JPH07502376A - 処理システム - Google Patents
処理システムInfo
- Publication number
- JPH07502376A JPH07502376A JP5507566A JP50756693A JPH07502376A JP H07502376 A JPH07502376 A JP H07502376A JP 5507566 A JP5507566 A JP 5507566A JP 50756693 A JP50756693 A JP 50756693A JP H07502376 A JPH07502376 A JP H07502376A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- processing system
- pressure
- jacket
- high pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Polarising Elements (AREA)
- Press Drives And Press Lines (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Pressure Vessels And Lids Thereof (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Electron Beam Exposure (AREA)
- Treatment Of Fiber Materials (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.複数の外被部分(6.7)と、 該外被部分(6.7)を押圧して当接させるための第1手段(12.13)と、 該外被部分(6.7)は該外被部分(6.7)が前記第1手段(12.13)に よって押圧して当接される時にワークピースのための封入空間(16)を形成す るような形状をしており前記ワークピースを高圧力にさらすことによって前記ワ ークピースを処理するために前記内部空間(16)に加圧ガスを供給する第2手 段(18.40)とを有するワークピース用処理システム。 2.複数の前記外被部分(6.7)によって部分的に形成された圧力容器(4. 5.6.7)と、該圧力容器(6.7)の排気を行う手段(3)とを有する請求 項1に記載の処理システム。 3.前記内部空間(16)を加熱する手段(41.42)を有し、それによって 前記ワークピースを加熱する請求項1に記載の処理システム。 4.共通の軸線に沿って反対方向に動くことができる2つの外被部分(6.7) を有する請求項1に記載の処理システム。 5.前記外被部分の各々が前記軸腺に対して傾いたシール面を有し、該シール面 は前記外被部分(6.7)が押圧して当接する時にシール状態で抑圧して当接す る請求項4に記載の処理システム。 6.前記外被部分の1つが、変形して、それによって前記取付け面をシール状態 で押圧して当接させるような形状(31.32.33)になっている請求項5に 記載の処理システム。 7.前記内部空間の高圧力を制御するために、前記内部空間から、弁を付けられ た出口(22)を有する請求項1に記載の処理システム。 8.第1外被部分に前記ワークピースを取付け、前記第1外被部分及び第2外被 部分を押圧して当接させ、該外被部分(6.7)は該外被部分(6.7)が押圧 して当接される時に前記ワークピースのための封入空間(16)を形成するよう な形状をしており、 前記ワークピースを高圧力にさらすことによって前記ワークピースを処理するた めに加圧ガスを前記内部空間(16)に供給するワークピース処理方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9122676.1 | 1991-10-25 | ||
GB919122676A GB9122676D0 (en) | 1991-10-25 | 1991-10-25 | Processing system |
PCT/GB1992/001940 WO1993008591A1 (en) | 1991-10-25 | 1992-10-22 | Processing system |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10277495A Division JPH11246970A (ja) | 1991-10-25 | 1998-09-30 | ワークピース用処理システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07502376A true JPH07502376A (ja) | 1995-03-09 |
JP2879833B2 JP2879833B2 (ja) | 1999-04-05 |
Family
ID=10703527
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5507566A Expired - Lifetime JP2879833B2 (ja) | 1991-10-25 | 1992-10-22 | 処理システム |
JP10277495A Pending JPH11246970A (ja) | 1991-10-25 | 1998-09-30 | ワークピース用処理システム |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10277495A Pending JPH11246970A (ja) | 1991-10-25 | 1998-09-30 | ワークピース用処理システム |
Country Status (8)
Country | Link |
---|---|
US (2) | US5518771A (ja) |
EP (2) | EP0609327B1 (ja) |
JP (2) | JP2879833B2 (ja) |
KR (2) | KR100209182B1 (ja) |
AT (1) | ATE176835T1 (ja) |
DE (1) | DE69228441T2 (ja) |
GB (1) | GB9122676D0 (ja) |
WO (1) | WO1993008591A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6895032B2 (en) | 2002-08-02 | 2005-05-17 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | High-pressure processing apparatus |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9324002D0 (en) * | 1993-11-22 | 1994-01-12 | Electrotech Ltd | Processing system |
KR960026249A (ko) * | 1994-12-12 | 1996-07-22 | 윌리엄 이. 힐러 | 고압, 저온 반도체 갭 충진 프로세스 |
US5857368A (en) * | 1995-10-06 | 1999-01-12 | Applied Materials, Inc. | Apparatus and method for fabricating metal paths in semiconductor substrates through high pressure extrusion |
JP3955340B2 (ja) * | 1996-04-26 | 2007-08-08 | 株式会社神戸製鋼所 | 高温高圧ガス処理装置 |
GB2333136B (en) * | 1996-08-01 | 2001-01-17 | Trikon Equip Ltd | A high pressure seal |
GB9616214D0 (en) * | 1996-08-01 | 1996-09-11 | Electrotech Ltd | A high pressure seal |
JP4246804B2 (ja) * | 1997-03-26 | 2009-04-02 | 株式会社神戸製鋼所 | 加熱・加圧処理装置 |
US6140235A (en) * | 1997-12-05 | 2000-10-31 | Applied Materials, Inc. | High pressure copper fill at low temperature |
TW489827U (en) | 1998-04-09 | 2002-06-01 | Kobe Steel Ltd | Apparatus for high-temperature and high-pressure treatment of semiconductor substrates |
US6642140B1 (en) * | 1998-09-03 | 2003-11-04 | Micron Technology, Inc. | System for filling openings in semiconductor products |
CN1440564A (zh) * | 2000-07-07 | 2003-09-03 | 应用材料有限公司 | 锁料室 |
US20040096300A1 (en) * | 2001-06-30 | 2004-05-20 | Ilya Perlov | Loadlock chamber |
US20030026677A1 (en) * | 2001-08-03 | 2003-02-06 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd) | High-pressure process apparatus |
US20080264443A1 (en) * | 2002-02-05 | 2008-10-30 | Novellus Systems, Inc. | Apparatus and methods for increasing the rate of solute concentration evolution in a supercritical process chamber |
US6848458B1 (en) | 2002-02-05 | 2005-02-01 | Novellus Systems, Inc. | Apparatus and methods for processing semiconductor substrates using supercritical fluids |
US7153388B2 (en) * | 2003-03-31 | 2006-12-26 | Lam Research Corporation | Chamber for high-pressure wafer processing and method for making the same |
DE102004020915B4 (de) * | 2004-04-28 | 2008-12-11 | Centrotherm Photovoltaics Ag | Druckmessvorrichtung für Vakuumanlagen |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3599601A (en) * | 1968-05-28 | 1971-08-17 | Nippon Carbon Co Ltd | Internally heated autoclave for metal impregnation |
SE399527B (sv) * | 1974-05-06 | 1978-02-20 | Arvidsson K E | Metod att temporert eller permanent fylla halrum i ett material, vars skrymdensitet er legre en dess materialdensitet, med ett lettflyktigt kolvete samt ett mindre lettflyktigt kolvete, sasom fotogen eller tjera |
US4534816A (en) * | 1984-06-22 | 1985-08-13 | International Business Machines Corporation | Single wafer plasma etch reactor |
JPH04503734A (ja) * | 1988-12-01 | 1992-07-02 | ボック、エドワード | 脈動、浮遊状態で搬送、処理する改良された装置 |
US5194406A (en) * | 1988-12-01 | 1993-03-16 | Edward Bok | Installation for transport and processing under a pulsating double-floating condition |
NL8900003A (nl) * | 1989-01-02 | 1990-08-01 | Imec Inter Uni Micro Electr | Inrichting en werkwijze voor het behandelen van een of meer plakken materiaal. |
US5182424A (en) * | 1989-10-31 | 1993-01-26 | Vlastimil Frank | Module encapsulation by induction heating |
-
1991
- 1991-10-25 GB GB919122676A patent/GB9122676D0/en active Pending
-
1992
- 1992-10-22 AT AT92922023T patent/ATE176835T1/de not_active IP Right Cessation
- 1992-10-22 WO PCT/GB1992/001940 patent/WO1993008591A1/en active IP Right Grant
- 1992-10-22 DE DE69228441T patent/DE69228441T2/de not_active Expired - Lifetime
- 1992-10-22 JP JP5507566A patent/JP2879833B2/ja not_active Expired - Lifetime
- 1992-10-22 EP EP92922023A patent/EP0609327B1/en not_active Expired - Lifetime
- 1992-10-22 EP EP96116123A patent/EP0764973A3/en not_active Withdrawn
- 1992-10-22 KR KR1019940701364A patent/KR100209182B1/ko not_active IP Right Cessation
-
1995
- 1995-04-20 US US08/426,018 patent/US5518771A/en not_active Expired - Lifetime
-
1996
- 1996-01-25 US US08/591,026 patent/US5575850A/en not_active Expired - Lifetime
-
1998
- 1998-09-30 JP JP10277495A patent/JPH11246970A/ja active Pending
- 1998-12-30 KR KR1019980710832A patent/KR100248460B1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6895032B2 (en) | 2002-08-02 | 2005-05-17 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | High-pressure processing apparatus |
Also Published As
Publication number | Publication date |
---|---|
EP0764973A2 (en) | 1997-03-26 |
EP0609327A1 (en) | 1994-08-10 |
US5575850A (en) | 1996-11-19 |
KR940703075A (ko) | 1994-09-17 |
EP0764973A3 (en) | 1998-05-20 |
US5518771A (en) | 1996-05-21 |
DE69228441D1 (de) | 1999-03-25 |
JPH11246970A (ja) | 1999-09-14 |
WO1993008591A1 (en) | 1993-04-29 |
ATE176835T1 (de) | 1999-03-15 |
KR100248460B1 (en) | 2000-03-15 |
DE69228441T2 (de) | 2000-08-03 |
JP2879833B2 (ja) | 1999-04-05 |
KR100209182B1 (ko) | 1999-07-15 |
GB9122676D0 (en) | 1991-12-11 |
EP0609327B1 (en) | 1999-02-17 |
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