Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
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Filing date
Publication date
Application filed by Fujitsu LtdfiledCriticalFujitsu Ltd
Priority to JP14685476ApriorityCriticalpatent/JPS5370775A/en
Publication of JPS5370775ApublicationCriticalpatent/JPS5370775A/en
PURPOSE: To flatten surface and avert wiring by forming an insulation film on an insulation substrate, beforehand protecting isolating region layers with a mask, etching away exposed portions, thereafter epitaxially growing a semiconductor layer over the entire surface and forming a semiconductor element and other element here.
COPYRIGHT: (C)1978,JPO&Japio
JP14685476A1976-12-071976-12-07Production of semiconductor device
PendingJPS5370775A
(en)