|
US5846332A
(en)
*
|
1996-07-12 |
1998-12-08 |
Applied Materials, Inc. |
Thermally floating pedestal collar in a chemical vapor deposition chamber
|
|
US6055927A
(en)
*
|
1997-01-14 |
2000-05-02 |
Applied Komatsu Technology, Inc. |
Apparatus and method for white powder reduction in silicon nitride deposition using remote plasma source cleaning technology
|
|
US6527865B1
(en)
|
1997-09-11 |
2003-03-04 |
Applied Materials, Inc. |
Temperature controlled gas feedthrough
|
|
US6258170B1
(en)
|
1997-09-11 |
2001-07-10 |
Applied Materials, Inc. |
Vaporization and deposition apparatus
|
|
US6106625A
(en)
*
|
1997-12-02 |
2000-08-22 |
Applied Materials, Inc. |
Reactor useful for chemical vapor deposition of titanium nitride
|
|
US6079356A
(en)
*
|
1997-12-02 |
2000-06-27 |
Applied Materials, Inc. |
Reactor optimized for chemical vapor deposition of titanium
|
|
US6050216A
(en)
*
|
1998-08-21 |
2000-04-18 |
M.E.C. Technology, Inc. |
Showerhead electrode for plasma processing
|
|
US6170429B1
(en)
*
|
1998-09-30 |
2001-01-09 |
Lam Research Corporation |
Chamber liner for semiconductor process chambers
|
|
KR20010062209A
(ko)
*
|
1999-12-10 |
2001-07-07 |
히가시 데쓰로 |
고내식성 막이 내부에 형성된 챔버를 구비하는 처리 장치
|
|
US6477980B1
(en)
|
2000-01-20 |
2002-11-12 |
Applied Materials, Inc. |
Flexibly suspended gas distribution manifold for plasma chamber
|
|
US6772827B2
(en)
|
2000-01-20 |
2004-08-10 |
Applied Materials, Inc. |
Suspended gas distribution manifold for plasma chamber
|
|
US6237528B1
(en)
|
2000-01-24 |
2001-05-29 |
M.E.C. Technology, Inc. |
Showerhead electrode assembly for plasma processing
|
|
US6170432B1
(en)
|
2000-01-24 |
2001-01-09 |
M.E.C. Technology, Inc. |
Showerhead electrode assembly for plasma processing
|
|
US6786935B1
(en)
*
|
2000-03-10 |
2004-09-07 |
Applied Materials, Inc. |
Vacuum processing system for producing components
|
|
US6451390B1
(en)
*
|
2000-04-06 |
2002-09-17 |
Applied Materials, Inc. |
Deposition of TEOS oxide using pulsed RF plasma
|
|
TWI297510B
(enExample)
*
|
2000-09-08 |
2008-06-01 |
Tokyo Electron Ltd |
|
|
US6669783B2
(en)
*
|
2001-06-28 |
2003-12-30 |
Lam Research Corporation |
High temperature electrostatic chuck
|
|
US6936906B2
(en)
|
2001-09-26 |
2005-08-30 |
Applied Materials, Inc. |
Integration of barrier layer and seed layer
|
|
US6916398B2
(en)
|
2001-10-26 |
2005-07-12 |
Applied Materials, Inc. |
Gas delivery apparatus and method for atomic layer deposition
|
|
JP4121269B2
(ja)
*
|
2001-11-27 |
2008-07-23 |
日本エー・エス・エム株式会社 |
セルフクリーニングを実行するプラズマcvd装置及び方法
|
|
US6827815B2
(en)
*
|
2002-01-15 |
2004-12-07 |
Applied Materials, Inc. |
Showerhead assembly for a processing chamber
|
|
KR20030066118A
(ko)
*
|
2002-02-04 |
2003-08-09 |
주성엔지니어링(주) |
열팽창에 의한 변형을 최소화할 수 있는 샤워헤드형가스공급장치
|
|
US6972267B2
(en)
*
|
2002-03-04 |
2005-12-06 |
Applied Materials, Inc. |
Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor
|
|
US6902629B2
(en)
*
|
2002-04-12 |
2005-06-07 |
Applied Materials, Inc. |
Method for cleaning a process chamber
|
|
US7186385B2
(en)
*
|
2002-07-17 |
2007-03-06 |
Applied Materials, Inc. |
Apparatus for providing gas to a processing chamber
|
|
WO2004015165A1
(en)
*
|
2002-08-08 |
2004-02-19 |
Trikon Technologies Limited |
Improvements to showerheads
|
|
US20040052969A1
(en)
*
|
2002-09-16 |
2004-03-18 |
Applied Materials, Inc. |
Methods for operating a chemical vapor deposition chamber using a heated gas distribution plate
|
|
US6946033B2
(en)
*
|
2002-09-16 |
2005-09-20 |
Applied Materials Inc. |
Heated gas distribution plate for a processing chamber
|
|
US7204912B2
(en)
*
|
2002-09-30 |
2007-04-17 |
Tokyo Electron Limited |
Method and apparatus for an improved bellows shield in a plasma processing system
|
|
US7137353B2
(en)
*
|
2002-09-30 |
2006-11-21 |
Tokyo Electron Limited |
Method and apparatus for an improved deposition shield in a plasma processing system
|
|
US7166166B2
(en)
*
|
2002-09-30 |
2007-01-23 |
Tokyo Electron Limited |
Method and apparatus for an improved baffle plate in a plasma processing system
|
|
US7147749B2
(en)
*
|
2002-09-30 |
2006-12-12 |
Tokyo Electron Limited |
Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
|
|
US6798519B2
(en)
*
|
2002-09-30 |
2004-09-28 |
Tokyo Electron Limited |
Method and apparatus for an improved optical window deposition shield in a plasma processing system
|
|
US6837966B2
(en)
*
|
2002-09-30 |
2005-01-04 |
Tokyo Electron Limeted |
Method and apparatus for an improved baffle plate in a plasma processing system
|
|
US7166200B2
(en)
*
|
2002-09-30 |
2007-01-23 |
Tokyo Electron Limited |
Method and apparatus for an improved upper electrode plate in a plasma processing system
|
|
EP1420080A3
(en)
*
|
2002-11-14 |
2005-11-09 |
Applied Materials, Inc. |
Apparatus and method for hybrid chemical deposition processes
|
|
KR100772740B1
(ko)
|
2002-11-28 |
2007-11-01 |
동경 엘렉트론 주식회사 |
플라즈마 처리 용기 내부재
|
|
US7270713B2
(en)
*
|
2003-01-07 |
2007-09-18 |
Applied Materials, Inc. |
Tunable gas distribution plate assembly
|
|
US20060254512A1
(en)
*
|
2003-02-28 |
2006-11-16 |
Tokyo Electron Limited |
Apparatus for attachment of semiconductor hardware
|
|
CN100495413C
(zh)
*
|
2003-03-31 |
2009-06-03 |
东京毅力科创株式会社 |
用于邻接在处理元件上的相邻覆层的方法
|
|
US6942753B2
(en)
*
|
2003-04-16 |
2005-09-13 |
Applied Materials, Inc. |
Gas distribution plate assembly for large area plasma enhanced chemical vapor deposition
|
|
KR100965758B1
(ko)
*
|
2003-05-22 |
2010-06-24 |
주성엔지니어링(주) |
액정표시장치용 플라즈마 강화 화학기상증착 장치의샤워헤드 어셈블리
|
|
CN101068950A
(zh)
*
|
2003-05-30 |
2007-11-07 |
阿维扎技术公司 |
气体分配系统
|
|
US7048432B2
(en)
*
|
2003-06-19 |
2006-05-23 |
Halliburton Energy Services, Inc. |
Method and apparatus for hydrating a gel for use in a subterranean formation
|
|
US7645341B2
(en)
*
|
2003-12-23 |
2010-01-12 |
Lam Research Corporation |
Showerhead electrode assembly for plasma processing apparatuses
|
|
JP4698251B2
(ja)
*
|
2004-02-24 |
2011-06-08 |
アプライド マテリアルズ インコーポレイテッド |
可動又は柔軟なシャワーヘッド取り付け
|
|
US8083853B2
(en)
*
|
2004-05-12 |
2011-12-27 |
Applied Materials, Inc. |
Plasma uniformity control by gas diffuser hole design
|
|
US7712434B2
(en)
*
|
2004-04-30 |
2010-05-11 |
Lam Research Corporation |
Apparatus including showerhead electrode and heater for plasma processing
|
|
US8317968B2
(en)
|
2004-04-30 |
2012-11-27 |
Lam Research Corporation |
Apparatus including gas distribution member supplying process gas and radio frequency (RF) power for plasma processing
|
|
US7112541B2
(en)
*
|
2004-05-06 |
2006-09-26 |
Applied Materials, Inc. |
In-situ oxide capping after CVD low k deposition
|
|
US20050252449A1
(en)
|
2004-05-12 |
2005-11-17 |
Nguyen Son T |
Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system
|
|
US8328939B2
(en)
*
|
2004-05-12 |
2012-12-11 |
Applied Materials, Inc. |
Diffuser plate with slit valve compensation
|
|
US8074599B2
(en)
*
|
2004-05-12 |
2011-12-13 |
Applied Materials, Inc. |
Plasma uniformity control by gas diffuser curvature
|
|
KR101063737B1
(ko)
*
|
2004-07-09 |
2011-09-08 |
주성엔지니어링(주) |
기판 제조장비의 샤워헤드
|
|
US20060021703A1
(en)
*
|
2004-07-29 |
2006-02-02 |
Applied Materials, Inc. |
Dual gas faceplate for a showerhead in a semiconductor wafer processing system
|
|
US7429410B2
(en)
*
|
2004-09-20 |
2008-09-30 |
Applied Materials, Inc. |
Diffuser gravity support
|
|
US7552521B2
(en)
*
|
2004-12-08 |
2009-06-30 |
Tokyo Electron Limited |
Method and apparatus for improved baffle plate
|
|
US7601242B2
(en)
*
|
2005-01-11 |
2009-10-13 |
Tokyo Electron Limited |
Plasma processing system and baffle assembly for use in plasma processing system
|
|
US7430986B2
(en)
*
|
2005-03-18 |
2008-10-07 |
Lam Research Corporation |
Plasma confinement ring assemblies having reduced polymer deposition characteristics
|
|
US20060225654A1
(en)
*
|
2005-03-29 |
2006-10-12 |
Fink Steven T |
Disposable plasma reactor materials and methods
|
|
WO2006107113A1
(en)
*
|
2005-04-05 |
2006-10-12 |
Matsushita Electric Industrial Co., Ltd. |
Strain relief cutouts in shower plate made from porous ceramic
|
|
US20060266288A1
(en)
*
|
2005-05-27 |
2006-11-30 |
Applied Materials, Inc. |
High plasma utilization for remote plasma clean
|
|
US7273823B2
(en)
*
|
2005-06-03 |
2007-09-25 |
Applied Materials, Inc. |
Situ oxide cap layer development
|
|
KR100689847B1
(ko)
|
2005-07-15 |
2007-03-08 |
삼성전자주식회사 |
화학기상증착장치
|
|
US20070044714A1
(en)
*
|
2005-08-31 |
2007-03-01 |
Applied Materials, Inc. |
Method and apparatus for maintaining a cross sectional shape of a diffuser during processing
|
|
US7641762B2
(en)
*
|
2005-09-02 |
2010-01-05 |
Applied Materials, Inc. |
Gas sealing skirt for suspended showerhead in process chamber
|
|
TWI329135B
(en)
*
|
2005-11-04 |
2010-08-21 |
Applied Materials Inc |
Apparatus and process for plasma-enhanced atomic layer deposition
|
|
KR100711184B1
(ko)
*
|
2006-03-27 |
2007-04-24 |
주식회사 마이크로텍 |
샤워헤드 브래킷
|
|
US7798096B2
(en)
|
2006-05-05 |
2010-09-21 |
Applied Materials, Inc. |
Plasma, UV and ion/neutral assisted ALD or CVD in a batch tool
|
|
US7776178B2
(en)
*
|
2006-10-25 |
2010-08-17 |
Applied Materials, Inc. |
Suspension for showerhead in process chamber
|
|
US7775508B2
(en)
*
|
2006-10-31 |
2010-08-17 |
Applied Materials, Inc. |
Ampoule for liquid draw and vapor draw with a continuous level sensor
|
|
US20080206987A1
(en)
*
|
2007-01-29 |
2008-08-28 |
Gelatos Avgerinos V |
Process for tungsten nitride deposition by a temperature controlled lid assembly
|
|
EP1970468B1
(de)
*
|
2007-03-05 |
2009-07-15 |
Applied Materials, Inc. |
Beschichtungsanlage und Gasleitungssystem
|
|
US8069817B2
(en)
|
2007-03-30 |
2011-12-06 |
Lam Research Corporation |
Showerhead electrodes and showerhead electrode assemblies having low-particle performance for semiconductor material processing apparatuses
|
|
US20080317973A1
(en)
*
|
2007-06-22 |
2008-12-25 |
White John M |
Diffuser support
|
|
US8313610B2
(en)
|
2007-09-25 |
2012-11-20 |
Lam Research Corporation |
Temperature control modules for showerhead electrode assemblies for plasma processing apparatuses
|
|
US8673080B2
(en)
|
2007-10-16 |
2014-03-18 |
Novellus Systems, Inc. |
Temperature controlled showerhead
|
|
KR101166988B1
(ko)
*
|
2007-12-25 |
2012-07-24 |
어플라이드 머티어리얼스, 인코포레이티드 |
플라즈마 챔버의 전극에 대한 비대칭 rf 구동
|
|
JP5039576B2
(ja)
*
|
2008-01-11 |
2012-10-03 |
シャープ株式会社 |
プラズマ処理装置
|
|
WO2010044895A2
(en)
*
|
2008-01-31 |
2010-04-22 |
Applied Materials, Inc |
Multiple phase rf power for electrode of plasma chamber
|
|
KR100970201B1
(ko)
|
2008-03-17 |
2010-07-14 |
주식회사 아이피에스 |
진공처리장치
|
|
US8146896B2
(en)
*
|
2008-10-31 |
2012-04-03 |
Applied Materials, Inc. |
Chemical precursor ampoule for vapor deposition processes
|
|
WO2010094002A2
(en)
*
|
2009-02-13 |
2010-08-19 |
Applied Materials, Inc. |
Rf bus and rf return bus for plasma chamber electrode
|
|
DE212010000009U1
(de)
*
|
2009-09-10 |
2011-05-26 |
LAM RESEARCH CORPORATION (Delaware Corporation), California |
Auswechselbare obere Kammerteile einer Plasmaverarbeitungsvorrichtung
|
|
KR200476124Y1
(ko)
*
|
2009-09-29 |
2015-01-30 |
어플라이드 머티어리얼스, 인코포레이티드 |
Rf전력공급 샤워헤드를 위한 편심 접지 복귀
|
|
KR101249999B1
(ko)
*
|
2010-08-12 |
2013-04-03 |
주식회사 디엠에스 |
화학기상증착 장치
|
|
US8573152B2
(en)
*
|
2010-09-03 |
2013-11-05 |
Lam Research Corporation |
Showerhead electrode
|
|
KR20120072563A
(ko)
*
|
2010-12-24 |
2012-07-04 |
주식회사 원익아이피에스 |
진공처리장치
|
|
SG192967A1
(en)
|
2011-03-04 |
2013-09-30 |
Novellus Systems Inc |
Hybrid ceramic showerhead
|
|
US20120231181A1
(en)
*
|
2011-03-09 |
2012-09-13 |
Applied Materials, Inc. |
Insulation coverage of cvd electrode
|
|
TWI480417B
(zh)
|
2012-11-02 |
2015-04-11 |
Ind Tech Res Inst |
具氣幕之氣體噴灑裝置及其薄膜沉積裝置
|
|
CN103305907A
(zh)
*
|
2013-06-14 |
2013-09-18 |
光垒光电科技(上海)有限公司 |
用于外延沉积的反应腔
|
|
TW201518538A
(zh)
*
|
2013-11-11 |
2015-05-16 |
Applied Materials Inc |
像素化冷卻溫度控制的基板支撐組件
|
|
US10741365B2
(en)
|
2014-05-05 |
2020-08-11 |
Lam Research Corporation |
Low volume showerhead with porous baffle
|
|
US10378107B2
(en)
|
2015-05-22 |
2019-08-13 |
Lam Research Corporation |
Low volume showerhead with faceplate holes for improved flow uniformity
|
|
US10023959B2
(en)
|
2015-05-26 |
2018-07-17 |
Lam Research Corporation |
Anti-transient showerhead
|
|
US11004661B2
(en)
*
|
2015-09-04 |
2021-05-11 |
Applied Materials, Inc. |
Process chamber for cyclic and selective material removal and etching
|
|
JP6285411B2
(ja)
*
|
2015-12-25 |
2018-02-28 |
株式会社日立国際電気 |
基板処理装置、半導体装置の製造方法及びプログラム
|
|
DE202017105481U1
(de)
*
|
2017-09-11 |
2018-12-12 |
Aixtron Se |
Gaseinlassorgan für einen CVD- oder PVD-Reaktor
|
|
US10907252B2
(en)
*
|
2017-10-23 |
2021-02-02 |
Applied Materials, Inc. |
Horizontal heat choke faceplate design
|
|
US10889894B2
(en)
*
|
2018-08-06 |
2021-01-12 |
Applied Materials, Inc. |
Faceplate with embedded heater
|
|
US12486574B2
(en)
|
2019-08-23 |
2025-12-02 |
Lam Research Corporation |
Thermally controlled chandelier showerhead
|
|
CN119980191A
(zh)
|
2019-08-28 |
2025-05-13 |
朗姆研究公司 |
金属沉积
|
|
KR20210105139A
(ko)
|
2020-02-18 |
2021-08-26 |
(주)포인트엔지니어링 |
가스 공급장치 및 이를 구비한 증착장치
|
|
US11810764B2
(en)
*
|
2020-04-23 |
2023-11-07 |
Applied Materials, Inc. |
Faceplate with edge flow control
|
|
US11242600B2
(en)
|
2020-06-17 |
2022-02-08 |
Applied Materials, Inc. |
High temperature face plate for deposition application
|
|
KR20220067696A
(ko)
|
2020-11-18 |
2022-05-25 |
(주)포인트엔지니어링 |
가스 공급부재 및 이를 구비한 기판처리장치
|