JPS51123562A - Production method of semiconductor device - Google Patents
Production method of semiconductor deviceInfo
- Publication number
- JPS51123562A JPS51123562A JP50048379A JP4837975A JPS51123562A JP S51123562 A JPS51123562 A JP S51123562A JP 50048379 A JP50048379 A JP 50048379A JP 4837975 A JP4837975 A JP 4837975A JP S51123562 A JPS51123562 A JP S51123562A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- production method
- semiresistance
- change
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
Landscapes
- Bipolar Transistors (AREA)
- Element Separation (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50048379A JPS51123562A (en) | 1975-04-21 | 1975-04-21 | Production method of semiconductor device |
| GB15649/76A GB1532456A (en) | 1975-04-21 | 1976-04-15 | Methods of making passivating layers for semiconductor devices |
| US05/678,417 US4081292A (en) | 1975-04-21 | 1976-04-19 | Method of manufacturing a semi-insulating silicon layer |
| CA250,484A CA1059241A (en) | 1975-04-21 | 1976-04-20 | Method of manufacturing a semiconductor device employing silicon ion implantation into silicon compound layer |
| FR7611730A FR2309039A1 (fr) | 1975-04-21 | 1976-04-21 | Dispositif semi-conducteur et procede pour realiser dans celui-ci une couche semi-isolante en silicium |
| NL7604238A NL7604238A (nl) | 1975-04-21 | 1976-04-21 | Halfgeleiderinrichting. |
| DE19762617398 DE2617398A1 (de) | 1975-04-21 | 1976-04-21 | Halbleiterbauelement und verfahren zu seiner herstellung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50048379A JPS51123562A (en) | 1975-04-21 | 1975-04-21 | Production method of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51123562A true JPS51123562A (en) | 1976-10-28 |
Family
ID=12801674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50048379A Pending JPS51123562A (en) | 1975-04-21 | 1975-04-21 | Production method of semiconductor device |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4081292A (enExample) |
| JP (1) | JPS51123562A (enExample) |
| CA (1) | CA1059241A (enExample) |
| DE (1) | DE2617398A1 (enExample) |
| FR (1) | FR2309039A1 (enExample) |
| GB (1) | GB1532456A (enExample) |
| NL (1) | NL7604238A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61271869A (ja) * | 1985-05-27 | 1986-12-02 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2627855A1 (de) * | 1976-06-22 | 1977-12-29 | Siemens Ag | Halbleiterbauelement mit wenigstens zwei, einen pn-uebergang bildenden zonen unterschiedlichen leitungstyps sowie verfahren zu dessen herstellung |
| US4178191A (en) * | 1978-08-10 | 1979-12-11 | Rca Corp. | Process of making a planar MOS silicon-on-insulating substrate device |
| US4197144A (en) * | 1978-09-21 | 1980-04-08 | General Electric Company | Method for improving writing of information in memory targets |
| US4420765A (en) * | 1981-05-29 | 1983-12-13 | Rca Corporation | Multi-layer passivant system |
| DE3138960A1 (de) * | 1981-09-30 | 1983-04-14 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur erzeugung elektrisch leitender schichten |
| JPS58101439A (ja) * | 1981-12-12 | 1983-06-16 | Toshiba Corp | 半導体装置の製造方法 |
| JPS5935425A (ja) * | 1982-08-23 | 1984-02-27 | Toshiba Corp | 半導体装置の製造方法 |
| US4679308A (en) * | 1984-12-14 | 1987-07-14 | Honeywell Inc. | Process for controlling mobile ion contamination in semiconductor devices |
| US4634473A (en) * | 1985-09-09 | 1987-01-06 | Rca Corporation | Method for fabricating a radiation hardened oxide having structural damage |
| JPH0750693B2 (ja) * | 1985-12-02 | 1995-05-31 | 日本テキサス・インスツルメンツ株式会社 | 酸化シリコン膜の製造方法 |
| US4732867A (en) * | 1986-11-03 | 1988-03-22 | General Electric Company | Method of forming alignment marks in sapphire |
| US5591661A (en) * | 1992-04-07 | 1997-01-07 | Shiota; Philip | Method for fabricating devices for electrostatic discharge protection and voltage references, and the resulting structures |
| JPH0786515A (ja) * | 1993-09-16 | 1995-03-31 | Nec Corp | ポリシリコン抵抗体の形成方法 |
| US5882961A (en) * | 1995-09-11 | 1999-03-16 | Motorola, Inc. | Method of manufacturing semiconductor device with reduced charge trapping |
| US5672522A (en) * | 1996-03-05 | 1997-09-30 | Trw Inc. | Method for making selective subcollector heterojunction bipolar transistors |
| US5677562A (en) * | 1996-05-14 | 1997-10-14 | General Instrument Corporation Of Delaware | Planar P-N junction semiconductor structure with multilayer passivation |
| SE509780C2 (sv) * | 1997-07-04 | 1999-03-08 | Ericsson Telefon Ab L M | Bipolär effekttransistor och framställningsförfarande |
| JP5195186B2 (ja) * | 2008-09-05 | 2013-05-08 | 三菱電機株式会社 | 半導体装置の製造方法 |
| CN105097570B (zh) * | 2014-05-21 | 2017-12-19 | 北大方正集团有限公司 | 钝化层制造方法及高压半导体功率器件 |
| KR102850766B1 (ko) | 2020-10-08 | 2025-08-25 | 삼성전자주식회사 | 집적회로 장치 및 그 제조 방법 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3533857A (en) * | 1967-11-29 | 1970-10-13 | Hughes Aircraft Co | Method of restoring crystals damaged by irradiation |
| US3897274A (en) * | 1971-06-01 | 1975-07-29 | Texas Instruments Inc | Method of fabricating dielectrically isolated semiconductor structures |
| CH549285A (de) * | 1972-12-14 | 1974-05-15 | Ibm | Verfahren zum herstellen amorpher halbleiterschichten. |
| US3871067A (en) * | 1973-06-29 | 1975-03-18 | Ibm | Method of manufacturing a semiconductor device |
| US3900345A (en) * | 1973-08-02 | 1975-08-19 | Motorola Inc | Thin low temperature epi regions by conversion of an amorphous layer |
| JPS532552B2 (enExample) * | 1974-03-30 | 1978-01-28 |
-
1975
- 1975-04-21 JP JP50048379A patent/JPS51123562A/ja active Pending
-
1976
- 1976-04-15 GB GB15649/76A patent/GB1532456A/en not_active Expired
- 1976-04-19 US US05/678,417 patent/US4081292A/en not_active Expired - Lifetime
- 1976-04-20 CA CA250,484A patent/CA1059241A/en not_active Expired
- 1976-04-21 DE DE19762617398 patent/DE2617398A1/de not_active Withdrawn
- 1976-04-21 FR FR7611730A patent/FR2309039A1/fr active Granted
- 1976-04-21 NL NL7604238A patent/NL7604238A/xx not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61271869A (ja) * | 1985-05-27 | 1986-12-02 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US4081292A (en) | 1978-03-28 |
| GB1532456A (en) | 1978-11-15 |
| FR2309039A1 (fr) | 1976-11-19 |
| NL7604238A (nl) | 1976-10-25 |
| CA1059241A (en) | 1979-07-24 |
| DE2617398A1 (de) | 1976-11-04 |
| FR2309039B1 (enExample) | 1980-05-09 |
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