JP2010205919A - プリント基板ユニット - Google Patents
プリント基板ユニット Download PDFInfo
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- JP2010205919A JP2010205919A JP2009049625A JP2009049625A JP2010205919A JP 2010205919 A JP2010205919 A JP 2010205919A JP 2009049625 A JP2009049625 A JP 2009049625A JP 2009049625 A JP2009049625 A JP 2009049625A JP 2010205919 A JP2010205919 A JP 2010205919A
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- wiring board
- printed wiring
- back surface
- circuit board
- printed circuit
- Prior art date
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- 230000003014 reinforcing effect Effects 0.000 claims description 31
- 125000006850 spacer group Chemical group 0.000 claims description 16
- 238000005452 bending Methods 0.000 claims description 2
- 230000035939 shock Effects 0.000 abstract 3
- 239000000758 substrate Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】プリント基板ユニット13によれば、電子部品パッケージ15はプリント配線板14および放熱板16aの間に挟み込まれる。放熱板16aはボルト17でプリント配線板14に固定される。ボルト17の先端はプリント配線板14の裏側でスタッド18に結合される。スタッド18およびプリント配線板14の裏面の間には緩衝板22が挟み込まれる。緩衝板22は所定の接触面積でプリント配線板14の裏面に接触する。例えばプリント基板ユニット13の運搬時にプリント配線板14に外力が作用すると、プリント配線板14では応力が生成される。プリント配線板14の裏面にスタッド18が接触する場合に比べて緩衝板22の接触面積は大きく確保される。その結果、プリント配線板14内で応力は十分に分散される。プリント配線板14の破損は阻止される。
【選択図】図3
Description
Claims (7)
- プリント配線板と、
前記プリント配線板の表面に実装される電子部品パッケージと、
前記電子部品パッケージ上に受け止められて、前記電子部品パッケージの輪郭より外側に広がる輪郭を規定する放熱板と、
前記電子部品パッケージの輪郭より外側で前記放熱板および前記プリント配線板を貫通し、前記プリント配線板の裏面から突き出る先端を規定するボルトと、
前記ボルトの頭および前記放熱板の表面の間に挟み込まれて、前記放熱板の表面から前記頭を遠ざける弾性力を発揮する弾性部材と、
前記プリント配線板の裏面に所定の間隔で隔てられる補強板と、
前記補強板の表面から立ち上がり、前記ボルトの先端に結合されるスタッドと、
前記スタッドと前記プリント配線板の裏面との間に挟み込まれて前記プリント配線板の裏面に沿って広がる緩衝板とを備えることを特徴とするプリント基板ユニット。 - 請求項1に記載のプリント基板ユニットにおいて、前記緩衝板は前記補強板に結合されることを特徴とするプリント基板ユニット。
- 請求項1に記載のプリント基板ユニットにおいて、前記緩衝板は折り曲げに基づき前記補強板に一体化されることを特徴とするプリント基板ユニット。
- 請求項1〜3のいずれか1項に記載のプリント基板ユニットを備えることを特徴とする電子機器。
- プリント配線板と、
前記プリント配線板の表面に実装される電子部品パッケージと、
前記電子部品パッケージ上に受け止められて、前記電子部品パッケージの輪郭より外側に広がる輪郭を規定する放熱板と、
前記電子部品パッケージの輪郭より外側で前記放熱板および前記プリント配線板を貫通し、前記プリント配線板の裏面から突き出る先端を規定するボルトと、
前記ボルトの頭および前記放熱板の表面の間に挟み込まれて、前記放熱板の表面から前記頭を遠ざける弾性力を発揮する弾性部材と、
前記プリント配線板の裏面に所定の間隔で隔てられる補強板と、
前記補強板の表面から立ち上がり、前記ボルトの先端に結合されるスタッドと、
前記プリント配線板の裏面および前記補強板の表面の間に挟み込まれて、前記スタッドを受け入れる貫通孔を区画するスペーサとを備えることを特徴とするプリント基板ユニット。 - 請求項5に記載のプリント基板ユニットにおいて、前記補強板の表面から規定される前記スタッドの高さは前記スペーサの厚みより小さいことを特徴とするプリント基板ユニット。
- 請求項5または6に記載のプリント基板ユニットを備えることを特徴とする電子機器。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009049625A JP5163543B2 (ja) | 2009-03-03 | 2009-03-03 | プリント基板ユニット |
US12/706,962 US20100226102A1 (en) | 2009-03-03 | 2010-02-17 | Printed circuit board unit |
US14/081,040 US20140071631A1 (en) | 2009-03-03 | 2013-11-15 | Printed circuit board unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009049625A JP5163543B2 (ja) | 2009-03-03 | 2009-03-03 | プリント基板ユニット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010205919A true JP2010205919A (ja) | 2010-09-16 |
JP5163543B2 JP5163543B2 (ja) | 2013-03-13 |
Family
ID=42678100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009049625A Expired - Fee Related JP5163543B2 (ja) | 2009-03-03 | 2009-03-03 | プリント基板ユニット |
Country Status (2)
Country | Link |
---|---|
US (2) | US20100226102A1 (ja) |
JP (1) | JP5163543B2 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012169586A (ja) * | 2011-01-24 | 2012-09-06 | Fujitsu Ltd | ヒートスプレッダ及びその製造方法、半導体装置、電子装置 |
JP2013080742A (ja) * | 2011-09-30 | 2013-05-02 | Fujitsu Ltd | 半導体パッケージ、配線基板ユニット、及び電子機器 |
WO2014103373A1 (ja) * | 2012-12-26 | 2014-07-03 | 株式会社東芝 | 電子機器 |
US9451720B2 (en) | 2012-12-26 | 2016-09-20 | Kabushiki Kaisha Toshiba | Electronic device |
US11133239B2 (en) | 2017-07-05 | 2021-09-28 | Huawei Technologies Co., Ltd. | Mechanical part for fastening processor, assembly, and computer device |
Families Citing this family (13)
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CN101668406B (zh) * | 2008-09-01 | 2011-11-09 | 鸿富锦精密工业(深圳)有限公司 | 电子装置及其支撑件 |
JP5546889B2 (ja) * | 2010-02-09 | 2014-07-09 | 日本電産エレシス株式会社 | 電子部品ユニット及びその製造方法 |
DE102011088256A1 (de) * | 2011-12-12 | 2013-06-13 | Zf Friedrichshafen Ag | Multilayer-Leiterplatte sowie Anordnung mit einer solchen |
US8867231B2 (en) * | 2012-01-13 | 2014-10-21 | Tyco Electronics Corporation | Electronic module packages and assemblies for electrical systems |
JP5949988B1 (ja) * | 2015-03-20 | 2016-07-13 | 日本電気株式会社 | 電子装置 |
US10128723B2 (en) | 2015-07-07 | 2018-11-13 | Milwaukee Electric Tool Corporation | Printed circuit board spacer |
US10616993B1 (en) * | 2018-01-15 | 2020-04-07 | Arista Networks, Inc. | Heatsink backing plate |
JP7115032B2 (ja) * | 2018-05-24 | 2022-08-09 | 富士通株式会社 | 基板 |
US11107962B2 (en) * | 2018-12-18 | 2021-08-31 | Soulnano Limited | UV LED array with power interconnect and heat sink |
US11071195B1 (en) * | 2020-06-05 | 2021-07-20 | Google Llc | Heatsink and stiffener mount with integrated alignment |
US11758690B2 (en) * | 2021-06-18 | 2023-09-12 | Nanning Fulian Fugui Precision Industrial Co., Ltd. | Heat-dissipation device allowing easy detachment from heat-generating component |
US11991864B2 (en) | 2022-03-16 | 2024-05-21 | Google Llc | Load vectoring heat sink |
CN114980487B (zh) * | 2022-05-27 | 2024-02-09 | 深圳市鸿富诚新材料股份有限公司 | 一种芯片封装结构及封装方法 |
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JPH11163232A (ja) * | 1997-11-28 | 1999-06-18 | Nec Kofu Ltd | 電子部品の放熱装置 |
JP2002164680A (ja) * | 2000-11-24 | 2002-06-07 | Matsushita Electric Ind Co Ltd | 部品取付ねじ及びそれを用いた部品取付装置 |
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JP2012169586A (ja) * | 2011-01-24 | 2012-09-06 | Fujitsu Ltd | ヒートスプレッダ及びその製造方法、半導体装置、電子装置 |
JP2013080742A (ja) * | 2011-09-30 | 2013-05-02 | Fujitsu Ltd | 半導体パッケージ、配線基板ユニット、及び電子機器 |
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JP2014127579A (ja) * | 2012-12-26 | 2014-07-07 | Toshiba Corp | 電子機器 |
US9451720B2 (en) | 2012-12-26 | 2016-09-20 | Kabushiki Kaisha Toshiba | Electronic device |
US11133239B2 (en) | 2017-07-05 | 2021-09-28 | Huawei Technologies Co., Ltd. | Mechanical part for fastening processor, assembly, and computer device |
Also Published As
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US20100226102A1 (en) | 2010-09-09 |
JP5163543B2 (ja) | 2013-03-13 |
US20140071631A1 (en) | 2014-03-13 |
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