JPH10150159A - メモリ容量を増大する方法および装置 - Google Patents

メモリ容量を増大する方法および装置

Info

Publication number
JPH10150159A
JPH10150159A JP9298140A JP29814097A JPH10150159A JP H10150159 A JPH10150159 A JP H10150159A JP 9298140 A JP9298140 A JP 9298140A JP 29814097 A JP29814097 A JP 29814097A JP H10150159 A JPH10150159 A JP H10150159A
Authority
JP
Japan
Prior art keywords
memory
module
memory module
present
base portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9298140A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10150159A5 (enExample
Inventor
Robert W Noonan
ロバート・ダブリュー・ヌーナン
Jeffery L Hooten
ジェフリー・エル・フーテン
Christian H Post
クリスチャン・エイチ・ポスト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compaq Computer Corp
Original Assignee
Compaq Computer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compaq Computer Corp filed Critical Compaq Computer Corp
Publication of JPH10150159A publication Critical patent/JPH10150159A/ja
Publication of JPH10150159A5 publication Critical patent/JPH10150159A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185—Mounting of expansion boards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/184—Mounting of motherboards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09027—Non-rectangular flat PCB, e.g. circular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Memories (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Executing Machine-Instructions (AREA)
JP9298140A 1996-10-31 1997-10-30 メモリ容量を増大する方法および装置 Pending JPH10150159A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US741699 1985-06-06
US08/741,699 US6310782B1 (en) 1996-10-31 1996-10-31 Apparatus for maximizing memory density within existing computer system form factors

Publications (2)

Publication Number Publication Date
JPH10150159A true JPH10150159A (ja) 1998-06-02
JPH10150159A5 JPH10150159A5 (enExample) 2005-04-07

Family

ID=24981807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9298140A Pending JPH10150159A (ja) 1996-10-31 1997-10-30 メモリ容量を増大する方法および装置

Country Status (3)

Country Link
US (2) US6310782B1 (enExample)
EP (1) EP0840198A3 (enExample)
JP (1) JPH10150159A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006024031A2 (en) 2004-08-23 2006-03-02 Hewlett-Packard Development Company, L.P. Method and apparatus for redirection of video data
US7519110B2 (en) * 2005-01-18 2009-04-14 At&T Intellectual Property I, L.P. System and method for improving DSL performance
CN102548351A (zh) * 2010-12-31 2012-07-04 鸿富锦精密工业（深圳）有限公司 散热装置

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3676746A (en) * 1970-12-23 1972-07-11 Honeywell Inf Systems Compatible modular circuit board connector
US3993935A (en) * 1974-12-16 1976-11-23 Xerox Corporation Printed circuit board connection
US4109298A (en) * 1976-07-26 1978-08-22 Texas Instruments Incorporated Connector with printed wiring board structure
US4727410A (en) * 1983-11-23 1988-02-23 Cabot Technical Ceramics, Inc. High density integrated circuit package
US4685031A (en) * 1986-02-24 1987-08-04 Texas Instruments Incorporated Edgeboard connector
JPS63211692A (ja) * 1987-02-27 1988-09-02 株式会社日立製作所 両面配線基板
US5191224A (en) 1987-04-22 1993-03-02 Hitachi, Ltd. Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein
US4858072A (en) * 1987-11-06 1989-08-15 Ford Aerospace & Communications Corporation Interconnection system for integrated circuit chips
JPH01175180A (ja) * 1987-12-28 1989-07-11 Yamaichi Electric Mfg Co Ltd 配線基板用コネクタ
JP2509969B2 (ja) * 1988-02-26 1996-06-26 株式会社日立製作所 電子装置
US4882700A (en) 1988-06-08 1989-11-21 Micron Technology, Inc. Switched memory module
US5138434A (en) 1991-01-22 1992-08-11 Micron Technology, Inc. Packaging for semiconductor logic devices
US5036481A (en) 1989-04-18 1991-07-30 Dell Usa Corporation Personal computer system with dual purpose expansion slot
DE9017041U1 (de) * 1990-12-18 1991-03-07 Akyürek, Altan, Dipl.-Ing., 8560 Lauf Halbleitermodul
JPH05727A (ja) * 1991-01-22 1993-01-08 Toshiba Eng & Constr Co Ltd 多段ラツクを有するパイプ搬送装置
US5202754A (en) 1991-09-13 1993-04-13 International Business Machines Corporation Three-dimensional multichip packages and methods of fabrication
JPH05102334A (ja) 1991-10-08 1993-04-23 Mitsubishi Electric Corp 半導体装置および半導体装置ユニツト
US5200917A (en) * 1991-11-27 1993-04-06 Micron Technology, Inc. Stacked printed circuit board device
US5224023A (en) 1992-02-10 1993-06-29 Smith Gary W Foldable electronic assembly module
JP3035403B2 (ja) 1992-03-09 2000-04-24 富士通株式会社 半導体装置
JPH05343579A (ja) * 1992-06-05 1993-12-24 Toshiba Corp 半導体実装基板
KR950014123B1 (ko) 1992-09-08 1995-11-21 삼성전자주식회사 반도체 패키지
US5272664A (en) 1993-04-21 1993-12-21 Silicon Graphics, Inc. High memory capacity DRAM SIMM
JP3362316B2 (ja) * 1993-05-27 2003-01-07 光洋電子工業株式会社 制御用電子機器
JPH0789282A (ja) 1993-06-30 1995-04-04 Mitsubishi Electric Corp Ｉｃメモリカード、ホスト装置側コネクタ及びそれらを用いた接続システム
US5567653A (en) 1994-09-14 1996-10-22 International Business Machines Corporation Process for aligning etch masks on an integrated circuit surface using electromagnetic energy
JPH08139232A (ja) 1994-11-04 1996-05-31 Hitachi Ltd 混成集積回路装置およびそのソケット並びに混成集積回路装置とソケットの接続構造体
US5568356A (en) * 1995-04-18 1996-10-22 Hughes Aircraft Company Stacked module assembly including electrically interconnected switching module and plural electronic modules
IN188196B (enExample) * 1995-05-15 2002-08-31 Silicon Graphics Inc
US5661677A (en) * 1996-05-15 1997-08-26 Micron Electronics, Inc. Circuit and method for on-board programming of PRD Serial EEPROMS
US6008538A (en) * 1996-10-08 1999-12-28 Micron Technology, Inc. Method and apparatus providing redundancy for fabricating highly reliable memory modules

Also Published As

Publication number Publication date
EP0840198A3 (en) 1999-04-21
US20010010625A1 (en) 2001-08-02
EP0840198A2 (en) 1998-05-06
US6310782B1 (en) 2001-10-30
US6549420B2 (en) 2003-04-15

Similar Documents

Publication Publication Date Title
US5995405A (en) Memory module with flexible serial presence detect configuration
US6765813B2 (en) Integrated systems using vertically-stacked three-dimensional memory cells
US7106609B2 (en) Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems
EP0571092B1 (en) Single in-line memory module
TW459365B (en) Semiconductor device
WO2003009302A1 (en) Semiconductor memory device
JPS6033311B2 (ja) 垂直半導体集積回路チツプ・パツケ−ジ
US20170047310A1 (en) Semiconductor package and method of manufacturing the same
US6907486B1 (en) Disk module of solid state
KR960043145A (ko) 점유면적의 저감된 패드 배치를 가지는 반도체 기억장치 및 그를 위한 패드 배치 방법
US5574682A (en) PC card
KR20000050356A (ko) 멀티 인라인 메모리 모듈 및 그와 결합되는 전자 부품 소켓
JPH10150159A (ja) メモリ容量を増大する方法および装置
JPH1187640A (ja) 半導体装置および電子装置
US20210103791A1 (en) Card type solid state drive
US20040201968A1 (en) Multi-bank memory module
EP1139208A1 (en) Disk module of solid state
CN115274664B (zh) 一种三维存储器、芯片封装结构及电子设备
KR200195300Y1 (ko) 고체상태의 디스크모듈
JPS61120454A (ja) デ−タ記憶用集積回路のパツケ−ジ
US12495497B2 (en) Low power memory module
JP2000091729A (ja) スタックメモリモジュール
JP2001044325A (ja) 半導体装置及び半導体モジュール
JPH10116958A (ja) メモリシステム
JPH11177040A (ja) 半導体装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040427

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040427

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060301

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070612

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20071106