JPH11288975A - ボンディング方法及びボンディング装置 - Google Patents

ボンディング方法及びボンディング装置

Info

Publication number
JPH11288975A
JPH11288975A JP10091311A JP9131198A JPH11288975A JP H11288975 A JPH11288975 A JP H11288975A JP 10091311 A JP10091311 A JP 10091311A JP 9131198 A JP9131198 A JP 9131198A JP H11288975 A JPH11288975 A JP H11288975A
Authority
JP
Japan
Prior art keywords
bonding
substrate
chip
electrode
sealing resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10091311A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11288975A5 (https=
Inventor
Taizo Tomioka
泰造 冨岡
Tomohiro Iguchi
知洋 井口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP10091311A priority Critical patent/JPH11288975A/ja
Publication of JPH11288975A publication Critical patent/JPH11288975A/ja
Publication of JPH11288975A5 publication Critical patent/JPH11288975A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

Landscapes

  • Wire Bonding (AREA)
JP10091311A 1998-04-03 1998-04-03 ボンディング方法及びボンディング装置 Pending JPH11288975A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10091311A JPH11288975A (ja) 1998-04-03 1998-04-03 ボンディング方法及びボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10091311A JPH11288975A (ja) 1998-04-03 1998-04-03 ボンディング方法及びボンディング装置

Publications (2)

Publication Number Publication Date
JPH11288975A true JPH11288975A (ja) 1999-10-19
JPH11288975A5 JPH11288975A5 (https=) 2005-09-15

Family

ID=14022934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10091311A Pending JPH11288975A (ja) 1998-04-03 1998-04-03 ボンディング方法及びボンディング装置

Country Status (1)

Country Link
JP (1) JPH11288975A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6193136B1 (en) * 1998-08-20 2001-02-27 Matsushita Electric Industrial Co., Ltd. Component mounting method and apparatus
JP2001267359A (ja) * 2000-03-14 2001-09-28 Toshiba Corp 半導体装置の製造方法及び半導体装置
JP2005183459A (ja) * 2003-12-16 2005-07-07 Fujitsu Ltd 電子部品のボンディング方法及び装置
JP2007005676A (ja) * 2005-06-27 2007-01-11 Athlete Fa Kk 電子部品の接合装置
US7513032B2 (en) 2004-10-29 2009-04-07 Fujitsu Limited Method of mounting an electronic part to a substrate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6193136B1 (en) * 1998-08-20 2001-02-27 Matsushita Electric Industrial Co., Ltd. Component mounting method and apparatus
US6467670B2 (en) 1998-08-20 2002-10-22 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting component
JP2001267359A (ja) * 2000-03-14 2001-09-28 Toshiba Corp 半導体装置の製造方法及び半導体装置
JP2005183459A (ja) * 2003-12-16 2005-07-07 Fujitsu Ltd 電子部品のボンディング方法及び装置
US7513032B2 (en) 2004-10-29 2009-04-07 Fujitsu Limited Method of mounting an electronic part to a substrate
JP2007005676A (ja) * 2005-06-27 2007-01-11 Athlete Fa Kk 電子部品の接合装置

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