JPH0719160Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0719160Y2
JPH0719160Y2 JP1987093516U JP9351687U JPH0719160Y2 JP H0719160 Y2 JPH0719160 Y2 JP H0719160Y2 JP 1987093516 U JP1987093516 U JP 1987093516U JP 9351687 U JP9351687 U JP 9351687U JP H0719160 Y2 JPH0719160 Y2 JP H0719160Y2
Authority
JP
Japan
Prior art keywords
lead
emitter
base
heat dissipation
dissipation plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987093516U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63201346U (enExample
Inventor
典博 重田
益良男 吉井
宏之 星本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP1987093516U priority Critical patent/JPH0719160Y2/ja
Publication of JPS63201346U publication Critical patent/JPS63201346U/ja
Application granted granted Critical
Publication of JPH0719160Y2 publication Critical patent/JPH0719160Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5453—Dispositions of bond wires connecting between multiple bond pads on a chip, e.g. daisy chain
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP1987093516U 1987-06-18 1987-06-18 半導体装置 Expired - Lifetime JPH0719160Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987093516U JPH0719160Y2 (ja) 1987-06-18 1987-06-18 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987093516U JPH0719160Y2 (ja) 1987-06-18 1987-06-18 半導体装置

Publications (2)

Publication Number Publication Date
JPS63201346U JPS63201346U (enExample) 1988-12-26
JPH0719160Y2 true JPH0719160Y2 (ja) 1995-05-01

Family

ID=30956158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987093516U Expired - Lifetime JPH0719160Y2 (ja) 1987-06-18 1987-06-18 半導体装置

Country Status (1)

Country Link
JP (1) JPH0719160Y2 (enExample)

Also Published As

Publication number Publication date
JPS63201346U (enExample) 1988-12-26

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