JPH0745562Y2 - スパッタリング装置 - Google Patents

スパッタリング装置

Info

Publication number
JPH0745562Y2
JPH0745562Y2 JP1988059931U JP5993188U JPH0745562Y2 JP H0745562 Y2 JPH0745562 Y2 JP H0745562Y2 JP 1988059931 U JP1988059931 U JP 1988059931U JP 5993188 U JP5993188 U JP 5993188U JP H0745562 Y2 JPH0745562 Y2 JP H0745562Y2
Authority
JP
Japan
Prior art keywords
gallium
lower electrode
electrode
melting point
low melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988059931U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01164757U (ko
Inventor
則忠 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP1988059931U priority Critical patent/JPH0745562Y2/ja
Publication of JPH01164757U publication Critical patent/JPH01164757U/ja
Application granted granted Critical
Publication of JPH0745562Y2 publication Critical patent/JPH0745562Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP1988059931U 1988-05-06 1988-05-06 スパッタリング装置 Expired - Lifetime JPH0745562Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988059931U JPH0745562Y2 (ja) 1988-05-06 1988-05-06 スパッタリング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988059931U JPH0745562Y2 (ja) 1988-05-06 1988-05-06 スパッタリング装置

Publications (2)

Publication Number Publication Date
JPH01164757U JPH01164757U (ko) 1989-11-17
JPH0745562Y2 true JPH0745562Y2 (ja) 1995-10-18

Family

ID=31285665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988059931U Expired - Lifetime JPH0745562Y2 (ja) 1988-05-06 1988-05-06 スパッタリング装置

Country Status (1)

Country Link
JP (1) JPH0745562Y2 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4979442B2 (ja) * 2007-04-10 2012-07-18 昭和電工株式会社 Ｇａスパッタターゲットの製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5323881A (en) * 1976-08-18 1978-03-04 Ulvac Corp High speed sputtering apparatus
JPS54143780A (en) * 1978-05-01 1979-11-09 Nippon Telegr & Teleph Corp <Ntt> Manufacture of semiconductor sputtering target
JPS61257472A (ja) * 1985-05-07 1986-11-14 Mitsubishi Electric Corp スパツタリング装置
JPS6357763A (ja) * 1986-08-27 1988-03-12 Mitsui Eng & Shipbuild Co Ltd タ−ゲツト及びその製造方法

Also Published As

Publication number Publication date
JPH01164757U (ko) 1989-11-17

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