JPH077292A - 部品供給装置 - Google Patents

部品供給装置

Info

Publication number
JPH077292A
JPH077292A JP5147205A JP14720593A JPH077292A JP H077292 A JPH077292 A JP H077292A JP 5147205 A JP5147205 A JP 5147205A JP 14720593 A JP14720593 A JP 14720593A JP H077292 A JPH077292 A JP H077292A
Authority
JP
Japan
Prior art keywords
tape
component
adhesive tape
peeling
lever
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5147205A
Other languages
English (en)
Japanese (ja)
Inventor
Naoji Ariga
直次 有賀
Yukio Suzuki
幸夫 鈴木
Saburo Ogawa
三良 小川
Etsurou Minamihama
悦郎 南浜
Takayuki Akatsuka
剛之 赤塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pentax Corp
Toshiba Corp
Asahi Koki Co Ltd
Japan Tobacco Inc
Toshiba FA Systems Engineering Corp
Original Assignee
Toshiba Corp
Asahi Koki Co Ltd
Japan Tobacco Inc
Asahi Kogaku Kogyo Co Ltd
Toshiba FA Systems Engineering Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Asahi Koki Co Ltd, Japan Tobacco Inc, Asahi Kogaku Kogyo Co Ltd, Toshiba FA Systems Engineering Corp filed Critical Toshiba Corp
Priority to JP5147205A priority Critical patent/JPH077292A/ja
Priority to EP94109300A priority patent/EP0630177A1/en
Priority to US08/259,978 priority patent/US5492593A/en
Priority to KR1019940013825A priority patent/KR950002554A/ko
Priority to TW083105919A priority patent/TW241239B/zh
Publication of JPH077292A publication Critical patent/JPH077292A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
JP5147205A 1993-06-18 1993-06-18 部品供給装置 Pending JPH077292A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP5147205A JPH077292A (ja) 1993-06-18 1993-06-18 部品供給装置
EP94109300A EP0630177A1 (en) 1993-06-18 1994-06-16 Parts feeder
US08/259,978 US5492593A (en) 1993-06-18 1994-06-17 Parts feeder
KR1019940013825A KR950002554A (ko) 1993-06-18 1994-06-18 부품공급장치
TW083105919A TW241239B (enExample) 1993-06-18 1994-06-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5147205A JPH077292A (ja) 1993-06-18 1993-06-18 部品供給装置

Publications (1)

Publication Number Publication Date
JPH077292A true JPH077292A (ja) 1995-01-10

Family

ID=15424945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5147205A Pending JPH077292A (ja) 1993-06-18 1993-06-18 部品供給装置

Country Status (5)

Country Link
US (1) US5492593A (enExample)
EP (1) EP0630177A1 (enExample)
JP (1) JPH077292A (enExample)
KR (1) KR950002554A (enExample)
TW (1) TW241239B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3404431B2 (ja) * 1994-07-04 2003-05-06 富士機械製造株式会社 電子部品供給カートリッジおよび電子部品供給取出装置
JP3397900B2 (ja) * 1994-08-12 2003-04-21 富士機械製造株式会社 電子部品供給装置
KR100484028B1 (ko) * 1996-05-13 2005-06-16 마쯔시다덴기산교 가부시키가이샤 전자부품의공급장치
JP4014296B2 (ja) * 1998-06-24 2007-11-28 富士機械製造株式会社 テーピング電気部品送り装置および電気部品供給方法
SE517579C2 (sv) * 1999-03-10 2002-06-25 Foerpackningsinnovation Norden Matarenhet för frammatning av ett förpackningsmedium
JP5408146B2 (ja) * 2011-01-25 2014-02-05 パナソニック株式会社 テープフィーダおよびテープフィーダにおけるテープ装着方法
EP3229575B1 (en) * 2014-12-03 2019-11-06 FUJI Corporation Tape feeder
TWI567011B (zh) * 2016-06-15 2017-01-21 萬潤科技股份有限公司 Method and device for conveying the components of the bonding process
CN116902285B (zh) * 2023-09-12 2023-12-26 山西星心半导体科技有限公司 一种led灯珠生产用编带机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8103573A (nl) * 1981-07-29 1983-02-16 Philips Nv Inrichting voor het tegelijkertijd toevoeren van meerdere in banden verpakte electrische en/of electronische onderdelen aan een bepaalde positie.
US4586670A (en) * 1984-12-17 1986-05-06 Usm Corporation Tape stripper for electrical component tape feeder
JPS62111825A (ja) * 1985-11-06 1987-05-22 Fuji Kikai Seizo Kk キヤリヤテ−プから電子部品を取り出す方法
US4735341A (en) * 1986-05-12 1988-04-05 Universal Instruments Corporation Feeder for electrical component supply tapes
JPS63277166A (ja) * 1987-05-09 1988-11-15 Hitachi Ltd チツプ電子部品供給装置
JP2740348B2 (ja) * 1989-10-17 1998-04-15 三洋電機株式会社 テープ送出装置のカバーテープ剥離装置
US5213653A (en) * 1990-09-05 1993-05-25 Yamaha Hatsudoki Kabushiki Kaisha Waste tape disposing means of tape feeder
DE69215778T2 (de) * 1991-07-19 1997-04-10 Matsushita Electric Ind Co Ltd Vorrichtung zum Zuführen elektronischer Bauelemente

Also Published As

Publication number Publication date
US5492593A (en) 1996-02-20
EP0630177A1 (en) 1994-12-21
KR950002554A (ko) 1995-01-04
TW241239B (enExample) 1995-02-21

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