CN102548351A - 散热装置 - Google Patents

散热装置 Download PDF

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Publication number
CN102548351A
CN102548351A CN2010106169316A CN201010616931A CN102548351A CN 102548351 A CN102548351 A CN 102548351A CN 2010106169316 A CN2010106169316 A CN 2010106169316A CN 201010616931 A CN201010616931 A CN 201010616931A CN 102548351 A CN102548351 A CN 102548351A
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circuit board
support ring
heat abstractor
double
screw bolt
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刘涛
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN2010106169316A priority Critical patent/CN102548351A/zh
Priority to US13/071,477 priority patent/US8432698B2/en
Publication of CN102548351A publication Critical patent/CN102548351A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热装置，用于对装设于电路板上的电子元件进行散热，所述电路板通过安装件固定至板体上，该散热装置包括与电子元件相贴设的散热器、及对应穿过散热器并连接到电路板上的固定件，所述固定件包括穿置于散热器上的螺柱、穿置于电路板上的支撑环及固定设置于板体上的固定柱，所述螺柱穿过支撑环螺合于固定柱内，且固定柱的顶部与支撑环的底部相贴合。所述散热装置中固定件包括穿置于散热器上的螺柱、穿置于电路板上的支撑环及固定设置于板体上的固定柱，所述螺柱穿过支撑环螺合连接于固定柱内，且固定柱的顶部支撑支撑环的底部，当电路板受到冲击而震动时，散热器不会对电路板产生过大冲击。

Description

散热装置
技术领域
本发明涉及一种散热装置，尤其是指一种用于冷却电子元件的的散热装置。
背景技术
随着电子产业的蓬勃迅速发展，电子元件的应用越来越广泛。安装于电路板上的电子元件如中央处理器在运行时会产生大量的热量，热量如不能及时地散发出去，将导致电子元件内部温度越来越高，严重影响电子元件运行的稳定性。因此，通常在电子元件的表面设置有散热装置，以降低电子元件的工作温度。
在安装、运输或者使用过程中，由金属制成的散热装置的重量完全由电路板去承担，当出现震动情况时，电路板容易因为受到散热装置的冲击而产生瞬间形变。通常电路板上的若干锡球处于同一平面上以连接芯片与电路板，当电路板出现变形的时候，形变量大位置上的锡球就容易被开裂或断开，使得电路板损坏甚至无法使用。
发明内容
有鉴于此，有必要提供一种受到震动时对电路板产生冲击较小的散热装置。
一种散热装置，用于对装设于电路板上的电子元件进行散热，所述电路板通过安装件固定至板体上，该散热装置包括与电子元件相贴设的散热器、及对应穿过散热器并连接到电路板上的固定件，所述固定件包括穿置于散热器上的螺柱、穿置于电路板上的支撑环及固定设置于板体上的固定柱，所述螺柱穿过支撑环螺合于固定柱内，且固定柱的顶部与支撑环的底部相贴合。
所述散热装置中所述散热器通过固定件固定于电路板上，其中固定件包括穿置于散热器上的螺柱、穿置于电路板上的支撑环及固定设置于板体上的固定柱，所述螺柱穿过支撑环螺合连接于固定柱内，且固定柱的顶部支撑支撑环的底部，当电路板受到冲击而震动时，散热器因其重量而对电路板产生的应力就会通过螺柱，经过支撑环传递至固定于板体上的固定柱上，最终由板体承担，而不会对电路板产生过大冲击。
下面参照附图，结合具体实施例对本发明作进一步的描述。
附图说明
图1是本发明一实施例的散热装置的剖面示意图。
主要元件符号说明
散热器        10
基板          12
散热鳍片      14
离心风扇      20
固定件        30
螺柱          32
支撑环        34
底座          340
主体部        342
固定柱        36
固定部        360
配合部        362
电路板        100
电子元件      200
螺合件        300
板体          400
具体实施方式
请参阅图1，本发明的散热装置用于对安装于电路板100上的电子元件200进行散热，其包括散热器10、设置于该散热器10上的离心风扇20用以向该散热器10提供强制气流及对应穿过散热器10并连接到电路板100上的固定件30。另外，所述电路板100通过螺合件300固定连接到一板体400上，在使用中，该板体400通常为机箱板。
上述散热器10由导热性能良好的金属如铜、铝等一体制成，其底面与电子元件200的顶面相对应贴合。该散热器10包括基板12及形成于基板12上的若干散热鳍片14。这些散热鳍片14相互间隔设置，每相邻二散热鳍片14之间形成一气流通道(未标示)。
上述离心风扇20水平放置于所述散热器10的顶部并与散热器10的散热鳍片14的气流通道相正对，以使该离心风扇20产生的强制气流直接穿过散热鳍片14。
上述固定件30包括穿置于散热器10上的螺柱32、穿置于电路板100上的支撑环34及固定设置于板体400上的固定柱36。所述螺柱32对应穿过散热器10的基板12并向下延伸。所述支撑环34包括圆环状底座340及由该底座340顶面中部向上一体凸伸而出的筒状主体部342。所述底座340贴合于电路板100的底面。所述主体部342卡置于电路板100内，供所述螺柱32的底部对应穿过。在本实施例中，所述螺柱32与该支撑环34的主体部342相螺合。所述支撑环34可通过铆接、焊接、粘接或直接卡制等方式固定于电路板100上。所述固定柱36包括穿置于板体400内的固定部360及由该固定部360顶部向上一体延伸而出的筒状配合部362。所述螺柱32的底端螺合于该固定柱36的配合部362内。所述配合部362的顶面支撑于所述支撑环34的底座340顶面上，这样，当电路板100受到冲击而震动时，散热器10因其重量而对电路板100产生的应力就会通过螺柱32，经过支撑环34传递至固定于板体400上的固定柱36上，最终由板体400承担，而不会对电路板100产生过大冲击。
综上所述，本发明的散热装置中所述散热器10通过固定件30固定于所述电路板100上，其中固定件30包括穿置于散热器10上的螺柱32、穿置于电路板100上的支撑环34及固定设置于板体400上的固定柱36，所述螺柱32穿过支撑环34螺合连接于固定柱36内，且固定柱36的顶部支撑支撑环34的底部，当电路板100受到冲击而震动时，散热器10因其重量而对电路板100产生的应力就会通过螺柱32，经过支撑环34传递至固定于板体400上的固定柱36上，最终由板体400承担，而不会对电路板100产生过大冲击。
应该指出，上述实施方式仅为本发明的较佳实施方式，本领域技术人员还可在本发明精神内做其它变化。这些依据本发明精神所做的变化，都应包含在本发明所要求保护的范围之内。

Claims (10)

1.一种散热装置，用于对装设于电路板上的电子元件进行散热，所述电路板通过安装件固定至板体上，该散热装置包括与电子元件相贴设的散热器、及对应穿过散热器并连接到电路板上的固定件，其特征在于：所述固定件包括穿置于散热器上的螺柱、穿置于电路板上的支撑环及固定设置于板体上的固定柱，所述螺柱穿过支撑环螺合于固定柱内，且固定柱的顶部与支撑环的底部相贴合。
2.如权利要求1所述的散热装置，其特征在于：所述螺柱螺合于所述支撑环内。
3.如权利要求1所述的散热装置，其特征在于：所述支撑环包括底座及由该底座顶面中部凸伸而出的筒状主体部。
4.如权利要求3所述的散热装置，其特征在于：所述底座贴合于电路板的底面，所述主体部卡置于电路板内。
5.如权利要求3所述的散热装置，其特征在于：所述支撑环通过铆接、焊接、粘接或直接卡制的方式固定于电路板上。
6.如权利要求3所述的散热装置，其特征在于：所述固定柱包括穿置于板体内的固定部及由该固定部顶部向上一体延伸而出的筒状配合部。
7.如权利要求6所述的散热装置，其特征在于：所述螺柱螺合于该固定柱的配合部内，该配合部支撑所述支撑环的底座。
8.如权利要求1所述的散热装置，其特征在于：所述散热器包括基板及形成于基板上的若干散热鳍片。
9.如权利要求8所述的散热装置，其特征在于：所述散热鳍片相互间隔设置，每相邻二散热鳍片之间形成一气流通道。
10.如权利要求1所述的散热装置，其特征在于：还包括设置于散热器上的风扇。
CN2010106169316A 2010-12-31 2010-12-31 散热装置 Pending CN102548351A (zh)

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US13/071,477 US8432698B2 (en) 2010-12-31 2011-03-24 Electronic system and heat dissipation device thereof

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Application publication date: 20120704