JPH1116868A5 - - Google Patents
Info
- Publication number
- JPH1116868A5 JPH1116868A5 JP1997171699A JP17169997A JPH1116868A5 JP H1116868 A5 JPH1116868 A5 JP H1116868A5 JP 1997171699 A JP1997171699 A JP 1997171699A JP 17169997 A JP17169997 A JP 17169997A JP H1116868 A5 JPH1116868 A5 JP H1116868A5
- Authority
- JP
- Japan
- Prior art keywords
- treatment tank
- pure water
- treated
- flow rate
- chemical solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9171699A JPH1116868A (ja) | 1997-06-27 | 1997-06-27 | 薬液置換装置及び薬液置換方法 |
| US09/105,029 US6159303A (en) | 1997-06-27 | 1998-06-25 | Liquid displacement apparatus and liquid displacement method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9171699A JPH1116868A (ja) | 1997-06-27 | 1997-06-27 | 薬液置換装置及び薬液置換方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1116868A JPH1116868A (ja) | 1999-01-22 |
| JPH1116868A5 true JPH1116868A5 (enExample) | 2005-04-28 |
Family
ID=15928049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9171699A Pending JPH1116868A (ja) | 1997-06-27 | 1997-06-27 | 薬液置換装置及び薬液置換方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US6159303A (enExample) |
| JP (1) | JPH1116868A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6360756B1 (en) * | 1999-06-03 | 2002-03-26 | Taiwan Semiconductor Manufacturing Company, Ltd | Wafer rinse tank for metal etching and method for using |
| FR2797405B1 (fr) * | 1999-08-12 | 2001-10-26 | Coillard Sa Ets | Bac de rincage a liquide ultra propre |
| DE102005015758A1 (de) * | 2004-12-08 | 2006-06-14 | Astec Halbleitertechnologie Gmbh | Verfahren und Vorrichtung zum Ätzen von in einer Ätzlösung aufgenommenen Substraten |
| JP6053624B2 (ja) * | 2012-06-29 | 2016-12-27 | 台湾上村股▲分▼有限公司Taiwan Uyemura Co., Ltd. | 微細気泡式処理装置 |
| CN111570380B (zh) * | 2020-06-19 | 2022-07-19 | 北京北方华创微电子装备有限公司 | 槽式清洗设备的过泡保护装置及过泡保护方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19517573C2 (de) * | 1995-05-12 | 2000-11-02 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zur Naßbehandlung von Substraten in einem Behälter |
| US5673713A (en) * | 1995-12-19 | 1997-10-07 | Lg Semicon Co., Ltd. | Apparatus for cleansing semiconductor wafer |
| KR0179784B1 (ko) * | 1995-12-19 | 1999-04-15 | 문정환 | 반도체 웨이퍼 세정장치 |
-
1997
- 1997-06-27 JP JP9171699A patent/JPH1116868A/ja active Pending
-
1998
- 1998-06-25 US US09/105,029 patent/US6159303A/en not_active Expired - Fee Related
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