JPH01164757U - - Google Patents
Info
- Publication number
- JPH01164757U JPH01164757U JP5993188U JP5993188U JPH01164757U JP H01164757 U JPH01164757 U JP H01164757U JP 5993188 U JP5993188 U JP 5993188U JP 5993188 U JP5993188 U JP 5993188U JP H01164757 U JPH01164757 U JP H01164757U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- sputtering device
- electrodes
- deposited
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988059931U JPH0745562Y2 (ja) | 1988-05-06 | 1988-05-06 | スパッタリング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988059931U JPH0745562Y2 (ja) | 1988-05-06 | 1988-05-06 | スパッタリング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01164757U true JPH01164757U (ko) | 1989-11-17 |
| JPH0745562Y2 JPH0745562Y2 (ja) | 1995-10-18 |
Family
ID=31285665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988059931U Expired - Lifetime JPH0745562Y2 (ja) | 1988-05-06 | 1988-05-06 | スパッタリング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0745562Y2 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008260974A (ja) * | 2007-04-10 | 2008-10-30 | Showa Denko Kk | Ｇａスパッタターゲットの製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5323881A (en) * | 1976-08-18 | 1978-03-04 | Ulvac Corp | High speed sputtering apparatus |
| JPS54143780A (en) * | 1978-05-01 | 1979-11-09 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture of semiconductor sputtering target |
| JPS61257472A (ja) * | 1985-05-07 | 1986-11-14 | Mitsubishi Electric Corp | スパツタリング装置 |
| JPS6357763A (ja) * | 1986-08-27 | 1988-03-12 | Mitsui Eng & Shipbuild Co Ltd | タ−ゲツト及びその製造方法 |
-
1988
- 1988-05-06 JP JP1988059931U patent/JPH0745562Y2/ja not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5323881A (en) * | 1976-08-18 | 1978-03-04 | Ulvac Corp | High speed sputtering apparatus |
| JPS54143780A (en) * | 1978-05-01 | 1979-11-09 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture of semiconductor sputtering target |
| JPS61257472A (ja) * | 1985-05-07 | 1986-11-14 | Mitsubishi Electric Corp | スパツタリング装置 |
| JPS6357763A (ja) * | 1986-08-27 | 1988-03-12 | Mitsui Eng & Shipbuild Co Ltd | タ−ゲツト及びその製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008260974A (ja) * | 2007-04-10 | 2008-10-30 | Showa Denko Kk | Ｇａスパッタターゲットの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0745562Y2 (ja) | 1995-10-18 |