KR920005952Y1 - 반도체장치 - Google Patents

반도체장치 Download PDF

Info

Publication number
KR920005952Y1
KR920005952Y1 KR2019870007249U KR870007249U KR920005952Y1 KR 920005952 Y1 KR920005952 Y1 KR 920005952Y1 KR 2019870007249 U KR2019870007249 U KR 2019870007249U KR 870007249 U KR870007249 U KR 870007249U KR 920005952 Y1 KR920005952 Y1 KR 920005952Y1
Authority
KR
South Korea
Prior art keywords
chip
wiring board
thick
ceramic wiring
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR2019870007249U
Other languages
English (en)
Korean (ko)
Other versions
KR880003791U (ko
Inventor
미키야 고바야시
Original Assignee
소니 가부시키가이샤
오가 노리오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 소니 가부시키가이샤, 오가 노리오 filed Critical 소니 가부시키가이샤
Publication of KR880003791U publication Critical patent/KR880003791U/ko
Application granted granted Critical
Publication of KR920005952Y1 publication Critical patent/KR920005952Y1/ko
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR2019870007249U 1986-07-06 1987-05-13 반도체장치 Expired KR920005952Y1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP86-105213 1986-07-06
JP1986105213U JPH0735389Y2 (ja) 1986-07-09 1986-07-09 半導体装置

Publications (2)

Publication Number Publication Date
KR880003791U KR880003791U (ko) 1988-04-14
KR920005952Y1 true KR920005952Y1 (ko) 1992-08-27

Family

ID=14401389

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019870007249U Expired KR920005952Y1 (ko) 1986-07-06 1987-05-13 반도체장치

Country Status (3)

Country Link
JP (1) JPH0735389Y2 (enExample)
KR (1) KR920005952Y1 (enExample)
MY (1) MY102308A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002222914A (ja) * 2001-01-26 2002-08-09 Sony Corp 半導体装置及びその製造方法
JP4489137B1 (ja) * 2009-01-20 2010-06-23 パナソニック株式会社 回路モジュール及び電子機器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5272468A (en) * 1975-12-15 1977-06-16 Matsushita Electric Industrial Co Ltd Printed circuit board
JPS629728Y2 (enExample) * 1981-05-07 1987-03-06
JPS58150862U (ja) * 1982-04-01 1983-10-08 パイオニア株式会社 チツプ部品取付装置
JPS60114844U (ja) * 1984-01-10 1985-08-03 三菱電機株式会社 サ−マルヘツド
JPS6181140U (enExample) * 1984-11-01 1986-05-29

Also Published As

Publication number Publication date
JPH0735389Y2 (ja) 1995-08-09
JPS6310550U (enExample) 1988-01-23
KR880003791U (ko) 1988-04-14
MY102308A (en) 1992-05-28

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