JP2002118098A5 - - Google Patents

Download PDF

Info

Publication number
JP2002118098A5
JP2002118098A5 JP2000308749A JP2000308749A JP2002118098A5 JP 2002118098 A5 JP2002118098 A5 JP 2002118098A5 JP 2000308749 A JP2000308749 A JP 2000308749A JP 2000308749 A JP2000308749 A JP 2000308749A JP 2002118098 A5 JP2002118098 A5 JP 2002118098A5
Authority
JP
Japan
Prior art keywords
reaction chamber
plasma generation
recess
processing apparatus
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000308749A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002118098A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000308749A priority Critical patent/JP2002118098A/ja
Priority claimed from JP2000308749A external-priority patent/JP2002118098A/ja
Publication of JP2002118098A publication Critical patent/JP2002118098A/ja
Publication of JP2002118098A5 publication Critical patent/JP2002118098A5/ja
Pending legal-status Critical Current

Links

JP2000308749A 2000-10-10 2000-10-10 プラズマ処理装置 Pending JP2002118098A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000308749A JP2002118098A (ja) 2000-10-10 2000-10-10 プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000308749A JP2002118098A (ja) 2000-10-10 2000-10-10 プラズマ処理装置

Publications (2)

Publication Number Publication Date
JP2002118098A JP2002118098A (ja) 2002-04-19
JP2002118098A5 true JP2002118098A5 (enExample) 2005-04-14

Family

ID=18789007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000308749A Pending JP2002118098A (ja) 2000-10-10 2000-10-10 プラズマ処理装置

Country Status (1)

Country Link
JP (1) JP2002118098A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4060684B2 (ja) 2002-10-29 2008-03-12 日本発条株式会社 ステージ
JP2006194303A (ja) * 2005-01-12 2006-07-27 Nok Corp 耐プラズマ用シール
JP5233082B2 (ja) * 2006-05-17 2013-07-10 東洋製罐グループホールディングス株式会社 プラズマ処理装置
JPWO2008156031A1 (ja) * 2007-06-19 2010-08-26 東京エレクトロン株式会社 真空処理装置
JP5661622B2 (ja) * 2008-07-07 2015-01-28 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ プラズマ処理チャンバで用いるための真空ギャップを備えたプラズマ対向プローブ装置
JP5534154B2 (ja) * 2008-12-03 2014-06-25 Ｎｏｋ株式会社 配水管継手の密封構造
CN103874316B (zh) * 2014-03-24 2016-05-11 青岛科技大学 一种实验室用感应等离子处理设备的设计
TWM503056U (zh) * 2014-07-24 2015-06-11 Wen-Hsin Chiang 用於電漿反應裝置之襯套單元
JP6812237B2 (ja) * 2016-03-29 2021-01-13 Ｓｐｐテクノロジーズ株式会社 プラズマ処理装置
CN121890301A (zh) * 2023-10-05 2026-04-17 株式会社国际电气 基板处理装置、基板处理方法、半导体装置的制造方法以及程序

Similar Documents

Publication Publication Date Title
WO2004010473A3 (en) Bubbler for substrate processing
SG125152A1 (en) Substrate holding apparatus and substrate polishing apparatus
GB2419896A (en) Chemical vapor deposition reactor
TW200607883A (en) Susceptor for vapor deposition apparatus
AU2003299098A1 (en) Deep draw packing method and film with small shrinkability for deep draw packing
TW200711029A (en) Substrate processing apparatus and substrate stage used therein
TW200512793A (en) Substrate heating apparatus and multi-chamber substrate processing system
TW200802585A (en) Substrate processing apparatus, substrate processing method, and storage medium
JP2002187060A5 (enExample)
WO2003015133A3 (en) Showerhead electrode design for semiconductor processing reactor
WO2004062448A3 (en) Sanitizing toothbrush holder
TW200510565A (en) Thin film deposition apparatus and thin film deposition method
TW368699B (en) Manufacturing method for semiconductor device and manufacturing device for semiconductor
PL1845290T3 (pl) Uszczelnienie w urządzeniach wysokociśnieniowych
TW200503145A (en) Wafer pedestal cover
ATE454601T1 (de) Umfangsdichtung zur rückseitenkühlung von substraten
ATE402877T1 (de) Intelligenter deckel
AU2001292642A1 (en) Temporary protective covers
EP1508630A4 (en) APPARATUS FOR MANUFACTURING A PLASTIC CONTAINER COATED WITH A CDA (DIAMOND-LIKE CARBON) FILM
TW455662B (en) Valve seal
PL1894847T3 (pl) Pojemnik opakowaniowy z tworzywa sztucznego
JP2004099924A (ja) 真空処理装置
JPH1140654A5 (enExample)
USD556157S1 (en) Load-lock chamber
JP2003068713A (ja) プラズマ処理装置