KR950002554A - 부품공급장치 - Google Patents

부품공급장치 Download PDF

Info

Publication number
KR950002554A
KR950002554A KR1019940013825A KR19940013825A KR950002554A KR 950002554 A KR950002554 A KR 950002554A KR 1019940013825 A KR1019940013825 A KR 1019940013825A KR 19940013825 A KR19940013825 A KR 19940013825A KR 950002554 A KR950002554 A KR 950002554A
Authority
KR
South Korea
Prior art keywords
tape
component
peeling
adhesive tape
conveying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019940013825A
Other languages
English (en)
Korean (ko)
Inventor
나오츠구 아리가
유키오 스즈키
사부로 오가와
에츠오 미나미하마
다카유키 아카츠카
Original Assignee
사토 후미오
가부시키가이샤 도시바
미즈노 시게루
닛폰 다바코 산교 가부시키가이샤
다케야스 하츠이치
아사히 고오키 가부시키가이샤
마츠모토 도오루
아사히 고가쿠 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 사토 후미오, 가부시키가이샤 도시바, 미즈노 시게루, 닛폰 다바코 산교 가부시키가이샤, 다케야스 하츠이치, 아사히 고오키 가부시키가이샤, 마츠모토 도오루, 아사히 고가쿠 고교 가부시키가이샤 filed Critical 사토 후미오
Publication of KR950002554A publication Critical patent/KR950002554A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
KR1019940013825A 1993-06-18 1994-06-18 부품공급장치 Ceased KR950002554A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5147205A JPH077292A (ja) 1993-06-18 1993-06-18 部品供給装置
JP93-147205 1993-06-18

Publications (1)

Publication Number Publication Date
KR950002554A true KR950002554A (ko) 1995-01-04

Family

ID=15424945

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940013825A Ceased KR950002554A (ko) 1993-06-18 1994-06-18 부품공급장치

Country Status (5)

Country Link
US (1) US5492593A (enExample)
EP (1) EP0630177A1 (enExample)
JP (1) JPH077292A (enExample)
KR (1) KR950002554A (enExample)
TW (1) TW241239B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3404431B2 (ja) * 1994-07-04 2003-05-06 富士機械製造株式会社 電子部品供給カートリッジおよび電子部品供給取出装置
JP3397900B2 (ja) * 1994-08-12 2003-04-21 富士機械製造株式会社 電子部品供給装置
DE69737545T2 (de) * 1996-05-13 2007-12-13 Matsushita Electric Industrial Co., Ltd., Kadoma Vorrichtung zum zuführen von elektronischen bauelementen
JP4014296B2 (ja) * 1998-06-24 2007-11-28 富士機械製造株式会社 テーピング電気部品送り装置および電気部品供給方法
SE517579C2 (sv) * 1999-03-10 2002-06-25 Foerpackningsinnovation Norden Matarenhet för frammatning av ett förpackningsmedium
JP5408146B2 (ja) * 2011-01-25 2014-02-05 パナソニック株式会社 テープフィーダおよびテープフィーダにおけるテープ装着方法
WO2016088224A1 (ja) * 2014-12-03 2016-06-09 富士機械製造株式会社 テープフィーダ
TWI567011B (zh) * 2016-06-15 2017-01-21 萬潤科技股份有限公司 Method and device for conveying the components of the bonding process
CN116902285B (zh) * 2023-09-12 2023-12-26 山西星心半导体科技有限公司 一种led灯珠生产用编带机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8103573A (nl) * 1981-07-29 1983-02-16 Philips Nv Inrichting voor het tegelijkertijd toevoeren van meerdere in banden verpakte electrische en/of electronische onderdelen aan een bepaalde positie.
US4586670A (en) * 1984-12-17 1986-05-06 Usm Corporation Tape stripper for electrical component tape feeder
JPS62111825A (ja) * 1985-11-06 1987-05-22 Fuji Kikai Seizo Kk キヤリヤテ−プから電子部品を取り出す方法
US4735341A (en) * 1986-05-12 1988-04-05 Universal Instruments Corporation Feeder for electrical component supply tapes
JPS63277166A (ja) * 1987-05-09 1988-11-15 Hitachi Ltd チツプ電子部品供給装置
JP2740348B2 (ja) * 1989-10-17 1998-04-15 三洋電機株式会社 テープ送出装置のカバーテープ剥離装置
US5213653A (en) * 1990-09-05 1993-05-25 Yamaha Hatsudoki Kabushiki Kaisha Waste tape disposing means of tape feeder
EP0523714B1 (en) * 1991-07-19 1996-12-11 Matsushita Electric Industrial Co., Ltd. Electronic component supplying apparatus

Also Published As

Publication number Publication date
EP0630177A1 (en) 1994-12-21
JPH077292A (ja) 1995-01-10
US5492593A (en) 1996-02-20
TW241239B (enExample) 1995-02-21

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PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

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St.27 status event code: A-3-3-R10-R17-oth-X000

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St.27 status event code: A-1-2-D10-D21-exm-PE0902

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

R18-X000 Changes to party contact information recorded

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