CA984060A - Semiconductor contact pad structure with bumps - Google Patents

Semiconductor contact pad structure with bumps

Info

Publication number
CA984060A
CA984060A CA165,113A CA165113A CA984060A CA 984060 A CA984060 A CA 984060A CA 165113 A CA165113 A CA 165113A CA 984060 A CA984060 A CA 984060A
Authority
CA
Canada
Prior art keywords
bumps
contact pad
pad structure
semiconductor contact
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA165,113A
Other languages
English (en)
Other versions
CA165113S (en
Inventor
Ralph E. Rose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Signetics Corp
Original Assignee
Signetics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Signetics Corp filed Critical Signetics Corp
Application granted granted Critical
Publication of CA984060A publication Critical patent/CA984060A/en
Expired legal-status Critical Current

Links

Classifications

    • H10P95/00—
    • H10W72/90—
    • H10W72/01255—
    • H10W72/01951—
    • H10W72/20—
    • H10W72/251—
    • H10W72/5522—
CA165,113A 1972-03-27 1973-03-02 Semiconductor contact pad structure with bumps Expired CA984060A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00238116A US3821785A (en) 1972-03-27 1972-03-27 Semiconductor structure with bumps

Publications (1)

Publication Number Publication Date
CA984060A true CA984060A (en) 1976-02-17

Family

ID=22896575

Family Applications (1)

Application Number Title Priority Date Filing Date
CA165,113A Expired CA984060A (en) 1972-03-27 1973-03-02 Semiconductor contact pad structure with bumps

Country Status (8)

Country Link
US (1) US3821785A (enExample)
JP (1) JPS52670B2 (enExample)
CA (1) CA984060A (enExample)
DE (1) DE2314731C3 (enExample)
FR (1) FR2178007B1 (enExample)
GB (1) GB1377601A (enExample)
IT (1) IT981659B (enExample)
NL (1) NL7304183A (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3906541A (en) * 1974-03-29 1975-09-16 Gen Electric Field effect transistor devices and methods of making same
JPS5130673U (enExample) * 1974-08-26 1976-03-05
US3959522A (en) * 1975-04-30 1976-05-25 Rca Corporation Method for forming an ohmic contact
JPS51147253A (en) * 1975-06-13 1976-12-17 Nec Corp Structure of electrode terminal
US4293637A (en) * 1977-05-31 1981-10-06 Matsushita Electric Industrial Co., Ltd. Method of making metal electrode of semiconductor device
US4438181A (en) 1981-01-13 1984-03-20 Jon M. Schroeder Electronic component bonding tape
DE3135007A1 (de) * 1981-09-04 1983-03-24 Licentia Gmbh Mehrschichtenkontakt fuer eine halbleiteranordnung
JPS59193036A (ja) * 1983-04-16 1984-11-01 Toshiba Corp 半導体装置の製造方法
US5134460A (en) * 1986-08-11 1992-07-28 International Business Machines Corporation Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding
US4742023A (en) * 1986-08-28 1988-05-03 Fujitsu Limited Method for producing a semiconductor device
US4875617A (en) * 1987-01-20 1989-10-24 Citowsky Elya L Gold-tin eutectic lead bonding method and structure
US4937006A (en) * 1988-07-29 1990-06-26 International Business Machines Corporation Method and apparatus for fluxless solder bonding
US5130779A (en) * 1990-06-19 1992-07-14 International Business Machines Corporation Solder mass having conductive encapsulating arrangement
KR960016007B1 (ko) * 1993-02-08 1996-11-25 삼성전자 주식회사 반도체 칩 범프의 제조방법
US6342442B1 (en) * 1998-11-20 2002-01-29 Agere Systems Guardian Corp. Kinetically controlled solder bonding
US6428942B1 (en) * 1999-10-28 2002-08-06 Fujitsu Limited Multilayer circuit structure build up method
US6214646B1 (en) * 2000-02-29 2001-04-10 Lucent Technologies Inc. Soldering optical subassemblies
US6818545B2 (en) 2001-03-05 2004-11-16 Megic Corporation Low fabrication cost, fine pitch and high reliability solder bump
US20040140219A1 (en) * 2003-01-21 2004-07-22 Texas Instruments Incorporated System and method for pulse current plating
DE102004024644A1 (de) * 2004-05-18 2005-12-22 Infineon Technologies Ag Verfahren zum Aufbringen metallischer Strukturen auf Substrate und Halbleiterbauelement
JP4852041B2 (ja) * 2004-08-10 2012-01-11 デイジ プレシジョン インダストリーズ リミテッド 剪断試験装置
DE102005055280B3 (de) * 2005-11-17 2007-04-12 Infineon Technologies Ag Verbindungselement zwischen Halbleiterchip und Schaltungsträger sowie Verfahren zur Herstellung und Verwendung des Verbindungselements
TWI298204B (en) * 2005-11-21 2008-06-21 Advanced Semiconductor Eng Structure of bumps forming on an under metallurgy layer and method for making the same
JP5060494B2 (ja) * 2006-02-17 2012-10-31 デイジ プレシジョン インダストリーズ リミテッド せん断試験装置
DE102008042107A1 (de) * 2008-09-15 2010-03-18 Robert Bosch Gmbh Elektronisches Bauteil sowie Verfahren zu seiner Herstellung
TWM397591U (en) * 2010-04-22 2011-02-01 Mao Bang Electronic Co Ltd Bumping structure
KR102430984B1 (ko) * 2015-09-22 2022-08-09 삼성전자주식회사 반도체 장치 및 이의 제조 방법
US10903151B2 (en) * 2018-05-23 2021-01-26 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1196834A (en) * 1967-03-29 1970-07-01 Hitachi Ltd Improvement of Electrode Structure in a Semiconductor Device.
FR1569479A (enExample) * 1967-07-13 1969-05-30

Also Published As

Publication number Publication date
FR2178007B1 (enExample) 1978-08-04
FR2178007A1 (enExample) 1973-11-09
US3821785A (en) 1974-06-28
JPS52670B2 (enExample) 1977-01-10
IT981659B (it) 1974-10-10
JPS499187A (enExample) 1974-01-26
GB1377601A (en) 1974-12-18
DE2314731A1 (de) 1973-10-11
DE2314731C3 (de) 1982-10-14
DE2314731B2 (de) 1980-06-04
NL7304183A (enExample) 1973-10-01

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