JPH0741157Y2 - Ｉｃパッケージ用封止キャップ - Google Patents

Ｉｃパッケージ用封止キャップ

Info

Publication number
JPH0741157Y2
JPH0741157Y2 JP1988071721U JP7172188U JPH0741157Y2 JP H0741157 Y2 JPH0741157 Y2 JP H0741157Y2 JP 1988071721 U JP1988071721 U JP 1988071721U JP 7172188 U JP7172188 U JP 7172188U JP H0741157 Y2 JPH0741157 Y2 JP H0741157Y2
Authority
JP
Japan
Prior art keywords
brazing
flange
substrate
ring
metallized layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988071721U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01176939U (enrdf_load_stackoverflow
Inventor
信彦 宮脇
俊克 高田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP1988071721U priority Critical patent/JPH0741157Y2/ja
Publication of JPH01176939U publication Critical patent/JPH01176939U/ja
Application granted granted Critical
Publication of JPH0741157Y2 publication Critical patent/JPH0741157Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Ceramic Products (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1988071721U 1988-06-01 1988-06-01 Ｉｃパッケージ用封止キャップ Expired - Lifetime JPH0741157Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988071721U JPH0741157Y2 (ja) 1988-06-01 1988-06-01 Ｉｃパッケージ用封止キャップ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988071721U JPH0741157Y2 (ja) 1988-06-01 1988-06-01 Ｉｃパッケージ用封止キャップ

Publications (2)

Publication Number Publication Date
JPH01176939U JPH01176939U (enrdf_load_stackoverflow) 1989-12-18
JPH0741157Y2 true JPH0741157Y2 (ja) 1995-09-20

Family

ID=31296916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988071721U Expired - Lifetime JPH0741157Y2 (ja) 1988-06-01 1988-06-01 Ｉｃパッケージ用封止キャップ

Country Status (1)

Country Link
JP (1) JPH0741157Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7476708B2 (ja) * 2020-07-30 2024-05-01 日本電気株式会社 気密封止パッケージ、赤外線検知器及び気密封止パッケージの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01253944A (ja) * 1988-04-04 1989-10-11 Sumitomo Electric Ind Ltd 半導体装置用部品

Also Published As

Publication number Publication date
JPH01176939U (enrdf_load_stackoverflow) 1989-12-18

Similar Documents

Publication Publication Date Title
JP4969738B2 (ja) セラミックス回路基板およびそれを用いた半導体モジュール
JP3461829B2 (ja) 緩衝層を有する電力半導体素子
US4670771A (en) Rectifier module
JPH0676790B2 (ja) イグナイタ
JPH05347469A (ja) セラミックス回路基板
JPH0741157Y2 (ja) Ｉｃパッケージ用封止キャップ
JPH08222658A (ja) 半導体素子用パッケージ及びその製造方法
JP2841259B2 (ja) 半導体素子用セラミック容器
JP3953442B2 (ja) 半導体装置
JPH0272655A (ja) 実装部品
JPS62290158A (ja) 半導体素子塔載部のセラミツクの接合構造
JP3283119B2 (ja) 回路基板
JPH07335792A (ja) 半導体素子搭載用パッケージ
JP2773549B2 (ja) 半導体装置用容器
JPH06125018A (ja) 半導体素子用キャップ
JP2687678B2 (ja) 半導体用セラミックスパッケージ
JPH0739236Y2 (ja) アルミナ質基板と窒化アルミニウム基板の接合部
JPS63122253A (ja) 半導体パツケ−ジ
JPH0777988B2 (ja) ヒートシンク付きセラミックパッケージ
JP4123717B2 (ja) チップ型半導体素子の製造方法
JPH0424947A (ja) 半導体用セラミックスパッケージ
JP2759777B2 (ja) 半導体素子搭載部のセラミックの接合構造
JPH0730040A (ja) リードフレームおよび半導体装置の実装構造
JPH0581184B2 (enrdf_load_stackoverflow)
JP2551228B2 (ja) 半導体装置