JPH10150159A5 - - Google Patents

Info

Publication number
JPH10150159A5
JPH10150159A5 JP1997298140A JP29814097A JPH10150159A5 JP H10150159 A5 JPH10150159 A5 JP H10150159A5 JP 1997298140 A JP1997298140 A JP 1997298140A JP 29814097 A JP29814097 A JP 29814097A JP H10150159 A5 JPH10150159 A5 JP H10150159A5
Authority
JP
Japan
Prior art keywords
device disposed
memory device
memory
memory module
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997298140A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10150159A (ja
Filing date
Publication date
Priority claimed from US08/741,699 external-priority patent/US6310782B1/en
Application filed filed Critical
Publication of JPH10150159A publication Critical patent/JPH10150159A/ja
Publication of JPH10150159A5 publication Critical patent/JPH10150159A5/ja
Pending legal-status Critical Current

Links

JP9298140A 1996-10-31 1997-10-30 メモリ容量を増大する方法および装置 Pending JPH10150159A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US741699 1996-10-31
US08/741,699 US6310782B1 (en) 1996-10-31 1996-10-31 Apparatus for maximizing memory density within existing computer system form factors

Publications (2)

Publication Number Publication Date
JPH10150159A JPH10150159A (ja) 1998-06-02
JPH10150159A5 true JPH10150159A5 (enExample) 2005-04-07

Family

ID=24981807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9298140A Pending JPH10150159A (ja) 1996-10-31 1997-10-30 メモリ容量を増大する方法および装置

Country Status (3)

Country Link
US (2) US6310782B1 (enExample)
EP (1) EP0840198A3 (enExample)
JP (1) JPH10150159A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006024031A2 (en) 2004-08-23 2006-03-02 Hewlett-Packard Development Company, L.P. Method and apparatus for redirection of video data
US7519110B2 (en) * 2005-01-18 2009-04-14 At&T Intellectual Property I, L.P. System and method for improving DSL performance
CN102548351A (zh) * 2010-12-31 2012-07-04 鸿富锦精密工业（深圳）有限公司 散热装置

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3676746A (en) * 1970-12-23 1972-07-11 Honeywell Inf Systems Compatible modular circuit board connector
US3993935A (en) * 1974-12-16 1976-11-23 Xerox Corporation Printed circuit board connection
US4109298A (en) * 1976-07-26 1978-08-22 Texas Instruments Incorporated Connector with printed wiring board structure
US4727410A (en) * 1983-11-23 1988-02-23 Cabot Technical Ceramics, Inc. High density integrated circuit package
US4685031A (en) * 1986-02-24 1987-08-04 Texas Instruments Incorporated Edgeboard connector
JPS63211692A (ja) * 1987-02-27 1988-09-02 株式会社日立製作所 両面配線基板
US5191224A (en) 1987-04-22 1993-03-02 Hitachi, Ltd. Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein
US4858072A (en) * 1987-11-06 1989-08-15 Ford Aerospace & Communications Corporation Interconnection system for integrated circuit chips
JPH01175180A (ja) * 1987-12-28 1989-07-11 Yamaichi Electric Mfg Co Ltd 配線基板用コネクタ
JP2509969B2 (ja) * 1988-02-26 1996-06-26 株式会社日立製作所 電子装置
US4882700A (en) 1988-06-08 1989-11-21 Micron Technology, Inc. Switched memory module
US5138434A (en) 1991-01-22 1992-08-11 Micron Technology, Inc. Packaging for semiconductor logic devices
US5036481A (en) 1989-04-18 1991-07-30 Dell Usa Corporation Personal computer system with dual purpose expansion slot
DE9017041U1 (de) * 1990-12-18 1991-03-07 Akyürek, Altan, Dipl.-Ing., 8560 Lauf Halbleitermodul
JPH05727A (ja) * 1991-01-22 1993-01-08 Toshiba Eng & Constr Co Ltd 多段ラツクを有するパイプ搬送装置
US5202754A (en) 1991-09-13 1993-04-13 International Business Machines Corporation Three-dimensional multichip packages and methods of fabrication
JPH05102334A (ja) 1991-10-08 1993-04-23 Mitsubishi Electric Corp 半導体装置および半導体装置ユニツト
US5200917A (en) * 1991-11-27 1993-04-06 Micron Technology, Inc. Stacked printed circuit board device
US5224023A (en) 1992-02-10 1993-06-29 Smith Gary W Foldable electronic assembly module
JP3035403B2 (ja) 1992-03-09 2000-04-24 富士通株式会社 半導体装置
JPH05343579A (ja) * 1992-06-05 1993-12-24 Toshiba Corp 半導体実装基板
KR950014123B1 (ko) 1992-09-08 1995-11-21 삼성전자주식회사 반도체 패키지
US5272664A (en) 1993-04-21 1993-12-21 Silicon Graphics, Inc. High memory capacity DRAM SIMM
JP3362316B2 (ja) * 1993-05-27 2003-01-07 光洋電子工業株式会社 制御用電子機器
JPH0789282A (ja) 1993-06-30 1995-04-04 Mitsubishi Electric Corp Ｉｃメモリカード、ホスト装置側コネクタ及びそれらを用いた接続システム
US5567653A (en) 1994-09-14 1996-10-22 International Business Machines Corporation Process for aligning etch masks on an integrated circuit surface using electromagnetic energy
JPH08139232A (ja) 1994-11-04 1996-05-31 Hitachi Ltd 混成集積回路装置およびそのソケット並びに混成集積回路装置とソケットの接続構造体
US5568356A (en) * 1995-04-18 1996-10-22 Hughes Aircraft Company Stacked module assembly including electrically interconnected switching module and plural electronic modules
IN188196B (enExample) * 1995-05-15 2002-08-31 Silicon Graphics Inc
US5661677A (en) * 1996-05-15 1997-08-26 Micron Electronics, Inc. Circuit and method for on-board programming of PRD Serial EEPROMS
US6008538A (en) * 1996-10-08 1999-12-28 Micron Technology, Inc. Method and apparatus providing redundancy for fabricating highly reliable memory modules

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