JPS56107553A - Semiconductor device and preparation thereof - Google Patents

Semiconductor device and preparation thereof

Info

Publication number
JPS56107553A
JPS56107553A JP906580A JP906580A JPS56107553A JP S56107553 A JPS56107553 A JP S56107553A JP 906580 A JP906580 A JP 906580A JP 906580 A JP906580 A JP 906580A JP S56107553 A JPS56107553 A JP S56107553A
Authority
JP
Japan
Prior art keywords
wiring
electrode
opening
base
attach
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP906580A
Other languages
Japanese (ja)
Other versions
JPS6325716B2 (en
Inventor
Sadaji Tamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP906580A priority Critical patent/JPS56107553A/en
Publication of JPS56107553A publication Critical patent/JPS56107553A/en
Publication of JPS6325716B2 publication Critical patent/JPS6325716B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To obtain miniaturized integrated circuit with minute electrode wiring free from ruggedness by a construction wherein an opening for an electrode and a concave portion for containing wiring are provided on an insulating film of a semiconductor substrate with a semiconductor region, and a metal is allowed to attach to the opening to provide the electrode wiring. CONSTITUTION:In a bipolar transistor, for instance, a thin oxide film 2' is made to attach to the base region on the main surface of a semiconductor substrate having collector, base and emitter regions 1, 3, 4, while a thick oxide film 2 is permitted to adhere to the periphery of the base region. Next, with a photoresist pattern 11 as a mask, an opening 6 for the emitter electrode, an opening 5 for the base electrode and a concave portion 12 in which wiring is provided are made through chemical etching. After depositing wiring metal layers 13, 13', the photoresist pattern 11 together with the metal layer 13' on the pattern are removed. By so doing, spacing between the openings of electrodes can be reduced, while a wiring layer with less ruggedness is produced, so that a compact transistor with a small parasitic capacity is obtainable.
JP906580A 1980-01-29 1980-01-29 Semiconductor device and preparation thereof Granted JPS56107553A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP906580A JPS56107553A (en) 1980-01-29 1980-01-29 Semiconductor device and preparation thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP906580A JPS56107553A (en) 1980-01-29 1980-01-29 Semiconductor device and preparation thereof

Publications (2)

Publication Number Publication Date
JPS56107553A true JPS56107553A (en) 1981-08-26
JPS6325716B2 JPS6325716B2 (en) 1988-05-26

Family

ID=11710203

Family Applications (1)

Application Number Title Priority Date Filing Date
JP906580A Granted JPS56107553A (en) 1980-01-29 1980-01-29 Semiconductor device and preparation thereof

Country Status (1)

Country Link
JP (1) JPS56107553A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007255936A (en) * 2006-03-20 2007-10-04 Horiba Ltd Sample solution dropping/cleaning device and sample solution dropping/cleaning method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5110064A (en) * 1974-07-11 1976-01-27 Takao Nishikawa KOKUMOTSUSENBETSUSOCHI
JPS5267962A (en) * 1975-12-03 1977-06-06 Sanyo Electric Co Ltd Manufacture of semiconductor unit
JPS5578532A (en) * 1978-12-07 1980-06-13 Matsushita Electronics Corp Formation of electrode for semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5110064A (en) * 1974-07-11 1976-01-27 Takao Nishikawa KOKUMOTSUSENBETSUSOCHI
JPS5267962A (en) * 1975-12-03 1977-06-06 Sanyo Electric Co Ltd Manufacture of semiconductor unit
JPS5578532A (en) * 1978-12-07 1980-06-13 Matsushita Electronics Corp Formation of electrode for semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007255936A (en) * 2006-03-20 2007-10-04 Horiba Ltd Sample solution dropping/cleaning device and sample solution dropping/cleaning method

Also Published As

Publication number Publication date
JPS6325716B2 (en) 1988-05-26

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