JPH0735389Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0735389Y2
JPH0735389Y2 JP1986105213U JP10521386U JPH0735389Y2 JP H0735389 Y2 JPH0735389 Y2 JP H0735389Y2 JP 1986105213 U JP1986105213 U JP 1986105213U JP 10521386 U JP10521386 U JP 10521386U JP H0735389 Y2 JPH0735389 Y2 JP H0735389Y2
Authority
JP
Japan
Prior art keywords
chip
layer
wiring layer
wiring
circuit element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1986105213U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6310550U (enExample
Inventor
三輝也 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP1986105213U priority Critical patent/JPH0735389Y2/ja
Priority to KR2019870007249U priority patent/KR920005952Y1/ko
Priority to MYPI87000928A priority patent/MY102308A/en
Publication of JPS6310550U publication Critical patent/JPS6310550U/ja
Application granted granted Critical
Publication of JPH0735389Y2 publication Critical patent/JPH0735389Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP1986105213U 1986-07-06 1986-07-09 半導体装置 Expired - Lifetime JPH0735389Y2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1986105213U JPH0735389Y2 (ja) 1986-07-09 1986-07-09 半導体装置
KR2019870007249U KR920005952Y1 (ko) 1986-07-06 1987-05-13 반도체장치
MYPI87000928A MY102308A (en) 1986-07-09 1987-07-01 Hybrid printed circuit structures

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986105213U JPH0735389Y2 (ja) 1986-07-09 1986-07-09 半導体装置

Publications (2)

Publication Number Publication Date
JPS6310550U JPS6310550U (enExample) 1988-01-23
JPH0735389Y2 true JPH0735389Y2 (ja) 1995-08-09

Family

ID=14401389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986105213U Expired - Lifetime JPH0735389Y2 (ja) 1986-07-06 1986-07-09 半導体装置

Country Status (3)

Country Link
JP (1) JPH0735389Y2 (enExample)
KR (1) KR920005952Y1 (enExample)
MY (1) MY102308A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002222914A (ja) * 2001-01-26 2002-08-09 Sony Corp 半導体装置及びその製造方法
JP4489137B1 (ja) * 2009-01-20 2010-06-23 パナソニック株式会社 回路モジュール及び電子機器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5272468A (en) * 1975-12-15 1977-06-16 Matsushita Electric Industrial Co Ltd Printed circuit board
JPS629728Y2 (enExample) * 1981-05-07 1987-03-06
JPS58150862U (ja) * 1982-04-01 1983-10-08 パイオニア株式会社 チツプ部品取付装置
JPS60114844U (ja) * 1984-01-10 1985-08-03 三菱電機株式会社 サ−マルヘツド
JPS6181140U (enExample) * 1984-11-01 1986-05-29

Also Published As

Publication number Publication date
JPS6310550U (enExample) 1988-01-23
KR880003791U (ko) 1988-04-14
MY102308A (en) 1992-05-28
KR920005952Y1 (ko) 1992-08-27

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