JPS499187A - - Google Patents

Info

Publication number
JPS499187A
JPS499187A JP48034978A JP3497873A JPS499187A JP S499187 A JPS499187 A JP S499187A JP 48034978 A JP48034978 A JP 48034978A JP 3497873 A JP3497873 A JP 3497873A JP S499187 A JPS499187 A JP S499187A
Authority
JP
Japan
Prior art keywords
layer
photoresist
pads
leads
exposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48034978A
Other languages
English (en)
Japanese (ja)
Other versions
JPS52670B2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS499187A publication Critical patent/JPS499187A/ja
Publication of JPS52670B2 publication Critical patent/JPS52670B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10P95/00—
    • H10W72/90—
    • H10W72/01255—
    • H10W72/01951—
    • H10W72/20—
    • H10W72/251—
    • H10W72/5522—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP48034978A 1972-03-27 1973-03-27 Expired JPS52670B2 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00238116A US3821785A (en) 1972-03-27 1972-03-27 Semiconductor structure with bumps

Publications (2)

Publication Number Publication Date
JPS499187A true JPS499187A (enExample) 1974-01-26
JPS52670B2 JPS52670B2 (enExample) 1977-01-10

Family

ID=22896575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48034978A Expired JPS52670B2 (enExample) 1972-03-27 1973-03-27

Country Status (8)

Country Link
US (1) US3821785A (enExample)
JP (1) JPS52670B2 (enExample)
CA (1) CA984060A (enExample)
DE (1) DE2314731C3 (enExample)
FR (1) FR2178007B1 (enExample)
GB (1) GB1377601A (enExample)
IT (1) IT981659B (enExample)
NL (1) NL7304183A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5130673U (enExample) * 1974-08-26 1976-03-05

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3906541A (en) * 1974-03-29 1975-09-16 Gen Electric Field effect transistor devices and methods of making same
US3959522A (en) * 1975-04-30 1976-05-25 Rca Corporation Method for forming an ohmic contact
JPS51147253A (en) * 1975-06-13 1976-12-17 Nec Corp Structure of electrode terminal
US4293637A (en) * 1977-05-31 1981-10-06 Matsushita Electric Industrial Co., Ltd. Method of making metal electrode of semiconductor device
US4438181A (en) 1981-01-13 1984-03-20 Jon M. Schroeder Electronic component bonding tape
DE3135007A1 (de) * 1981-09-04 1983-03-24 Licentia Gmbh Mehrschichtenkontakt fuer eine halbleiteranordnung
JPS59193036A (ja) * 1983-04-16 1984-11-01 Toshiba Corp 半導体装置の製造方法
US5134460A (en) * 1986-08-11 1992-07-28 International Business Machines Corporation Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding
US4742023A (en) * 1986-08-28 1988-05-03 Fujitsu Limited Method for producing a semiconductor device
US4875617A (en) * 1987-01-20 1989-10-24 Citowsky Elya L Gold-tin eutectic lead bonding method and structure
US4937006A (en) * 1988-07-29 1990-06-26 International Business Machines Corporation Method and apparatus for fluxless solder bonding
US5130779A (en) * 1990-06-19 1992-07-14 International Business Machines Corporation Solder mass having conductive encapsulating arrangement
KR960016007B1 (ko) * 1993-02-08 1996-11-25 삼성전자 주식회사 반도체 칩 범프의 제조방법
US6342442B1 (en) * 1998-11-20 2002-01-29 Agere Systems Guardian Corp. Kinetically controlled solder bonding
US6428942B1 (en) * 1999-10-28 2002-08-06 Fujitsu Limited Multilayer circuit structure build up method
US6214646B1 (en) * 2000-02-29 2001-04-10 Lucent Technologies Inc. Soldering optical subassemblies
US6818545B2 (en) 2001-03-05 2004-11-16 Megic Corporation Low fabrication cost, fine pitch and high reliability solder bump
US20040140219A1 (en) * 2003-01-21 2004-07-22 Texas Instruments Incorporated System and method for pulse current plating
DE102004024644A1 (de) * 2004-05-18 2005-12-22 Infineon Technologies Ag Verfahren zum Aufbringen metallischer Strukturen auf Substrate und Halbleiterbauelement
JP4852041B2 (ja) * 2004-08-10 2012-01-11 デイジ プレシジョン インダストリーズ リミテッド 剪断試験装置
DE102005055280B3 (de) * 2005-11-17 2007-04-12 Infineon Technologies Ag Verbindungselement zwischen Halbleiterchip und Schaltungsträger sowie Verfahren zur Herstellung und Verwendung des Verbindungselements
TWI298204B (en) * 2005-11-21 2008-06-21 Advanced Semiconductor Eng Structure of bumps forming on an under metallurgy layer and method for making the same
JP5060494B2 (ja) * 2006-02-17 2012-10-31 デイジ プレシジョン インダストリーズ リミテッド せん断試験装置
DE102008042107A1 (de) * 2008-09-15 2010-03-18 Robert Bosch Gmbh Elektronisches Bauteil sowie Verfahren zu seiner Herstellung
TWM397591U (en) * 2010-04-22 2011-02-01 Mao Bang Electronic Co Ltd Bumping structure
KR102430984B1 (ko) * 2015-09-22 2022-08-09 삼성전자주식회사 반도체 장치 및 이의 제조 방법
US10903151B2 (en) * 2018-05-23 2021-01-26 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1196834A (en) * 1967-03-29 1970-07-01 Hitachi Ltd Improvement of Electrode Structure in a Semiconductor Device.
FR1569479A (enExample) * 1967-07-13 1969-05-30

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5130673U (enExample) * 1974-08-26 1976-03-05

Also Published As

Publication number Publication date
FR2178007B1 (enExample) 1978-08-04
FR2178007A1 (enExample) 1973-11-09
US3821785A (en) 1974-06-28
JPS52670B2 (enExample) 1977-01-10
IT981659B (it) 1974-10-10
CA984060A (en) 1976-02-17
GB1377601A (en) 1974-12-18
DE2314731A1 (de) 1973-10-11
DE2314731C3 (de) 1982-10-14
DE2314731B2 (de) 1980-06-04
NL7304183A (enExample) 1973-10-01

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