JPH11338150A5 - - Google Patents

Info

Publication number
JPH11338150A5
JPH11338150A5 JP1998144437A JP14443798A JPH11338150A5 JP H11338150 A5 JPH11338150 A5 JP H11338150A5 JP 1998144437 A JP1998144437 A JP 1998144437A JP 14443798 A JP14443798 A JP 14443798A JP H11338150 A5 JPH11338150 A5 JP H11338150A5
Authority
JP
Japan
Prior art keywords
acid
resin composition
photosensitive resin
positive photosensitive
action
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998144437A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11338150A (ja
JP3824288B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP14443798A priority Critical patent/JP3824288B2/ja
Priority claimed from JP14443798A external-priority patent/JP3824288B2/ja
Publication of JPH11338150A publication Critical patent/JPH11338150A/ja
Publication of JPH11338150A5 publication Critical patent/JPH11338150A5/ja
Application granted granted Critical
Publication of JP3824288B2 publication Critical patent/JP3824288B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP14443798A 1998-05-26 1998-05-26 ポジ型感光性樹脂組成物 Expired - Lifetime JP3824288B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14443798A JP3824288B2 (ja) 1998-05-26 1998-05-26 ポジ型感光性樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14443798A JP3824288B2 (ja) 1998-05-26 1998-05-26 ポジ型感光性樹脂組成物

Publications (3)

Publication Number Publication Date
JPH11338150A JPH11338150A (ja) 1999-12-10
JPH11338150A5 true JPH11338150A5 (enExample) 2005-02-24
JP3824288B2 JP3824288B2 (ja) 2006-09-20

Family

ID=15362196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14443798A Expired - Lifetime JP3824288B2 (ja) 1998-05-26 1998-05-26 ポジ型感光性樹脂組成物

Country Status (1)

Country Link
JP (1) JP3824288B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3430028B2 (ja) * 1998-09-08 2003-07-28 松下電器産業株式会社 パターン形成方法
JP2002006483A (ja) * 2000-06-20 2002-01-09 Sumitomo Chem Co Ltd フォトレジスト組成物
JP4190167B2 (ja) * 2000-09-26 2008-12-03 富士フイルム株式会社 ポジ型レジスト組成物
JP4199914B2 (ja) * 2000-11-29 2008-12-24 富士フイルム株式会社 ポジ型レジスト組成物
JP3874092B2 (ja) 2001-12-26 2007-01-31 信越化学工業株式会社 高分子化合物、レジスト材料及びパターン形成方法
AU2003230727A1 (en) * 2002-03-22 2003-10-13 Triad Therapeutics, Inc. Common ligand mimics: naphtoates
JP3912516B2 (ja) 2002-08-09 2007-05-09 信越化学工業株式会社 高分子化合物、レジスト材料及びパターン形成方法
JP4511383B2 (ja) * 2005-02-23 2010-07-28 富士フイルム株式会社 ポジ型レジスト組成物及びそれを用いたパターン形成方法
JP2007079552A (ja) * 2005-08-17 2007-03-29 Jsr Corp 感放射線性樹脂組成物
JP4991326B2 (ja) * 2006-01-24 2012-08-01 富士フイルム株式会社 ポジ型感光性組成物及びそれを用いたパターン形成方法
TWI477909B (zh) 2006-01-24 2015-03-21 Fujifilm Corp 正型感光性組成物及使用它之圖案形成方法
EP2447773B1 (en) 2010-11-02 2013-07-10 Fujifilm Corporation Method for producing a pattern, method for producing a MEMS structure, use of a cured film of a photosensitive composition as a sacrificial layer or as a component of a MEMS structure
JP5635449B2 (ja) 2011-03-11 2014-12-03 富士フイルム株式会社 樹脂パターン及びその製造方法、mems構造体の製造方法、半導体素子の製造方法、並びに、メッキパターン製造方法

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