JPS5338971A - Carrier tape - Google Patents

Carrier tape

Info

Publication number
JPS5338971A
JPS5338971A JP11308076A JP11308076A JPS5338971A JP S5338971 A JPS5338971 A JP S5338971A JP 11308076 A JP11308076 A JP 11308076A JP 11308076 A JP11308076 A JP 11308076A JP S5338971 A JPS5338971 A JP S5338971A
Authority
JP
Japan
Prior art keywords
carrier tape
resin
flowdown
mold
narrow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11308076A
Other languages
Japanese (ja)
Inventor
Toru Kawanobe
Kanji Otsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11308076A priority Critical patent/JPS5338971A/en
Publication of JPS5338971A publication Critical patent/JPS5338971A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To narrow the actual gap between the chip and the resin attachment part by adjusting the lead width on a carrier tape, and thus to prevent the flowdown of the mold-use resin.
COPYRIGHT: (C)1978,JPO&Japio
JP11308076A 1976-09-22 1976-09-22 Carrier tape Pending JPS5338971A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11308076A JPS5338971A (en) 1976-09-22 1976-09-22 Carrier tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11308076A JPS5338971A (en) 1976-09-22 1976-09-22 Carrier tape

Publications (1)

Publication Number Publication Date
JPS5338971A true JPS5338971A (en) 1978-04-10

Family

ID=14602964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11308076A Pending JPS5338971A (en) 1976-09-22 1976-09-22 Carrier tape

Country Status (1)

Country Link
JP (1) JPS5338971A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53103659U (en) * 1977-01-25 1978-08-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53103659U (en) * 1977-01-25 1978-08-21

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