JPS54158885A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPS54158885A
JPS54158885A JP6790278A JP6790278A JPS54158885A JP S54158885 A JPS54158885 A JP S54158885A JP 6790278 A JP6790278 A JP 6790278A JP 6790278 A JP6790278 A JP 6790278A JP S54158885 A JPS54158885 A JP S54158885A
Authority
JP
Japan
Prior art keywords
pellet
schottky barrier
wire
bonded
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6790278A
Other languages
Japanese (ja)
Inventor
Shingo Kawashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6790278A priority Critical patent/JPS54158885A/en
Publication of JPS54158885A publication Critical patent/JPS54158885A/en
Pending legal-status Critical Current

Links

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Protection Of Static Devices (AREA)

Abstract

PURPOSE: To preventing an IC from breaking down due to a reverse connection of a power supply with no need for a special attachment circuit by making a power line and a pellet surface not in ohmic ontact but in contact via a Schottky barrier diode.
CONSTITUTION: In a P-type semiconductor substrate, a N-type layer is formed and made into pellet 1 with PN junction and in the fixed region of the N-type layer, wire 4 of Au, etc., is bonded. At this time, ohmic contact is not made and Schottky barrier formation metal 6 is bonded so as to obtain Schottky barrier diode 7, thereby bonding wire 4 to this metal 6. In this way, diode 7 with a function of rectifying is interposed between the surface of pellet 1 and wire 4, so that even if the power supply is reversely connected by mistake, pellet 1 will never break down.
COPYRIGHT: (C)1979,JPO&Japio
JP6790278A 1978-06-06 1978-06-06 Semiconductor integrated circuit Pending JPS54158885A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6790278A JPS54158885A (en) 1978-06-06 1978-06-06 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6790278A JPS54158885A (en) 1978-06-06 1978-06-06 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS54158885A true JPS54158885A (en) 1979-12-15

Family

ID=13358280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6790278A Pending JPS54158885A (en) 1978-06-06 1978-06-06 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS54158885A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5965464A (en) * 1982-10-05 1984-04-13 Matsushita Electronics Corp Semiconductor integrated circuit device
JPS60241250A (en) * 1984-05-15 1985-11-30 Mitsubishi Electric Corp Semiconductor device
JPS6163852U (en) * 1984-09-29 1986-04-30
JPS6276543A (en) * 1985-09-28 1987-04-08 Fujitsu Ltd Semiconductor integrated circuit

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5965464A (en) * 1982-10-05 1984-04-13 Matsushita Electronics Corp Semiconductor integrated circuit device
JPS60241250A (en) * 1984-05-15 1985-11-30 Mitsubishi Electric Corp Semiconductor device
JPS6163852U (en) * 1984-09-29 1986-04-30
JPS6276543A (en) * 1985-09-28 1987-04-08 Fujitsu Ltd Semiconductor integrated circuit

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