JPH10242362A - リードフレーム、半導体装置及び半導体装置の製造方法 - Google Patents

リードフレーム、半導体装置及び半導体装置の製造方法

Info

Publication number
JPH10242362A
JPH10242362A JP9040402A JP4040297A JPH10242362A JP H10242362 A JPH10242362 A JP H10242362A JP 9040402 A JP9040402 A JP 9040402A JP 4040297 A JP4040297 A JP 4040297A JP H10242362 A JPH10242362 A JP H10242362A
Authority
JP
Japan
Prior art keywords
semiconductor chip
lead
semiconductor device
support
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9040402A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10242362A5 (enExample
Inventor
Shigeki Tanaka
茂樹 田中
Atsushi Fujisawa
敦 藤沢
Toshiyuki Shintani
俊幸 新谷
Kenichi Takebe
堅一 建部
Takashi Konno
貴史 今野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
Hitachi Hokkai Semiconductor Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Hokkai Semiconductor Ltd, Hitachi Ltd filed Critical Hitachi Hokkai Semiconductor Ltd
Priority to JP9040402A priority Critical patent/JPH10242362A/ja
Priority to KR1019970013268A priority patent/KR19980069737A/ko
Priority to CN97110843A priority patent/CN1192046A/zh
Publication of JPH10242362A publication Critical patent/JPH10242362A/ja
Publication of JPH10242362A5 publication Critical patent/JPH10242362A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061—Disposition
    • H01L2224/0612—Layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP9040402A 1997-02-25 1997-02-25 リードフレーム、半導体装置及び半導体装置の製造方法 Pending JPH10242362A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP9040402A JPH10242362A (ja) 1997-02-25 1997-02-25 リードフレーム、半導体装置及び半導体装置の製造方法
KR1019970013268A KR19980069737A (ko) 1997-02-25 1997-04-10 리이드프레임, 반도체장치 및 그 제조방법
CN97110843A CN1192046A (zh) 1997-02-25 1997-04-30 引线框、半导体器件及该半导体器件的制造工艺

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9040402A JPH10242362A (ja) 1997-02-25 1997-02-25 リードフレーム、半導体装置及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH10242362A true JPH10242362A (ja) 1998-09-11
JPH10242362A5 JPH10242362A5 (enExample) 2004-11-04

Family

ID=12579680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9040402A Pending JPH10242362A (ja) 1997-02-25 1997-02-25 リードフレーム、半導体装置及び半導体装置の製造方法

Country Status (3)

Country Link
JP (1) JPH10242362A (enExample)
KR (1) KR19980069737A (enExample)
CN (1) CN1192046A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006073670A (ja) * 2004-08-31 2006-03-16 Denso Corp 集積回路装置
WO2011148540A1 (ja) * 2010-05-28 2011-12-01 株式会社アドバンテスト プローブ構造体、プローブ装置、プローブ構造体の製造方法、および試験装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100377346C (zh) * 2004-12-23 2008-03-26 旺宏电子股份有限公司 封装件
CN118471938B (zh) * 2024-06-26 2025-02-11 池州昀钐半导体材料有限公司 一种导线框架和封装组件

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006073670A (ja) * 2004-08-31 2006-03-16 Denso Corp 集積回路装置
WO2011148540A1 (ja) * 2010-05-28 2011-12-01 株式会社アドバンテスト プローブ構造体、プローブ装置、プローブ構造体の製造方法、および試験装置
JP2011247792A (ja) * 2010-05-28 2011-12-08 Advantest Corp プローブ構造体、プローブ装置、プローブ構造体の製造方法、および試験装置

Also Published As

Publication number Publication date
CN1192046A (zh) 1998-09-02
KR19980069737A (ko) 1998-10-26

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