JPH07502376A - processing system - Google Patents

Abstract

In order to subject a workpiece, such as a semiconductor wafer, to elevated pressures the workpiece is enclosed in a void (16) between two enclosure parts (6,7) which have been forced together by upper and lower actuators (12,13). The enclosure parts (6,7) are themselves enclosed in a vacuum chamber (1) evacuatable by a vacuum pumping system. The enclosure parts (6,7) are connected to the vacuum chamber by bellows (4,5). <IMAGE>

Description

[Detailed description of the invention] processing system 〔Technical field〕 The present invention relates to a processing system for processing workpieces. Special and, but not exclusively, processing systems for processing semiconductor workpieces. It is related to.

[Prior art]

In the processing of semiconductor wafers and other similar workpieces, the wafer It is necessary to form a layer that fills the small holes (via holes) in the lower layer above. Reason It should be understood that filling these holes requires high pressure and possibly high temperature. This is accomplished by exposing the wafer to a do.

[Summary of the invention]

In our UK Patent No. 9111440.5 we use high pressure and temperature This method discloses how to fill in the holes. The invention is particularly applicable to the British patent 9111440.5, but other Also applies to configurations.

Therefore, the present invention provides a method for applying high pressure to a workpiece, such as a semiconductor wafer, in a controlled manner. Attempt to provide facilities that are exposed to force.

Generally, the present invention provides that a pair of jacket portions can be pressed together; The facing surfaces form an enclosed space when the two envelope parts are pressed together. It has a shape like that. Then this enclosed space is the workpiece to be processed. to accommodate.

It is therefore usually necessary to provide one or more ducts in at least one of the jacket parts. the duct extends into the plane of the corresponding envelope part forming the wall of the interior space. , supplying pressurized gas to the interior space to increase the pressure. The inner part of that internal space is Because it is exposed to high pressure, the forces holding the jacket parts together are sufficient to resist that pressure. It is necessary to do so.

Preferably, the interior space is such that the two jacket parts are hydraulically, pneumatically or similarly are pressed together so that an internal space is formed at the boundary between the two outer covering parts. do. However, more complex configurations using more envelope parts can also be used. It is possible.

It should be noted that since the casting is processed under high pressure and the powder is It is known to provide a high pressure chamber for sintering. However, below Semiconductor wafers are subjected to high pressure to cause layer deformation to fill holes in the horizontal layer. This has not been proposed before (with the exception of our British patent formula 9111440.5). did not exist.

Suitable heating means are provided in the enclosed space or in order to cause heating of the workpiece. Located adjacent to each other. For example, if processing semiconductor wafers, the temperature should be 400°C or higher. Temperatures on the order of 3000 psi and pressures above 3000 psi have been found to be suitable.

In the processing of semiconductor wafers using the present invention, aluminum and its alloys are , possibly forming one or more layers. In this case, one such layer or multiple The layers are usually formed by sputtering or evaporation. Them If the layer is protected from air, then high pressure is applied to fill the holes. It is most effective to If the layer is exposed to air, it will oxidize the surface of the layer and fill the holes. Slowly penetrates the hole before being swallowed. Therefore, oxidation occurs when high pressure is supplied. Make it difficult for the material to transform into a hole. This is because oxidized surfaces are less ductile. .

Thus, as the duct (or perhaps several ducts) extends into the enclosed space, provided that the duct achieves a suitably low pressure (hereinafter vacuum) within the enclosed space. For this purpose, it is preferably connected or connectable to suitable gas evacuation means.

Alternatively, or additionally, the gas supplied to the enclosed space may be subject to oxidation problems. is an inert gas so that it is avoided.

In forming a layer that deforms to fill a hole, the layer is usually The hole must be completely covered. This is a low pressure or preferably vacuum gas deformation of the overlying layer when the gas is trapped within the (sealed) hole and pressure is applied This is because it becomes relatively easy. Another reason is that the vacuum drops to atmospheric pressure. It offers a lower resistance to pressure than a vacuum, so it is less likely to be formed within a vacuum or enclosed space. This is because a configuration that allows this is preferable.

As mentioned above, means are provided within the enclosure for pressing the envelope parts together. It is important to exert sufficient force to counteract the high pressure applied.

For safety reasons, a valved outlet is provided from the internal space, which valve is connected to the enclosed space. is controlled by the difference between the pressure and the pressure that holds the jacket parts together. example For example, if at least one jacket portion is moved by air pressure, One ring return valve between the enclosed chamber and the enclosed space The pressure in the space is greater than the spring force of the return valve. Ensure that the pressure exerted by the air pressure is not exceeded at the maximum limit. .

The invention relates to features of the method and apparatus of the invention.

In a preferred form of the device according to the invention, two There is an outer covering part. Means are provided for applying a vacuum to the enclosed space.

When the workpiece is transferred to the equipment under vacuum, the two jacket parts of the equipment The pieces are moved together to form a pressure containment vessel around them. This container is The shape is such that a thin flat workpiece is contained in a roughly cylindrical chamber (enclosed space). and the height of the cylinder is significantly smaller than its diameter. Inert gas, standard Typically, argon is pumped to high pressures (typically 200 to 2000 (within the range of crowbars) into the chamber. The high pressure gas presses the envelope parts of the chamber together. used to separate and seal each other.

The chamber contains one or more heating elements and temperature measuring means to control the temperature of the gas surrounding the workpiece. Temperature controlled.

The exact temperature and pressure required will depend on the layer material and will allow the material to be forced into the hole. level required for the material to fill the hole completely and for the time required for the material to fill the hole completely. controlled by.

After sufficient time at high pressure, the gas is released from the pressure chamber and returns to near atmospheric pressure. Ru. It is then evacuated using a vacuum pump and the two envelope parts of the pressure chamber is released and the workpiece is removed. On the other hand, the chamber part is separated by atmospheric pressure and the work area is separated by atmospheric pressure. The piece is removed. The workpiece is ready for removal or further processing. The device is transported by a processing device to which it is attached. where other layers should be placed In filters, vacuum transfer is preferred since it avoids contamination of the layer surface.

The device must be able to contain the forces due to the very high initial pressure generated. stomach. The invention is preferably designed for processing thin flat workpieces, The apparatus preferably ensures that most of the force developed by the initial pressure is normal to the plane of the workpiece. It's meant to be direct.

The volume of the enclosed space of the present invention is preferably large enough to cycle the chamber between vacuum and high pressure. The time taken is minimized to the minimum.

Typical cycle times from vacuum to high pressure and back to vacuum range from a few minutes to a minute. shorter.

Where the workpiece is a semiconductor wafer, particles or other It is important that there are very few contaminants. The device of the invention preferably emits particles. A clean initial surface with minimal motion near or above the raw (5-μm) wafer. should be designed as such. The gas used to pressurize the device is filtered and As many particles as possible are removed. Gas may cause wafer contamination High purity inert gas that does not react with the layers deposited on the wafer It is desirable that

[Brief explanation of the drawing]

Embodiments of the invention will now be described in detail, by way of example, with reference to the accompanying drawings, in which: FIG.

FIG. 1 shows an apparatus for processing workpieces according to a first embodiment of the invention .

FIG. 2 shows details of the device of FIG.

FIG. 3 shows an apparatus for processing workpieces according to a second embodiment of the invention. .

Description of J Example] Referring to Figure 1, a generally annular vacuum chamber 1 is used to vacuum a thin flat workpiece. including a system for transporting through the passage 2 and depositing the layer on the workpiece The device is attached to a device (not shown) that includes means for. vacuum pump system 3 (shown schematically) is attached to the vacuum chamber l. The vacuum chamber l is a pressure volume surrounding each of the lower jacket part 6 and the lower jacket part 7 forming the container, and F of the lower jacket part 6 and the upper jacket part 7 via the lower bellows 4 and the upper bellows 5. connected to each other.

The lower mantle part itself consists of two parts 6a, 6b, as will be described in more detail later. It is divided into.

The bellows 4.5 ensures that the two envelope parts 6.7 of the pressure vessel are perpendicular to the vacuum chamber 1. Allow it to move. The lower jacket part 6 of the pressure vessel is supplied with air via a connecting tube 8. It is attached to a pressure-actuated cylinder 9 which is connected to the lower jacket part. 6 and lower the workpiece (reference numeral 10 in FIG. 2) into the lower envelope part 6 of the container. used to place. The workpiece was attached to the lower jacket part 6 The support part (reference number 11 in FIG. 2) is arranged.

The upper and lower jacket parts 7.6 of the pressure vessel are arranged at the top and at the bottom, respectively. The upper cylinder actuator 12 and the lower cylinder actuator 13 are compatible. It has a shape like that. After the workpiece is placed, the pressure oil is attached to the equipment The hydraulic system is supplied to the lower cylinder actuator 13 through a pipe 14. be provided.

The pressure causes the upper and lower jacket portions 7.6 to be pressed together, creating a generally cylindrical seal. Sufficient pressure is created to form a seal along line 15 around entry space 16. There is. It should be noted that the surfaces of the upper and lower skin portions 6.7 that match line 15 are In this example, the upper and lower outer shells are shaped like a truncated cone. Line 15 is inclined relative to the axis of movement of the part. Line 15 is dynamic, as will be described later. It is approximately perpendicular to the axis of the axis.

The pipe 17 is then connected to the gas or from a further pressure source 40 (schematically shown). through to the upper actuator 12 and through another pipe 18 to the enclosed space 16. supplied to The gas pressure is from the pressure oil pipe 14 that supplies the lower actuator 13. Activate the shutoff valve 28.

Therefore, this lower actuator 13 is held at a predetermined position since the pressure oil is hardly compressed. (2) On the other hand, the horizontal area of the actuator is the enclosed space 160 water. Since it is wider than Hirayo 1J, it is necessary to maintain the n-ru on the surface 15 between the 52 outer covering parts. A net closing force of

The upper actuator 12 is supported by the F end part member 19T, and the lower amplifier/yuator 13 is supported by the F right end member 20't'. This end member is '3. -ri21 Screwed into. The force caused by the high pressure 4 of T actuator 12 and j3 is almost g! ,a and is supported by a yoke 21 via end members 19 and 20. The system is 1 When pressurized to 000 bar, the forces supported by the yaws will cause the enclosed space to When large enough to accommodate a 200mm diameter workpiece, approximately 50 It is MN.

The safety valve 22 seals the surface 15 even if pressure oil leaks from the actuator 13. The upward force from the enclosed space 16 is applied to the actuator to prevent sudden separation. It is adapted not to exceed a downward force of 12.

This is because the spring force of the safety valve 22 is due to the force between the enclosed space 16 and the actuator. The pressure difference between the actuator and the actuator 2, dl is the diameter of the actuator 12, and d2 is the enclosed space. 16 diameter, P is the pressure d of the enclosed space J6, 2 This is because it is selected to be constrained to a smaller value.

Therefore, even if pressure oil leaks from the actuator 13, the outer covering portion 6 and and 7 are lowered together by the greater force of the actuator 12, and the The seal is Ilt samurai.

Heaters, upper thermal couple and lower electrical couple (schematically referenced 41..42'?'- (not shown) are fitted to the upper and lower jacket parts 7.6 of the pressurized J-container 1, and between the enclosures 7 and 1 (1.) of the added gas of 'i' is controlled to provide the added gas to ω, thus -?-15 enclosed ZZ 11. Press the same flow of gas at 1G between t-, 4*work [-- into the hole where the temperature of the gas is subwritten. Including υ 7 nine months' worth of fees The pressure gas in the large space 16 and the actuator 12 was maintained for a period of time ('4'!, t). The gas is released through paths 18 and 17. Enclosed (-1G is a vibe 2G The sky is emptied by the hawk. This valve is connected via an automatic shutoff valve (as shown in the figure). , °ζ Connected to vacuum pump system 1m3 to prevent gas from escaping when under pressure . Then the isolation valve 28 opens and the hydraulic fluid of actuator i3 comes out, and then the Pneumatic actuator 9 releases the seal at line 15 1. Under the pressure vessel It is used to lower the jacket part 6.

The enclosed space 16 is open to the vacuum chamber operator 1 and is further supplied by the vacuum pump system 3. That's why I'm being criticized. The pressure in the vacuum chamber 1 is monitored by a vacuum pressure sensor 27. vacuum When the pressure is low enough, the workpiece 10 is removed from the device 2 by a transfer mechanism. be taken out.

The seal at the surface 15 around the enclosed space 16 is further described herein with reference to FIG. Describe details 17. As can be seen from FIG. 2, two parts 6a of the lower jacket part 6, 6b is shaped such that the adjacent surfaces 31, 32 are tilted together. This in Figure 2 The slope of 41. is exaggerated for the sake of understanding and clarification. , 32 is a line Applicable at 33. When the enclosed space 16 is exposed to high pressure, the upper jacket portion The portion 6a of 6 is slightly deformed in the direction of the arrow 34, and the surface 31 of the portion 6b is It pivots around a line 33, 5 and thus this line 33 acts as a viewpoint.

Therefore, the side part of part 6a is slightly Move outward and downward.

This deformation moves the lip 35 on the upper surface of the portion 6a outward in the direction of the arrow 36 -1. , thus pressing firmly against the upper jacket part 7 at the knoll surface 15. subordinate Thus, the strength of the seal increases in proportion to the increased pressure in the enclosed space 16. correct In order to cause a significant deformation, the portion 6a is thinned as are both the portion 6b and the jacket portion 7. , so it deforms more under pressure f.

This structure of the device thus ensures a good sealing of the enclosed space 16.

FIG. 3 shows a second embodiment of the invention. This example and the example of FIGS. 1 and 2 The difference is only in the structure of the yoke; the other parts of this device are the same as in the first example. It is substantially the same as that of the example. Matching parts are indicated by the same reference number and are Some structural features, such as Eve, have been omitted to make the explanation easier to understand. .

In the embodiment of FIG. 3, the yoke 40 is in the form of a ring surrounding the remainder of the device. Therefore, it is not separated into side members and end members (7). The yoke is easier to make, lighter than the yoke of the first embodiment, and easier to access and maintain. For maintenance purposes, the yoke 40 must be slid sideways away from the rest of the equipment. It has the disadvantage of not being able to do so. Furthermore, the overall size of the device is large.

Many modifications to the embodiments described above are possible within the scope of the invention. for example, The upper and lower mantle portions move rather than an inclined surface formed by a truncated cone. It is possible to have something that fits in a plane perpendicular to the direction. Such a vertical plane , a good knoll similar to using a truncated cone does not provide or a seal like this is sufficient for many purposes and avoids misalignment and truncated cones. It is more tolerant of height mismatches and therefore provides practical advantages.

As previously mentioned, hydraulic fluid is e.g. 13. In the development of the present invention, the gas pressure can be further increased to achieve the desired height. To achieve the pressure, for example, a further hydraulic system with a piston of a different area can be used. It is usually necessary to use the hydraulic pressure nozzle in the internal space 16i. This is used to provide initial compression of the gas to be supplied.

Furthermore, the vacuum system 3 is used to remove the vibrator 26 to minimize gas loss. The gas removed from the interior space through is recycled to a further pressure source.

In FIG. 1, the upper and lower end members 19.20 are screwed into the yoke 21. It gets noticed. On the one hand, matching parts with protrusions are used.

C'-+J I40 Submission of translation of written amendment (Patent Law Article 1134-8) April 22, 1994

Claims (1)

[Claims] 1. a plurality of jacket parts (6.7); first means (12.13) for pressing the jacket portion (6.7) into abutment; The outer covering portion (6.7) is connected to the first means (12.13). Thus, when pressed and abutted, it forms an enclosed space (16) for the workpiece. By exposing the workpiece to high pressure, the workpiece is a second hand for supplying pressurized gas to said internal space (16) for treating the work piece; processing system for workpieces having stages (18.40). 2. A pressure vessel (4. 5.6.7) and means (3) for evacuating said pressure vessel (6.7). The processing system according to item 1. 3. means (41.42) for heating said interior space (16), thereby The processing system of claim 1, wherein the processing system heats the workpiece. 4. two jacket parts (6.7) that can move in opposite directions along a common axis The processing system according to claim 1, comprising: 5. Each of said jacket portions has a sealing surface inclined relative to said shaft gland, said sealing surface When the outer covering part (6.7) presses and contacts, it presses and contacts in a sealed state. 5. The processing system according to claim 4. 6. One of the jacket portions is deformed to thereby seal the mounting surface. Claim 5 has a shape (31, 32, 33) such that it can be pressed and brought into contact with Processing system described. 7. A valve is attached from the interior space to control the high pressure in the interior space. 2. Processing system according to claim 1, having an outlet (22). 8. attaching the workpiece to a first envelope portion, and attaching the workpiece to the first envelope portion and the second envelope portion; The outer covering portion (6.7) is pressed against the outer covering portion (6.7). so as to form an enclosed space (16) for said workpiece when brought into contact with said workpiece. It has a shape, for treating the workpiece by subjecting the workpiece to high pressure; A method for processing a workpiece, in which pressurized gas is supplied to the internal space (16) for the purpose of processing the workpiece.