JPS5461491A - Forming method of electrode wiring - Google Patents

Forming method of electrode wiring

Info

Publication number
JPS5461491A
JPS5461491A JP12750677A JP12750677A JPS5461491A JP S5461491 A JPS5461491 A JP S5461491A JP 12750677 A JP12750677 A JP 12750677A JP 12750677 A JP12750677 A JP 12750677A JP S5461491 A JPS5461491 A JP S5461491A
Authority
JP
Japan
Prior art keywords
electrode wiring
wiring
electrode
forming method
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12750677A
Other languages
Japanese (ja)
Inventor
Tatsu Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12750677A priority Critical patent/JPS5461491A/en
Publication of JPS5461491A publication Critical patent/JPS5461491A/en
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To enable flat wiring and multi-layer constitution, by implanting the electrode wiring to the grooves of the electrode wiring pattern shape, in the electrode wiring forming method providing electrode and wiring on the semiconductor substrate with planer technology.
CONSTITUTION: The silicon nitride film 13 is formed on the substrate by utilizing plasma discharge, the photo resist mask 14 is formed on it, and the silicon nitride film 13 for the uaeart not forming the mask 14 is etched by utilizing plasma discharge, forming the grooves 15,16,17 of the electrode wiring pattern, and wiring metal matrial is evaporated on the entire surface and the photo resist is removed by melting
COPYRIGHT: (C)1979,JPO&Japio
JP12750677A 1977-10-26 1977-10-26 Forming method of electrode wiring Pending JPS5461491A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12750677A JPS5461491A (en) 1977-10-26 1977-10-26 Forming method of electrode wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12750677A JPS5461491A (en) 1977-10-26 1977-10-26 Forming method of electrode wiring

Publications (1)

Publication Number Publication Date
JPS5461491A true JPS5461491A (en) 1979-05-17

Family

ID=14961665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12750677A Pending JPS5461491A (en) 1977-10-26 1977-10-26 Forming method of electrode wiring

Country Status (1)

Country Link
JP (1) JPS5461491A (en)

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