JPH0775775B2 - 噴流半田装置の波形面管理装置及びこれを用いた半田付け装置 - Google Patents

噴流半田装置の波形面管理装置及びこれを用いた半田付け装置

Info

Publication number
JPH0775775B2
JPH0775775B2 JP3212014A JP21201491A JPH0775775B2 JP H0775775 B2 JPH0775775 B2 JP H0775775B2 JP 3212014 A JP3212014 A JP 3212014A JP 21201491 A JP21201491 A JP 21201491A JP H0775775 B2 JPH0775775 B2 JP H0775775B2
Authority
JP
Japan
Prior art keywords
jet
solder
soldering
soldering device
corrugated surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP3212014A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0569121A (ja
Inventor
恭弘 森田
和行 木山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP3212014A priority Critical patent/JPH0775775B2/ja
Priority to MYPI92001492A priority patent/MY109790A/en
Priority to CN92110001A priority patent/CN1043002C/zh
Priority to KR1019920015107A priority patent/KR960013706B1/ko
Priority to TW081108024A priority patent/TW221974B/zh
Publication of JPH0569121A publication Critical patent/JPH0569121A/ja
Publication of JPH0775775B2 publication Critical patent/JPH0775775B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
JP3212014A 1991-08-23 1991-08-23 噴流半田装置の波形面管理装置及びこれを用いた半田付け装置 Expired - Fee Related JPH0775775B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP3212014A JPH0775775B2 (ja) 1991-08-23 1991-08-23 噴流半田装置の波形面管理装置及びこれを用いた半田付け装置
MYPI92001492A MY109790A (en) 1991-08-23 1992-08-19 Apparatus for detecting a solder wave surface.
CN92110001A CN1043002C (zh) 1991-08-23 1992-08-21 波峰焊装置中用的焊料波形面检测装置
KR1019920015107A KR960013706B1 (ko) 1991-08-23 1992-08-22 납땜장치
TW081108024A TW221974B (ko) 1991-08-23 1992-10-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3212014A JPH0775775B2 (ja) 1991-08-23 1991-08-23 噴流半田装置の波形面管理装置及びこれを用いた半田付け装置

Publications (2)

Publication Number Publication Date
JPH0569121A JPH0569121A (ja) 1993-03-23
JPH0775775B2 true JPH0775775B2 (ja) 1995-08-16

Family

ID=16615456

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3212014A Expired - Fee Related JPH0775775B2 (ja) 1991-08-23 1991-08-23 噴流半田装置の波形面管理装置及びこれを用いた半田付け装置

Country Status (5)

Country Link
JP (1) JPH0775775B2 (ko)
KR (1) KR960013706B1 (ko)
CN (1) CN1043002C (ko)
MY (1) MY109790A (ko)
TW (1) TW221974B (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4554748B2 (ja) * 1999-12-07 2010-09-29 株式会社タムラ製作所 ろう付け方法およびその装置
JP2003025063A (ja) * 2001-07-09 2003-01-28 Nihon Dennetsu Keiki Co Ltd 半田付け方法及び半田付け装置
CN102421560B (zh) * 2009-05-14 2015-04-22 千住金属工业株式会社 喷流焊料槽及锡焊装置
CN101628353B (zh) * 2009-08-07 2011-09-07 台达电子（东莞）有限公司 锡炉参数检测方法
CN102744485A (zh) * 2012-07-23 2012-10-24 宝电电子(张家港)有限公司 变压器的焊锡装置
CH706925A1 (de) * 2012-09-10 2014-03-14 Kirsten Soldering Ag Lötanlage mit einer Lotpumpe.
CN104148770B (zh) * 2014-09-02 2017-01-18 安徽省和翰光电科技有限公司 一种用于自动浸锡机的装夹装置
CN104296791B (zh) * 2014-10-08 2017-01-18 深圳市双赢伟业科技股份有限公司 印刷电路板测试探头夹持装置
CN104613844B (zh) * 2015-02-05 2019-03-12 合肥鑫晟光电科技有限公司 靶材厚度测量装置
WO2018131419A1 (ja) * 2017-01-12 2018-07-19 三菱電機株式会社 はんだ噴流検査装置及びはんだ噴流検査方法
CN107335888B (zh) * 2017-05-19 2020-08-28 深圳市阿拉玎光电自动化有限公司 波峰焊波峰高度校正装置及校正方法
JP6844021B2 (ja) * 2017-10-18 2021-03-17 三菱電機株式会社 はんだ付け装置、はんだ付け方法及び部品付き配線基板の製造方法
CN108465901B (zh) * 2018-05-19 2024-03-12 东莞市合易自动化科技有限公司 一种检测锡波形态的装置和检测方法
CN112272595B (zh) * 2018-07-31 2022-03-04 欧姆龙株式会社 信息处理装置及其控制方法、管理系统、以及记录介质
CN113091683A (zh) * 2019-12-23 2021-07-09 昆山华复精密金属有限公司 一种产品表面弧度的检测装置
CN111473726B (zh) * 2020-05-11 2021-11-16 绍兴上虞通风机有限公司 一种利用标准风叶检测风机风叶的检测装置及其检测方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6051939B2 (ja) * 1981-06-02 1985-11-16 権士 近藤 噴流式はんだ槽
JPH01104446A (ja) * 1987-10-14 1989-04-21 Ishikawajima Harima Heavy Ind Co Ltd 双ロール式連鋳機の始動方法
JPH026163U (ko) * 1988-06-24 1990-01-16
JPH0276663U (ko) * 1988-11-25 1990-06-12
JP3070853U (ja) * 2000-02-08 2000-08-15 株式会社渡辺製作所 Ｉｓｄｎ回線用接続装置

Also Published As

Publication number Publication date
CN1070306A (zh) 1993-03-24
JPH0569121A (ja) 1993-03-23
MY109790A (en) 1997-06-30
KR930004013A (ko) 1993-03-22
TW221974B (ko) 1994-04-01
CN1043002C (zh) 1999-04-14
KR960013706B1 (ko) 1996-10-10

Similar Documents

Publication Publication Date Title
JPH0775775B2 (ja) 噴流半田装置の波形面管理装置及びこれを用いた半田付け装置
US5560534A (en) Soldering apparatus
JPS6412119B2 (ko)
US5493969A (en) Screen printing apparatus and screen printing method
US5782400A (en) Substrate carrier for a soldering machine
JPH0645753A (ja) 部品実装システムとプリント配線基板と電子機器
US4616775A (en) Translatable soldering machine
US5637149A (en) Apparatus for application to a circuit board
JPH05185209A (ja) 半田波形面の高さ検出治具と制御方法と半田付け装置と反り検出治具とプリント配線基板とその製造方法と電子機器
CN111760706A (zh) 一种电路板快速喷涂装置
JP2515843B2 (ja) 基板スル−ホ−ルのはんだ除去装置
JPH05185210A (ja) 半田付け方法と半田付け装置とプリント配線基板と電子機器
JP2000200966A (ja) 局所フロ―はんだ付装置
JP3240853B2 (ja) クリーム半田の塗布装置および塗布方法
JP3417509B2 (ja) 電子部品の半田付け方法及び半田噴流装置
US3082520A (en) Automatic soldering machine and method
JPS625818Y2 (ko)
CN219960967U (zh) 一种自动贴片机
KR100314178B1 (ko) 플럭스 분출장치
JP2797484B2 (ja) 電子部品実装装置
JP2722514B2 (ja) 噴流式自動半田付装置
KR200145203Y1 (ko) 본드공급용 노즐장치
JPH0346995B2 (ko)
KR200145549Y1 (ko) 납땜장치
JP3198699B2 (ja) クリーム半田のスクリーン印刷方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees