JPH11340606A - レジスト層の形成方法及びプリント配線基板の製造方法 - Google Patents

レジスト層の形成方法及びプリント配線基板の製造方法

Info

Publication number
JPH11340606A
JPH11340606A JP10130976A JP13097698A JPH11340606A JP H11340606 A JPH11340606 A JP H11340606A JP 10130976 A JP10130976 A JP 10130976A JP 13097698 A JP13097698 A JP 13097698A JP H11340606 A JPH11340606 A JP H11340606A
Authority
JP
Japan
Prior art keywords
resist
substrate
hole
resist layer
conductive substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10130976A
Other languages
English (en)
Japanese (ja)
Inventor
Ryota Bando
了太 坂東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kansai Paint Co Ltd
Original Assignee
Kansai Paint Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kansai Paint Co Ltd filed Critical Kansai Paint Co Ltd
Priority to JP10130976A priority Critical patent/JPH11340606A/ja
Priority to TW088104821A priority patent/TW411746B/zh
Priority to KR1019990010514A priority patent/KR19990078305A/ko
Publication of JPH11340606A publication Critical patent/JPH11340606A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP10130976A 1998-03-27 1998-04-27 レジスト層の形成方法及びプリント配線基板の製造方法 Pending JPH11340606A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP10130976A JPH11340606A (ja) 1998-03-27 1998-04-27 レジスト層の形成方法及びプリント配線基板の製造方法
TW088104821A TW411746B (en) 1998-03-27 1999-03-26 Resist layer formation method and printed circuit board manufacturing method
KR1019990010514A KR19990078305A (ko) 1998-03-27 1999-03-26 레지스트층의 형성 방법 및 인쇄회로 기판의 제조방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10-98238 1998-03-27
JP9823898 1998-03-27
JP10130976A JPH11340606A (ja) 1998-03-27 1998-04-27 レジスト層の形成方法及びプリント配線基板の製造方法

Publications (1)

Publication Number Publication Date
JPH11340606A true JPH11340606A (ja) 1999-12-10

Family

ID=26439436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10130976A Pending JPH11340606A (ja) 1998-03-27 1998-04-27 レジスト層の形成方法及びプリント配線基板の製造方法

Country Status (3)

Country Link
JP (1) JPH11340606A (ko)
KR (1) KR19990078305A (ko)
TW (1) TW411746B (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101020671B1 (ko) 2008-11-26 2011-03-09 세메스 주식회사 기판 상의 포토레지스트막을 건조하기 위한 장치
KR101021839B1 (ko) * 2008-11-26 2011-03-17 세메스 주식회사 기판 상의 포토레지스트막을 건조하기 위한 장치

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110099513B (zh) * 2011-07-27 2022-02-18 住友重机械工业株式会社 基板制造装置及基板制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2941308B2 (ja) * 1989-07-12 1999-08-25 株式会社日立製作所 検査システムおよび電子デバイスの製造方法
JPH08141488A (ja) * 1994-11-18 1996-06-04 Nikka Kk 塗布装置用洗浄装置
JPH08236415A (ja) * 1995-02-22 1996-09-13 Dainippon Screen Mfg Co Ltd ロールコータ
JPH0917716A (ja) * 1995-06-30 1997-01-17 Casio Comput Co Ltd レジスト塗布装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101020671B1 (ko) 2008-11-26 2011-03-09 세메스 주식회사 기판 상의 포토레지스트막을 건조하기 위한 장치
KR101021839B1 (ko) * 2008-11-26 2011-03-17 세메스 주식회사 기판 상의 포토레지스트막을 건조하기 위한 장치

Also Published As

Publication number Publication date
TW411746B (en) 2000-11-11
KR19990078305A (ko) 1999-10-25

Similar Documents

Publication Publication Date Title
US7572351B2 (en) Process for producing wiring circuit board
EP2643731B1 (en) Photoimaging
US6653055B1 (en) Method for producing etched circuits
JPH11340606A (ja) レジスト層の形成方法及びプリント配線基板の製造方法
JP3920456B2 (ja) 導電性基板上にレジスト層を形成する装置
JP2000156556A (ja) スルーホール部を有する基板へのレジスト層形成方法及びプリント配線基板の製造方法
JP2699920B2 (ja) 多層印刷配線板の製造方法
JP2000332381A (ja) レジスト層の形成方法及びプリント配線基板の製造方法
JPH06177516A (ja) プリント配線板の製造方法
JPS6148831A (ja) 光硬化性構造体
JPH09130016A (ja) 回路形成方法
JP2710512B2 (ja) 印刷配線板の製造方法
JP3071725B2 (ja) 多層プリント配線板の製造方法
JP3153571B2 (ja) プリント配線板の製造方法
JPS60230658A (ja) プリント配線用基板の感光液塗布装置
JPH0997977A (ja) ブラインドスルーホール部を有するプリント基板の製造方法
JP2005085898A (ja) プリント配線基板の製造方法
JP3395223B2 (ja) プリント配線板の製造方法
JPH03123095A (ja) スルーホールめっき両面プリント配線板の導体パターン形成方法
JPH05198924A (ja) パターン形成方法
JPH05243709A (ja) 印刷配線板の製造方法
JPH02109392A (ja) 回路パターンの形成方法
JPH07254550A (ja) アクリル系レジストの形成方法
JPH0645735A (ja) プリント配線板の製造方法とその製造装置
JPH0936519A (ja) プリント配線板の製造方法