JPH0739258Y2 - 基板のエッジにおける端子構造 - Google Patents

基板のエッジにおける端子構造

Info

Publication number
JPH0739258Y2
JPH0739258Y2 JP1989070268U JP7026889U JPH0739258Y2 JP H0739258 Y2 JPH0739258 Y2 JP H0739258Y2 JP 1989070268 U JP1989070268 U JP 1989070268U JP 7026889 U JP7026889 U JP 7026889U JP H0739258 Y2 JPH0739258 Y2 JP H0739258Y2
Authority
JP
Japan
Prior art keywords
terminal
printed circuit
circuit board
substrate
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989070268U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0310565U (US20030204162A1-20031030-M00001.png
Inventor
忠 久保寺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Business Innovation Corp
Original Assignee
Fuji Xerox Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd
Priority to JP1989070268U priority Critical patent/JPH0739258Y2/ja
Publication of JPH0310565U publication Critical patent/JPH0310565U/ja
Application granted granted Critical
Publication of JPH0739258Y2 publication Critical patent/JPH0739258Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP1989070268U 1989-06-15 1989-06-15 基板のエッジにおける端子構造 Expired - Lifetime JPH0739258Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989070268U JPH0739258Y2 (ja) 1989-06-15 1989-06-15 基板のエッジにおける端子構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989070268U JPH0739258Y2 (ja) 1989-06-15 1989-06-15 基板のエッジにおける端子構造

Publications (2)

Publication Number Publication Date
JPH0310565U JPH0310565U (US20030204162A1-20031030-M00001.png) 1991-01-31
JPH0739258Y2 true JPH0739258Y2 (ja) 1995-09-06

Family

ID=31606284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989070268U Expired - Lifetime JPH0739258Y2 (ja) 1989-06-15 1989-06-15 基板のエッジにおける端子構造

Country Status (1)

Country Link
JP (1) JPH0739258Y2 (US20030204162A1-20031030-M00001.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019071332A (ja) * 2017-10-06 2019-05-09 富士通株式会社 配線基板、電子機器、板金部品の取り付け方法及び配線基板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5938063Y2 (ja) * 1980-07-09 1984-10-22 松下電工株式会社 スル−ホ−ルプリント板
JPS57168267U (US20030204162A1-20031030-M00001.png) * 1981-04-17 1982-10-23

Also Published As

Publication number Publication date
JPH0310565U (US20030204162A1-20031030-M00001.png) 1991-01-31

Similar Documents

Publication Publication Date Title
US6542379B1 (en) Circuitry with integrated passive components and method for producing
US6651324B1 (en) Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer
JPH02306690A (ja) 表面実装用配線基板の製造方法
JP3226959B2 (ja) 多層フレキシブルプリント基板の製法
JP2003188509A (ja) プリント配線基板
JPH0739258Y2 (ja) 基板のエッジにおける端子構造
JPH1070363A (ja) 印刷配線板の製造方法
JPH1079568A (ja) プリント配線板の製造方法
JP4782354B2 (ja) チップ抵抗器及びその製造方法
TW561811B (en) Printed wiring board structure and manufacturing method therefor
JPH0677623A (ja) 電子回路装置とその製造方法
JPS63137498A (ja) スル−ホ−ルプリント板の製法
KR101313155B1 (ko) 인쇄회로기판의 도금방법 및 이를 이용한 연성 인쇄회로기판의 제조방법
JP3202836B2 (ja) 多層プリント配線板の製造方法
JPS63283051A (ja) 混成集積回路装置用基板
JPH04263493A (ja) プリント配線板の製造方法
JPS6355236B2 (US20030204162A1-20031030-M00001.png)
JP2004055894A (ja) プリント回路板の構造
JPS63160397A (ja) 多層基板の製造方法
JPH08255870A (ja) 電子部品実装板及びその製造方法
JPH03255691A (ja) プリント配線板
JPH03136396A (ja) 電子回路部品とその製造方法及び電子回路装置
JPH0347341Y2 (US20030204162A1-20031030-M00001.png)
JPS59232491A (ja) 多層印刷配線板の製造方法
JPH10190158A (ja) リジッド・フレックスプリント配線板およびその製造方法