JPS5323881A - High speed sputtering apparatus - Google Patents

High speed sputtering apparatus

Info

Publication number
JPS5323881A
JPS5323881A JP9765876A JP9765876A JPS5323881A JP S5323881 A JPS5323881 A JP S5323881A JP 9765876 A JP9765876 A JP 9765876A JP 9765876 A JP9765876 A JP 9765876A JP S5323881 A JPS5323881 A JP S5323881A
Authority
JP
Japan
Prior art keywords
high speed
sputtering apparatus
speed sputtering
hearth
sputter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9765876A
Other languages
Japanese (ja)
Other versions
JPS55469B2 (en
Inventor
Kazuyuki Tsuruoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP9765876A priority Critical patent/JPS5323881A/en
Publication of JPS5323881A publication Critical patent/JPS5323881A/en
Publication of JPS55469B2 publication Critical patent/JPS55469B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To sputter on the substrate, made of the substance comparatively weak for heat, at high speed, by constructing water-cooled copper electrode to the hearth, having a cavity on the surface and melting the target material in its inner part once and next, making target by solidifying as it is.
JP9765876A 1976-08-18 1976-08-18 High speed sputtering apparatus Granted JPS5323881A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9765876A JPS5323881A (en) 1976-08-18 1976-08-18 High speed sputtering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9765876A JPS5323881A (en) 1976-08-18 1976-08-18 High speed sputtering apparatus

Publications (2)

Publication Number Publication Date
JPS5323881A true JPS5323881A (en) 1978-03-04
JPS55469B2 JPS55469B2 (en) 1980-01-08

Family

ID=14198159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9765876A Granted JPS5323881A (en) 1976-08-18 1976-08-18 High speed sputtering apparatus

Country Status (1)

Country Link
JP (1) JPS5323881A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01164757U (en) * 1988-05-06 1989-11-17

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58185483U (en) * 1982-06-02 1983-12-09 株式会社寿 Writing instrument with keychain

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01164757U (en) * 1988-05-06 1989-11-17

Also Published As

Publication number Publication date
JPS55469B2 (en) 1980-01-08

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