JPS542657A - Manufacture for semiconductor device - Google Patents

Manufacture for semiconductor device

Info

Publication number
JPS542657A
JPS542657A JP6823677A JP6823677A JPS542657A JP S542657 A JPS542657 A JP S542657A JP 6823677 A JP6823677 A JP 6823677A JP 6823677 A JP6823677 A JP 6823677A JP S542657 A JPS542657 A JP S542657A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
main surface
semiconductor
influence
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6823677A
Other languages
Japanese (ja)
Inventor
Yoichi Akasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP6823677A priority Critical patent/JPS542657A/en
Publication of JPS542657A publication Critical patent/JPS542657A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To reduce the influence of a crystal defect induced in a manufacture process, by adhering poly Si or Si3 N4 film to the 2nd main surface opposite to the 1st main surface where the function regions of a semiconductor are mainly formed.
COPYRIGHT: (C)1979,JPO&Japio
JP6823677A 1977-06-08 1977-06-08 Manufacture for semiconductor device Pending JPS542657A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6823677A JPS542657A (en) 1977-06-08 1977-06-08 Manufacture for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6823677A JPS542657A (en) 1977-06-08 1977-06-08 Manufacture for semiconductor device

Publications (1)

Publication Number Publication Date
JPS542657A true JPS542657A (en) 1979-01-10

Family

ID=13367942

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6823677A Pending JPS542657A (en) 1977-06-08 1977-06-08 Manufacture for semiconductor device

Country Status (1)

Country Link
JP (1) JPS542657A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5762538A (en) * 1980-10-01 1982-04-15 Nec Corp Manufacture of semiconductor device
US5189508A (en) * 1988-03-30 1993-02-23 Nippon Steel Corporation Silicon wafer excelling in gettering ability and method for production thereof
US5478758A (en) * 1994-06-03 1995-12-26 At&T Corp. Method of making a getterer for multi-layer wafers
US5892292A (en) * 1994-06-03 1999-04-06 Lucent Technologies Inc. Getterer for multi-layer wafers and method for making same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5762538A (en) * 1980-10-01 1982-04-15 Nec Corp Manufacture of semiconductor device
JPS613090B2 (en) * 1980-10-01 1986-01-30 Nippon Electric Co
US5189508A (en) * 1988-03-30 1993-02-23 Nippon Steel Corporation Silicon wafer excelling in gettering ability and method for production thereof
US5478758A (en) * 1994-06-03 1995-12-26 At&T Corp. Method of making a getterer for multi-layer wafers
US5892292A (en) * 1994-06-03 1999-04-06 Lucent Technologies Inc. Getterer for multi-layer wafers and method for making same

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