JPH1116868A - 薬液置換装置及び薬液置換方法 - Google Patents

薬液置換装置及び薬液置換方法

Info

Publication number
JPH1116868A
JPH1116868A JP9171699A JP17169997A JPH1116868A JP H1116868 A JPH1116868 A JP H1116868A JP 9171699 A JP9171699 A JP 9171699A JP 17169997 A JP17169997 A JP 17169997A JP H1116868 A JPH1116868 A JP H1116868A
Authority
JP
Japan
Prior art keywords
pure water
chemical
chemical solution
replacement
processing tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9171699A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1116868A5 (enExample
Inventor
Souichi Nadahara
壮一 灘原
Katsuya Okumura
勝弥 奥村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP9171699A priority Critical patent/JPH1116868A/ja
Priority to US09/105,029 priority patent/US6159303A/en
Publication of JPH1116868A publication Critical patent/JPH1116868A/ja
Publication of JPH1116868A5 publication Critical patent/JPH1116868A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/044—Cleaning involving contact with liquid using agitated containers in which the liquid and articles or material are placed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP9171699A 1997-06-27 1997-06-27 薬液置換装置及び薬液置換方法 Pending JPH1116868A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9171699A JPH1116868A (ja) 1997-06-27 1997-06-27 薬液置換装置及び薬液置換方法
US09/105,029 US6159303A (en) 1997-06-27 1998-06-25 Liquid displacement apparatus and liquid displacement method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9171699A JPH1116868A (ja) 1997-06-27 1997-06-27 薬液置換装置及び薬液置換方法

Publications (2)

Publication Number Publication Date
JPH1116868A true JPH1116868A (ja) 1999-01-22
JPH1116868A5 JPH1116868A5 (enExample) 2005-04-28

Family

ID=15928049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9171699A Pending JPH1116868A (ja) 1997-06-27 1997-06-27 薬液置換装置及び薬液置換方法

Country Status (2)

Country Link
US (1) US6159303A (enExample)
JP (1) JPH1116868A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014011463A (ja) * 2012-06-29 2014-01-20 Taiwan Uyemura Co Ltd 微細気泡式処理装置
CN111570380A (zh) * 2020-06-19 2020-08-25 北京北方华创微电子装备有限公司 槽式清洗设备的过泡保护装置及过泡保护方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6360756B1 (en) * 1999-06-03 2002-03-26 Taiwan Semiconductor Manufacturing Company, Ltd Wafer rinse tank for metal etching and method for using
FR2797405B1 (fr) * 1999-08-12 2001-10-26 Coillard Sa Ets Bac de rincage a liquide ultra propre
DE102005015758A1 (de) * 2004-12-08 2006-06-14 Astec Halbleitertechnologie Gmbh Verfahren und Vorrichtung zum Ätzen von in einer Ätzlösung aufgenommenen Substraten

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19517573C2 (de) * 1995-05-12 2000-11-02 Steag Micro Tech Gmbh Verfahren und Vorrichtung zur Naßbehandlung von Substraten in einem Behälter
KR0179784B1 (ko) * 1995-12-19 1999-04-15 문정환 반도체 웨이퍼 세정장치
US5673713A (en) * 1995-12-19 1997-10-07 Lg Semicon Co., Ltd. Apparatus for cleansing semiconductor wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014011463A (ja) * 2012-06-29 2014-01-20 Taiwan Uyemura Co Ltd 微細気泡式処理装置
CN111570380A (zh) * 2020-06-19 2020-08-25 北京北方华创微电子装备有限公司 槽式清洗设备的过泡保护装置及过泡保护方法

Also Published As

Publication number Publication date
US6159303A (en) 2000-12-12

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