JPS5346276A - Carrier tape - Google Patents

Carrier tape

Info

Publication number
JPS5346276A
JPS5346276A JP12033876A JP12033876A JPS5346276A JP S5346276 A JPS5346276 A JP S5346276A JP 12033876 A JP12033876 A JP 12033876A JP 12033876 A JP12033876 A JP 12033876A JP S5346276 A JPS5346276 A JP S5346276A
Authority
JP
Japan
Prior art keywords
carrier tape
insulation
redction
leads
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12033876A
Other languages
English (en)
Inventor
Keiji Miyamoto
Sumio Nishida
Toru Kawanobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12033876A priority Critical patent/JPS5346276A/ja
Publication of JPS5346276A publication Critical patent/JPS5346276A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP12033876A 1976-10-08 1976-10-08 Carrier tape Pending JPS5346276A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12033876A JPS5346276A (en) 1976-10-08 1976-10-08 Carrier tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12033876A JPS5346276A (en) 1976-10-08 1976-10-08 Carrier tape

Publications (1)

Publication Number Publication Date
JPS5346276A true JPS5346276A (en) 1978-04-25

Family

ID=14783772

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12033876A Pending JPS5346276A (en) 1976-10-08 1976-10-08 Carrier tape

Country Status (1)

Country Link
JP (1) JPS5346276A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5574148A (en) * 1978-11-29 1980-06-04 Nec Corp Production of semiconductor device
JPS5816555A (ja) * 1981-07-22 1983-01-31 Nec Corp リ−ドフレ−ム
JPS60221000A (ja) * 1983-12-27 1985-11-05 ロジヤ−ス・コ−ポレイシヨン 集積回路のテ−プ自動化接合方法および装置
JPS63160239A (ja) * 1986-12-23 1988-07-04 Nec Corp リ−ド・ボンデイング方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5574148A (en) * 1978-11-29 1980-06-04 Nec Corp Production of semiconductor device
JPS6142858B2 (ja) * 1978-11-29 1986-09-24 Nippon Electric Co
JPS5816555A (ja) * 1981-07-22 1983-01-31 Nec Corp リ−ドフレ−ム
JPS60221000A (ja) * 1983-12-27 1985-11-05 ロジヤ−ス・コ−ポレイシヨン 集積回路のテ−プ自動化接合方法および装置
JPS63160239A (ja) * 1986-12-23 1988-07-04 Nec Corp リ−ド・ボンデイング方法

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