CN101888743A - 固定装置组合 - Google Patents

固定装置组合 Download PDF

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Publication number
CN101888743A
CN101888743A CN2009103023663A CN200910302366A CN101888743A CN 101888743 A CN101888743 A CN 101888743A CN 2009103023663 A CN2009103023663 A CN 2009103023663A CN 200910302366 A CN200910302366 A CN 200910302366A CN 101888743 A CN101888743 A CN 101888743A
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Prior art keywords
circuit board
fixing device
backboard
device combination
chip carrier
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CN2009103023663A
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武治平
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2009103023663A priority Critical patent/CN101888743A/zh
Priority to US12/508,164 priority patent/US7983047B2/en
Publication of CN101888743A publication Critical patent/CN101888743A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种固定装置组合，包括一电路板、一安装于该电路板上的芯片插座、及一安装于所述芯片插座上方的散热器，所述芯片插座由其连接于所述电路板上的锡球实现与电路板之间的电气连接，所述散热器包括位于其底部的固定脚和装设于相应固定脚内的螺钉，相应螺钉穿过固定脚将所述散热器固定在电路板上，所述电路板组合还包括一安装于所述电路板背面的背板，所述背板抵顶于所述电路板安装所述芯片插座的下方，每一螺钉上于相应固定脚和所述电路板之间设有一弹簧。所述弹簧和背板可减小电路板遭到冲击时的形变量，减小锡球所受的应力，以免破坏锡球。

Description

固定装置组合
技术领域
本发明涉及一种固定装置组合，特别是指一种散热器的固定装置组合。
背景技术
在目前的PCBA(Printed CircUit Board Assembly，印刷电路板装配)过程中，电子元件的引脚先插接于电路板的过孔中且其末端微微凸露于电路板的背面，再在这些引脚凸露的末端上焊锡，使电子元件固定于电路板上且与对应走线保持稳固的电气连接关系，以确保电路的稳定性。又如主板上的CPU(Central Processing Unit，中央处理器)芯片及北桥芯片等是由其焊接于主板上的锡球实现其与主板走线之间的电气连接。但是如果所述主板受到冲击或震动发生形变时，CPU芯片和北桥芯片的锡球受到较大的应力，容易遭到破坏，致使主板的电路连接不完整从而无法正常工作。
发明内容
鉴于以上内容，有必要提供一种在电路板受到冲击或震动时能有效减小锡球所受应力的固定装置组合。
一种固定装置组合，包括一电路板、一安装于该电路板上的芯片插座、及一安装于所述芯片插座上方的散热器，所述芯片插座由其连接于所述电路板上的锡球实现与电路板之间的电气连接，所述散热器包括位于其底部的固定脚和装设于相应固定脚内的螺钉，相应螺钉穿过固定脚将所述散热器固定在电路板上，所述电路板组合还包括一安装于所述电路板背面的背板，所述背板抵顶于所述电路板安装所述芯片插座的下方，每一螺钉上于相应固定脚和所述电路板之间设有一弹簧。
相对于现有技术，所述固定装置组合在电路板所述散热器之间设置了具有缓冲作用的弹簧，同时在电路板的背面装有背板，在电路板遭受冲击时锡球所在的区域受到弹簧和背板的保护作用其形变量能有效减小，从而减小锡球受到的应力，以防锡球遭到过大应力的破坏。
附图说明
图1是本发明固定装置组合较佳实施方式的立体图，所述固定装置组合包括一电路板及一安装于所述电路板上的背板。
图2是图1中背板的另一角度的视图。
具体实施方式
请参阅图1，本发明固定装置组合的较佳实施方式包括一电路板10、一安装于所述电路板10上的CPU插座20、一安装于所述CPU插座20上的CPU芯片30、一安装于所述CPU芯片30上的CPU散热器40，及一安装于所述电路板10背面的背板60。所述CPU芯片30由植于CPU插座20底部的锡球实现与所述电路板10之间的电气连接(图未示)。所述CPU散热器40包括位于其四角上的固定脚41，每一固定脚41上设有相应的固定孔(图未示)。若干螺钉50穿过相应固定脚41上的固定孔将所述CPU散热器40固定于电路板10上，每一螺钉50包括安装于其上位于相应固定脚41和所述电路板10之间的扣环51，每一扣环51和相应固定脚41之间设有一弹簧52。
请同时参阅图2，所述背板60上凸设有一与所述CPU插座20相应的方形凸台611，及四个分别位于该第一方形凸台611四角外侧的圆形凸台613。所述方形凸台611的顶部开设一方形开口612，每一圆形凸台613的顶部开设有一圆形开孔614。所述方形凸台611抵顶于所述电路板10背面相应于安装所述CPU插座20的位置处，以保护CPU插座20下方的锡球。每一螺钉50的末端分别伸入对应圆形凸台613的开孔614内。所述背板60上还开设有多个呈十字形或T字形的卡扣开口62，可与机壳上的卡扣片相互卡扣，从而将所述固定装置组合固定于机壳内。
由于所述CPU芯片30上方的CPU散热器40对所述电路板10的压力较大，电路板10遭到冲击或跌撞时，安装所述CPU芯片30的区域更易发生形变，使所述CPU插座20的锡球受到较大的应力从而遭到破坏。所述弹簧52安装于每一扣环51和相应固定脚41之间，可在发生形变时产生与螺钉紧固力方向相反的弹力，因而可起到缓冲作用，从而减小了锡球受到的应力。同时所述背板60安装于所述CPU插座20的下方，减小了所述电路板10的形变量，可进一步减小锡球受到的应力，使所述固定装置组合的抗震品质得以提高。
通过一业界熟知的冲击仿真分析软件LS-DYNA对所述电路板10受到冲击时所述CPU插座20底部的锡球所受应力的情形进行模拟。模拟条件设定为：所述电路板10跌落或受到撞击时的初速度为3.22m/s，当电路板10受到通常业界认定的非破坏性临界撞击力时，电路板各角点的最大加速度设定为30G。根据上述的模拟条件，应用本固定装置组合后，得出的结果为：所述CPU插座20底部的锡球所受到的最大正向应力值为93.8MPa，而没有应用本固定装置组合时，所述CPU插座20底部的锡球所受到的最大正向应力值为194.3MPa。由此看出，改进后，所述CPU插座20底部的锡球所受到的最大应力减小，所述弹簧52和背板60有效降低了锡球在受到冲击时被破坏的风险。

Claims (8)

1.一种固定装置组合，包括一电路板、一安装于该电路板上的芯片插座、及一安装于所述芯片插座上方的散热器，所述芯片插座由其连接于所述电路板上的锡球实现与电路板之间的电气连接，所述散热器包括位于其底部的固定脚和装设于相应固定脚内的螺钉，相应螺钉穿过固定脚将所述散热器固定在电路板上，其特征在于：所述电路板组合还包括一安装于所述电路板背面的背板，所述背板抵顶于所述电路板安装所述芯片插座的下方，每一螺钉上于相应固定脚和所述电路板之间设有一弹簧。
2.如权利要求1所述的固定装置组合，其特征在于：每一螺钉上于相应固定脚和所述电路板之间设有一扣环，所述弹簧装设于相应固定脚和扣环之间。
3.如权利要求1所述的固定装置组合，其特征在于：所述背板上凸设一方形凸台，所述方形凸台抵顶于所述电路板安装所述芯片插座的下方。
4.如权利要求3所述的固定装置组合，其特征在于：所述方形凸台的顶部开设一方形开口。
5.如权利要求3所述的固定装置组合，其特征在于：所述背板上凸设位于所述方形凸台四角外侧的圆形凸台，每一圆形凸台的顶部开设有一圆形开孔。
6.如权利要求5所述的电路板组合，其特征在于：每一螺钉的末端分别伸入对应圆形凸台的开孔内从而将所述散热器和背板固定在所述电路板上。
7.如权利要求1所述的电路板组合，其特征在于：所述背板上开设有T字形或十字形的卡扣口。
8.如权利要求1所述的电路板组合，其特征在于：所述芯片插座内装设一中央处理器芯片。
CN2009103023663A 2009-05-15 2009-05-15 固定装置组合 Pending CN101888743A (zh)

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CN2009103023663A CN101888743A (zh) 2009-05-15 2009-05-15 固定装置组合
US12/508,164 US7983047B2 (en) 2009-05-15 2009-07-23 Mounting assembly for heat sink

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105991043A (zh) * 2015-03-17 2016-10-05 富士电机株式会社 电力转换装置
CN106455400A (zh) * 2016-09-23 2017-02-22 复旦大学 减震装置及电路板组件
CN112018532A (zh) * 2019-05-30 2020-12-01 富士康(昆山)电脑接插件有限公司 独立压接装置及其组合

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010287796A (ja) * 2009-06-12 2010-12-24 Sony Corp 電子機器
CN102548351A (zh) * 2010-12-31 2012-07-04 鸿富锦精密工业（深圳）有限公司 散热装置
FI20125191L (fi) * 2012-02-20 2013-08-21 Tellabs Oy Kunnonvalvonnalla varustettu kokoonpano ja menetelmä kunnon valvomiseksi
CN104238631A (zh) * 2013-06-11 2014-12-24 鸿富锦精密工业（深圳）有限公司 散热器固定装置
US8995933B2 (en) 2013-06-21 2015-03-31 Motorola Solutions, Inc. Radio frequency transistor and matching circuit grounding and thermal management apparatus
US9560792B2 (en) 2015-01-30 2017-01-31 Netgear, Inc. Apparatus and method for heat sink assembly
US9898058B2 (en) 2016-06-17 2018-02-20 Dell Products, L.P. Method for CPU/heatsink anti-tip and socket damage prevention
US9786572B1 (en) * 2016-09-23 2017-10-10 International Business Machines Corporation Flip chip ball grid array with low impedance and grounded lid
CN107223006B (zh) * 2017-06-28 2018-02-27 日海通信服务有限公司 机柜及其散热器
DE102020120326A1 (de) * 2020-07-31 2022-02-03 Harman Becker Automotive Systems Gmbh Abdeckung zum anpressen einer leiterplatte an einen kühlkörper

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5654876A (en) * 1996-01-05 1997-08-05 International Business Machines Corporation Demountable heat sink
US6331937B1 (en) * 1999-07-28 2001-12-18 Dell Usa, L.P. Apparatus and method for securing a heat sink to an electronic component in a computer system
US6472742B1 (en) * 1999-09-30 2002-10-29 Intel Corporation Thermal gap control
US6501658B2 (en) * 2001-02-16 2002-12-31 Intel Corporation Heatsink mounting with shock absorbers
GB2379266B (en) * 2001-08-29 2005-10-19 Sunonwealth Electr Mach Ind Co Heat dissipating device
US6424527B1 (en) * 2001-09-11 2002-07-23 Dell Products L.P. Computer board support and heat sink retention apparatus
US6549410B1 (en) * 2001-11-20 2003-04-15 Hewlett-Packard Company Heatsink mounting system
TW578981U (en) * 2001-11-30 2004-03-01 Foxconn Prec Components Co Ltd Heat dissipating assembly
US6826054B2 (en) * 2002-09-09 2004-11-30 Hon Hai Precision Ind. Co., Ltd. Heat sink clip assembly
US6885557B2 (en) * 2003-04-24 2005-04-26 Intel Corporaiton Heatsink assembly
TWM246683U (en) * 2003-08-13 2004-10-11 Hon Hai Prec Ind Co Ltd Heat sink assembly
US7019979B2 (en) * 2003-11-21 2006-03-28 Waffer Technology Corp. Heat dissipating device having improved fastening structure
TWM244712U (en) * 2003-12-26 2004-09-21 Hon Hai Prec Ind Co Ltd Heat sink fastener
CN2727956Y (zh) * 2004-07-06 2005-09-21 鸿富锦精密工业（深圳）有限公司 散热器扣合装置
US7142427B2 (en) * 2004-12-30 2006-11-28 Microsoft Corporation Bottom side heat sink attachment for console
US7286371B2 (en) * 2005-03-24 2007-10-23 Intel Corporation Attaching heat sinks to printed circuit boards using preloaded spring assemblies
DE102005033249B3 (de) * 2005-07-15 2006-10-05 Fujitsu Siemens Computers Gmbh Kühlanordnung für ein Computersystem
US7239518B2 (en) * 2005-11-01 2007-07-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Universal locking device for heat sink
US7468889B2 (en) * 2006-05-04 2008-12-23 Adlink Technology Inc. Thermal module fastener for server blade
US7336496B1 (en) * 2006-09-14 2008-02-26 Inventec Corporation Fixing structure for computer mainboard
CN201025525Y (zh) * 2007-03-06 2008-02-20 鸿富锦精密工业（深圳）有限公司 电脑系统
US7495922B2 (en) * 2007-03-29 2009-02-24 Intel Corporation Spring loaded heat sink retention mechanism
US7576989B2 (en) * 2007-12-27 2009-08-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly having supporting clip
US7667970B2 (en) * 2007-12-27 2010-02-23 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly for multiple electronic components
CN101588697B (zh) * 2008-05-23 2012-05-23 富准精密工业(深圳)有限公司 固定装置组合

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105991043A (zh) * 2015-03-17 2016-10-05 富士电机株式会社 电力转换装置
CN105991043B (zh) * 2015-03-17 2019-06-07 富士电机株式会社 电力转换装置
CN106455400A (zh) * 2016-09-23 2017-02-22 复旦大学 减震装置及电路板组件
CN112018532A (zh) * 2019-05-30 2020-12-01 富士康(昆山)电脑接插件有限公司 独立压接装置及其组合
US11177191B2 (en) 2019-05-30 2021-11-16 Foxconn (Kunshan) Computer Connector Co., Ltd. Rivet spacer for compromising assembling between two parts secured to each other via screw structure

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Application publication date: 20101117