JPH071796Y2 - 浸漬型基板処理装置 - Google Patents

浸漬型基板処理装置

Info

Publication number
JPH071796Y2
JPH071796Y2 JP1990406312U JP40631290U JPH071796Y2 JP H071796 Y2 JPH071796 Y2 JP H071796Y2 JP 1990406312 U JP1990406312 U JP 1990406312U JP 40631290 U JP40631290 U JP 40631290U JP H071796 Y2 JPH071796 Y2 JP H071796Y2
Authority
JP
Japan
Prior art keywords
surface treatment
control valve
immersion type
substrate processing
type substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990406312U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0492633U (https=
Inventor
敏朗 廣江
賢司 杉本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd, Dainippon Screen Manufacturing Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP1990406312U priority Critical patent/JPH071796Y2/ja
Priority to KR1019910023959A priority patent/KR920013638A/ko
Priority to US07/815,323 priority patent/US5191908A/en
Publication of JPH0492633U publication Critical patent/JPH0492633U/ja
Application granted granted Critical
Publication of JPH071796Y2 publication Critical patent/JPH071796Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0426—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Coating Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
JP1990406312U 1990-12-28 1990-12-28 浸漬型基板処理装置 Expired - Lifetime JPH071796Y2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1990406312U JPH071796Y2 (ja) 1990-12-28 1990-12-28 浸漬型基板処理装置
KR1019910023959A KR920013638A (ko) 1990-12-28 1991-12-23 침지형 기판처리 장치
US07/815,323 US5191908A (en) 1990-12-28 1991-12-27 Dipping type surface treatment apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990406312U JPH071796Y2 (ja) 1990-12-28 1990-12-28 浸漬型基板処理装置

Publications (2)

Publication Number Publication Date
JPH0492633U JPH0492633U (https=) 1992-08-12
JPH071796Y2 true JPH071796Y2 (ja) 1995-01-18

Family

ID=18515925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990406312U Expired - Lifetime JPH071796Y2 (ja) 1990-12-28 1990-12-28 浸漬型基板処理装置

Country Status (3)

Country Link
US (1) US5191908A (https=)
JP (1) JPH071796Y2 (https=)
KR (1) KR920013638A (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3225441B2 (ja) * 1991-04-23 2001-11-05 東京エレクトロン株式会社 処理装置
JP2804210B2 (ja) * 1992-01-22 1998-09-24 ジャパン・フィールド株式会社 洗浄装置
JP3110218B2 (ja) * 1992-09-25 2000-11-20 三菱電機株式会社 半導体洗浄装置及び方法、ウエハカセット、専用グローブ並びにウエハ受け治具
JP3142195B2 (ja) * 1993-07-20 2001-03-07 大日本スクリーン製造株式会社 薬液供給装置
US5402807A (en) * 1993-07-21 1995-04-04 Moore; David R. Multi-modular device for wet-processing integrated circuits
JP2894535B2 (ja) * 1994-01-18 1999-05-24 信越半導体株式会社 ウェーハホルダー
US5531236A (en) * 1994-06-01 1996-07-02 Kempka; Steven N. Directed flow fluid rinse trough
US5772784A (en) * 1994-11-14 1998-06-30 Yieldup International Ultra-low particle semiconductor cleaner
US5746234A (en) 1994-11-18 1998-05-05 Advanced Chemill Systems Method and apparatus for cleaning thin substrates
US5720813A (en) 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
TW333658B (en) * 1996-05-30 1998-06-11 Tokyo Electron Co Ltd The substrate processing method and substrate processing system
JPH10223585A (ja) 1997-02-04 1998-08-21 Canon Inc ウェハ処理装置及びその方法並びにｓｏｉウェハの製造方法
US6391067B2 (en) 1997-02-04 2002-05-21 Canon Kabushiki Kaisha Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
US6068002A (en) 1997-04-02 2000-05-30 Tokyo Electron Limited Cleaning and drying apparatus, wafer processing system and wafer processing method
JPH1126423A (ja) * 1997-07-09 1999-01-29 Sugai:Kk 半導体ウエハ等の処理方法並びにその処理装置
US6695926B1 (en) * 1997-07-09 2004-02-24 Ses Co., Ltd. Treatment method of semiconductor wafers and the like and treatment system for the same
KR100707107B1 (ko) * 1997-07-17 2007-12-27 동경 엘렉트론 주식회사 세정.건조처리방법및장치
DE59908053D1 (de) * 1998-04-06 2004-01-29 Koerner Chemieanlagen Eingehauste Beizanlage
US6532975B1 (en) * 1999-08-13 2003-03-18 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
JP3212981B1 (ja) * 2000-05-01 2001-09-25 正則 茂木 弁の開閉位置出力装置
JP4100466B2 (ja) * 2000-12-25 2008-06-11 東京エレクトロン株式会社 液処理装置
US7218983B2 (en) * 2003-11-06 2007-05-15 Applied Materials, Inc. Method and apparatus for integrating large and small lot electronic device fabrication facilities
US7720557B2 (en) * 2003-11-06 2010-05-18 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
US20050209721A1 (en) * 2003-11-06 2005-09-22 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
US8635784B2 (en) * 2005-10-04 2014-01-28 Applied Materials, Inc. Methods and apparatus for drying a substrate
JP5063138B2 (ja) * 2007-02-23 2012-10-31 株式会社Ｓｏｋｕｄｏ 基板現像方法および現像装置
JP5806811B2 (ja) * 2010-10-01 2015-11-10 株式会社日立国際電気 基板処理装置、基板処理方法および半導体装置の製造方法
AT511898A1 (de) * 2011-09-12 2013-03-15 Tms Transport Und Montagesysteme Gmbh Reinigungsmaschine zum reinigen industriell gefertigter bauteile
DE102018105966A1 (de) * 2018-03-15 2019-09-19 Schaeffler Technologies AG & Co. KG Anlage und Verfahren zum Behandeln einer Oberfläche mindestens eines großformatigen Bauteils
US11194259B2 (en) * 2018-08-30 2021-12-07 Taiwan Semiconductor Manufacturing Co., Ltd. Equipment module with enhanced protection from airborne contaminants, and method of operation

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2181177A (en) * 1937-05-26 1939-11-28 Howard C Davis Process of deposition
US3893869A (en) * 1974-05-31 1975-07-08 Rca Corp Megasonic cleaning system
JPS5181467A (ja) * 1975-01-10 1976-07-16 Hitachi Ltd Senjoso
GB2018831A (en) * 1978-03-30 1979-10-24 Price Bros Ltd Improvements in cleaning equipment
JPS6014244A (ja) * 1983-07-06 1985-01-24 Fujitsu Ltd マスク洗浄装置
JPS6085529A (ja) * 1983-10-17 1985-05-15 Mitsubishi Electric Corp 半導体ウエ−ハ薬液処理装置
US4520834A (en) * 1983-11-08 1985-06-04 Dicicco Paolo S Apparatus for processing articles in a series of process solution containers
JPS62198122A (ja) * 1986-02-26 1987-09-01 Hitachi Ltd 半導体処理装置
JPS63248449A (ja) * 1987-04-03 1988-10-14 Tadahiro Omi ドラフトチヤンバ
US4839979A (en) * 1987-07-13 1989-06-20 Sea Search, Inc. Spear gun tip assembly and method of use thereof
JPH01226157A (ja) * 1988-03-07 1989-09-08 Kyushu Electron Metal Co Ltd 半導体基板の乾燥方法
JPH01238022A (ja) * 1988-03-17 1989-09-22 Marine Instr Co Ltd 半導体処理装置
JPH01261829A (ja) * 1988-04-13 1989-10-18 Sumitomo Electric Ind Ltd 有機金属気相エピタキシー用基板の前処理方法

Also Published As

Publication number Publication date
US5191908A (en) 1993-03-09
KR920013638A (ko) 1992-07-29
JPH0492633U (https=) 1992-08-12

Similar Documents

Publication Publication Date Title
JPH071796Y2 (ja) 浸漬型基板処理装置
EP0854499B1 (en) Substrate transporting and processing system
CN117219547A (zh) 高流速、气体净化的侧储存舱装置、组件和方法
US5876280A (en) Substrate treating system and substrate treating method
TWI373799B (en) Processing apparatus for cleaning substrate and substrate processing unit
KR100458647B1 (ko) 기판처리시스템
JP3122868B2 (ja) 塗布装置
US6199564B1 (en) Substrate processing method and apparatus
JPH038821B2 (https=)
JP2004311940A (ja) 基板移送モジュールの汚染を制御することができる基板処理装置及び方法
KR970006728B1 (ko) 환경제어장치
US6347990B1 (en) Microelectronic fabrication system cleaning methods and systems that maintain higher air pressure in a process area than in a transfer area
WO2014069942A1 (ko) 퍼지챔버 및 이를 구비하는 기판처리장치
JPH0689837A (ja) 基板処理装置
JP4912008B2 (ja) 基板処理装置
JP3200291B2 (ja) 洗浄装置
JP2518355Y2 (ja) 浸漬型基板処理装置
JP2006114607A (ja) 処理液供給装置
JPH1140497A (ja) 処理装置
JP3624278B2 (ja) 処理装置
JPH1140534A (ja) 基板洗浄装置の排気装置
WO2025204318A1 (ja) 基板処理装置および排気配管洗浄方法
JPH09162155A (ja) 処理方法及び処理装置
JP2001077081A (ja) エッチング装置
JPH0215545Y2 (https=)

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term