JPH0729591Y2 - チップ形コネクタ - Google Patents
チップ形コネクタInfo
- Publication number
- JPH0729591Y2 JPH0729591Y2 JP1990102089U JP10208990U JPH0729591Y2 JP H0729591 Y2 JPH0729591 Y2 JP H0729591Y2 JP 1990102089 U JP1990102089 U JP 1990102089U JP 10208990 U JP10208990 U JP 10208990U JP H0729591 Y2 JPH0729591 Y2 JP H0729591Y2
- Authority
- JP
- Japan
- Prior art keywords
- type connector
- chip
- contact
- back surface
- release paper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005476 soldering Methods 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 230000013011 mating Effects 0.000 claims description 6
- 238000004049 embossing Methods 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Packages (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990102089U JPH0729591Y2 (ja) | 1990-09-28 | 1990-09-28 | チップ形コネクタ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990102089U JPH0729591Y2 (ja) | 1990-09-28 | 1990-09-28 | チップ形コネクタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0459090U JPH0459090U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-05-20 |
JPH0729591Y2 true JPH0729591Y2 (ja) | 1995-07-05 |
Family
ID=31846057
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990102089U Expired - Fee Related JPH0729591Y2 (ja) | 1990-09-28 | 1990-09-28 | チップ形コネクタ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0729591Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2104438C (en) * | 1992-11-02 | 1996-07-02 | James Stephen Chapman | Method and apparatus for mounting connectors |
JP5208816B2 (ja) * | 2009-03-06 | 2013-06-12 | 日本板硝子株式会社 | 端子付ガラス及び端子付ガラス搭載車両 |
CN114271038B (zh) * | 2019-08-23 | 2024-05-03 | 株式会社富士 | 电子电路装置及其制造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS624394A (ja) * | 1985-06-29 | 1987-01-10 | 株式会社東芝 | フラツトパツケ−ジ形電子部品の装着方法およびこれに使用する粘着シ−ト |
JPS6444571U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1987-09-11 | 1989-03-16 | ||
JPH01184986A (ja) * | 1988-01-20 | 1989-07-24 | Sanyo Electric Co Ltd | プリント基板構成体 |
JPH01276695A (ja) * | 1988-04-27 | 1989-11-07 | Pfu Ltd | 表面実装型電子部品とそのテーピング体 |
-
1990
- 1990-09-28 JP JP1990102089U patent/JPH0729591Y2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0459090U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-05-20 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |