킨 구조이다.Hereinafter, the gist of the invention will be described in connection with the accompanying drawings. In the cooling block (B) consisting of the upper body (1) and the lower body (2), an annular passage is inserted into the lower body (2) into which the O-ring (5) is fitted on the lower outer surface of each piston (3). (9) to form a pressure space (8) in the upper body (1) in which each piston is inserted and communicate with the coolant passage (7) in the upper position of the O-ring (5) to form an annular passage (9) and the coolant passage (7) It is a structure connected as).

미설명부호 10은 기판, 11은 반도체, 12는 냉각액입구관, 13은 냉각액출구관이다. 이와같이된 본 발명은 냉각피스톤은 압격공간(8)아래의 약 0.1㎜ 가량의 틈(6)을 통하여 압력이 전달되면서 반도체를 눌러주고 있는 것인데 반도체로부터 발생된 열은 볼록한 하부 접촉면을 통하여 피스톤몸체로 전달되고 이 열은 냉각블럭 하부체(2)의 냉각액통로(7)과 피스톤 외부의 수 미리미터간격의 환형통로(9)를 흐르는 냉각액에 의하여 흡수된다.Reference numeral 10 denotes a substrate, 11 a semiconductor, 12 a coolant inlet tube, and 13 a coolant outlet tube. According to the present invention, the cooling piston presses the semiconductor while the pressure is transmitted through the gap 6 of about 0.1 mm below the pressing space 8, and heat generated from the semiconductor is transferred to the piston body through the convex lower contact surface. This heat is absorbed by the cooling liquid flowing through the cooling liquid passage 7 of the cooling block lower body 2 and the annular passage 9 spaced several millimeters outside the piston.

이때 냉각액은 오링(5)를 사용하여 기밀이 유지되면 피스톤이 실린더에서 빠지지않도록 피스톤에 돌기(4)가 만들어진 것이다.At this time, the coolant is a projection (4) is made to the piston so that the piston does not fall out of the cylinder when the airtight is maintained using the O-ring (5).

제 3 도는 여러개의 반도체를 동시에 냉각하는 개념도로서 피스톤이 각각의 반도체를 냉각액의 압력으로 누르고 있고 이 주위로 환형통로(9)가 형성되어 입구로 유입된 압력하의 냉각액이 환형통로(9)→냉각액통로(7)→환형통로(9)를 거쳐 출구로나가는 것을 설명하는 것이다.3 is a conceptual diagram in which several semiconductors are simultaneously cooled. A piston presses each semiconductor under the pressure of the cooling liquid, and an annular passage 9 is formed around the annular passage so that the coolant under the pressure flowing into the inlet is the annular passage 9 → the cooling liquid. The passage 7 through the annular passage 9 will be described.

제 1 도는 냉각모듈이 반도체(11)들이 장치된 기판(10)위에 설치된 모양인데 냉각블럭의 상하부체는 작은 나사들로 체결하는 것이며 이 냉각모듈은 여러개를 동시에 이어서 사용할 수 있으며, 본 발명의 실시예로서 피스톤과 반도체 사이에 전도성 점액을 바르고, 피스톤직경 약1㎝, 피스톤과 블럭사이의 냉각액통로 두께를 수밀리미터, 피스톤높이는 1-2㎝로 유지하면 반도체로부터 냉각액까지의 전체열 저항은 피스톤 1개당 약 5℃/W 이하까지 낮출수 있는 것이다. 그러므로 본 발명의 냉각모듈을 전자기기에 응용하면 반도체의 냉각효율을 상승시킴으로서 전자기기전체 성능 향상에 도움을 주는 등 전자산업에 널리 이용할 수 있는 것이다.1 is a cooling module is installed on the substrate 10 is equipped with a semiconductor (11), the upper and lower parts of the cooling block is fastened with a small screw, the cooling module can be used in succession of several at the same time, the implementation of the present invention For example, if conductive mucus is applied between the piston and the semiconductor, and the piston diameter is about 1 cm, the thickness of the cooling fluid passageway between the piston and the block is several millimeters, and the piston height is 1-2 cm, then the total heat resistance from the semiconductor to the cooling liquid is Piston 1 Can be lowered to about 5 ℃ / W or less per piece. Therefore, if the cooling module of the present invention is applied to an electronic device, the cooling efficiency of the semiconductor may be increased, and thus, the cooling module of the present invention may be widely used in the electronic industry.

Claims

The O-ring 5 is inserted into the piston 3 inserted into the cooling block, and the annular passage 9 is formed in the lower body 2 into which the piston 3 is inserted, so as to communicate with each other as the coolant passage 7, respectively. The semiconductor cooling module in which a pressure space (8) is formed in the upper body (1) into which is inserted) and communicated with the annular gap (6).