JPH0747915Y2 - 電子部品実装構造体 - Google Patents
電子部品実装構造体Info
- Publication number
- JPH0747915Y2 JPH0747915Y2 JP1989152688U JP15268889U JPH0747915Y2 JP H0747915 Y2 JPH0747915 Y2 JP H0747915Y2 JP 1989152688 U JP1989152688 U JP 1989152688U JP 15268889 U JP15268889 U JP 15268889U JP H0747915 Y2 JPH0747915 Y2 JP H0747915Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- protrusion
- chip
- substrate
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989152688U JPH0747915Y2 (ja) | 1989-12-28 | 1989-12-28 | 電子部品実装構造体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989152688U JPH0747915Y2 (ja) | 1989-12-28 | 1989-12-28 | 電子部品実装構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0390494U JPH0390494U (enExample) | 1991-09-13 |
| JPH0747915Y2 true JPH0747915Y2 (ja) | 1995-11-01 |
Family
ID=31698940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989152688U Expired - Fee Related JPH0747915Y2 (ja) | 1989-12-28 | 1989-12-28 | 電子部品実装構造体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0747915Y2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3985453B2 (ja) * | 2001-01-12 | 2007-10-03 | 松下電工株式会社 | 電力変換装置 |
-
1989
- 1989-12-28 JP JP1989152688U patent/JPH0747915Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0390494U (enExample) | 1991-09-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2791216B2 (ja) | 電気部品用パッケージ、電力損発生部品の取付方法、及び導体端子ピンと回路基板との接続方法 | |
| JPH073674Y2 (ja) | 電子装置 | |
| JPH04171994A (ja) | 駆動部品 | |
| JP2819433B2 (ja) | 集積回路をベースに装着する装置 | |
| JPH0747915Y2 (ja) | 電子部品実装構造体 | |
| JPH03268348A (ja) | 表面実装型icパッケージの放熱構造 | |
| JPH0638479Y2 (ja) | 電子部品のシールドケース | |
| JPH0439957A (ja) | 半導体パッケージの放熱具 | |
| JP2529174Y2 (ja) | ノイズフィルタ | |
| JPS627145A (ja) | 電力半導体装置 | |
| JP2000252657A (ja) | 制御機器の放熱装置 | |
| JP4569035B2 (ja) | パワー素子の冷却装置 | |
| JPS6331400Y2 (enExample) | ||
| JPH073673Y2 (ja) | 発熱素子の放熱構造 | |
| JPH0729670Y2 (ja) | 電源装置 | |
| JPH0810230Y2 (ja) | 電気部品と放熱体の取付構造 | |
| JP2521489Y2 (ja) | パワーモジュールの放熱構造 | |
| JPS5940733Y2 (ja) | トランスの取付装置 | |
| JPH039335Y2 (enExample) | ||
| JPH0436121Y2 (enExample) | ||
| JPH047175U (enExample) | ||
| JPS59185840U (ja) | 電子装置 | |
| JP2004207384A (ja) | 電子部品ユニットの放熱構造 | |
| JPH01246857A (ja) | 半導体装置 | |
| JPH11289036A (ja) | 電子装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |