KR920013638A - 침지형 기판처리 장치 - Google Patents

침지형 기판처리 장치 Download PDF

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Publication number
KR920013638A
KR920013638A KR1019910023959A KR910023959A KR920013638A KR 920013638 A KR920013638 A KR 920013638A KR 1019910023959 A KR1019910023959 A KR 1019910023959A KR 910023959 A KR910023959 A KR 910023959A KR 920013638 A KR920013638 A KR 920013638A
Authority
KR
South Korea
Prior art keywords
air
housing
opening
closed space
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019910023959A
Other languages
English (en)
Korean (ko)
Inventor
도시오 히로에
겐지 스기모토
Original Assignee
이시다 아키라
다이닛뽕 스크린 세이조오 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이시다 아키라, 다이닛뽕 스크린 세이조오 가부시키가이샤 filed Critical 이시다 아키라
Publication of KR920013638A publication Critical patent/KR920013638A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0426—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Coating Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
KR1019910023959A 1990-12-28 1991-12-23 침지형 기판처리 장치 Withdrawn KR920013638A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1990406312U JPH071796Y2 (ja) 1990-12-28 1990-12-28 浸漬型基板処理装置
JP90-406312 1990-12-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR2019950032269U Division KR960000939Y1 (ko) 1990-12-06 1995-11-03 침지형 기판처리 장치

Publications (1)

Publication Number Publication Date
KR920013638A true KR920013638A (ko) 1992-07-29

Family

ID=18515925

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910023959A Withdrawn KR920013638A (ko) 1990-12-28 1991-12-23 침지형 기판처리 장치

Country Status (3)

Country Link
US (1) US5191908A (https=)
JP (1) JPH071796Y2 (https=)
KR (1) KR920013638A (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3225441B2 (ja) * 1991-04-23 2001-11-05 東京エレクトロン株式会社 処理装置
JP2804210B2 (ja) * 1992-01-22 1998-09-24 ジャパン・フィールド株式会社 洗浄装置
JP3110218B2 (ja) * 1992-09-25 2000-11-20 三菱電機株式会社 半導体洗浄装置及び方法、ウエハカセット、専用グローブ並びにウエハ受け治具
JP3142195B2 (ja) * 1993-07-20 2001-03-07 大日本スクリーン製造株式会社 薬液供給装置
US5402807A (en) * 1993-07-21 1995-04-04 Moore; David R. Multi-modular device for wet-processing integrated circuits
JP2894535B2 (ja) * 1994-01-18 1999-05-24 信越半導体株式会社 ウェーハホルダー
US5531236A (en) * 1994-06-01 1996-07-02 Kempka; Steven N. Directed flow fluid rinse trough
US5772784A (en) * 1994-11-14 1998-06-30 Yieldup International Ultra-low particle semiconductor cleaner
US5746234A (en) 1994-11-18 1998-05-05 Advanced Chemill Systems Method and apparatus for cleaning thin substrates
US5720813A (en) 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
TW333658B (en) * 1996-05-30 1998-06-11 Tokyo Electron Co Ltd The substrate processing method and substrate processing system
JPH10223585A (ja) 1997-02-04 1998-08-21 Canon Inc ウェハ処理装置及びその方法並びにｓｏｉウェハの製造方法
US6391067B2 (en) 1997-02-04 2002-05-21 Canon Kabushiki Kaisha Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
US6068002A (en) 1997-04-02 2000-05-30 Tokyo Electron Limited Cleaning and drying apparatus, wafer processing system and wafer processing method
JPH1126423A (ja) * 1997-07-09 1999-01-29 Sugai:Kk 半導体ウエハ等の処理方法並びにその処理装置
US6695926B1 (en) * 1997-07-09 2004-02-24 Ses Co., Ltd. Treatment method of semiconductor wafers and the like and treatment system for the same
KR100707107B1 (ko) * 1997-07-17 2007-12-27 동경 엘렉트론 주식회사 세정.건조처리방법및장치
DE59908053D1 (de) * 1998-04-06 2004-01-29 Koerner Chemieanlagen Eingehauste Beizanlage
US6532975B1 (en) * 1999-08-13 2003-03-18 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
JP3212981B1 (ja) * 2000-05-01 2001-09-25 正則 茂木 弁の開閉位置出力装置
JP4100466B2 (ja) * 2000-12-25 2008-06-11 東京エレクトロン株式会社 液処理装置
US7218983B2 (en) * 2003-11-06 2007-05-15 Applied Materials, Inc. Method and apparatus for integrating large and small lot electronic device fabrication facilities
US7720557B2 (en) * 2003-11-06 2010-05-18 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
US20050209721A1 (en) * 2003-11-06 2005-09-22 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
US8635784B2 (en) * 2005-10-04 2014-01-28 Applied Materials, Inc. Methods and apparatus for drying a substrate
JP5063138B2 (ja) * 2007-02-23 2012-10-31 株式会社Ｓｏｋｕｄｏ 基板現像方法および現像装置
JP5806811B2 (ja) * 2010-10-01 2015-11-10 株式会社日立国際電気 基板処理装置、基板処理方法および半導体装置の製造方法
AT511898A1 (de) * 2011-09-12 2013-03-15 Tms Transport Und Montagesysteme Gmbh Reinigungsmaschine zum reinigen industriell gefertigter bauteile
DE102018105966A1 (de) * 2018-03-15 2019-09-19 Schaeffler Technologies AG & Co. KG Anlage und Verfahren zum Behandeln einer Oberfläche mindestens eines großformatigen Bauteils
US11194259B2 (en) * 2018-08-30 2021-12-07 Taiwan Semiconductor Manufacturing Co., Ltd. Equipment module with enhanced protection from airborne contaminants, and method of operation

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2181177A (en) * 1937-05-26 1939-11-28 Howard C Davis Process of deposition
US3893869A (en) * 1974-05-31 1975-07-08 Rca Corp Megasonic cleaning system
JPS5181467A (ja) * 1975-01-10 1976-07-16 Hitachi Ltd Senjoso
GB2018831A (en) * 1978-03-30 1979-10-24 Price Bros Ltd Improvements in cleaning equipment
JPS6014244A (ja) * 1983-07-06 1985-01-24 Fujitsu Ltd マスク洗浄装置
JPS6085529A (ja) * 1983-10-17 1985-05-15 Mitsubishi Electric Corp 半導体ウエ−ハ薬液処理装置
US4520834A (en) * 1983-11-08 1985-06-04 Dicicco Paolo S Apparatus for processing articles in a series of process solution containers
JPS62198122A (ja) * 1986-02-26 1987-09-01 Hitachi Ltd 半導体処理装置
JPS63248449A (ja) * 1987-04-03 1988-10-14 Tadahiro Omi ドラフトチヤンバ
US4839979A (en) * 1987-07-13 1989-06-20 Sea Search, Inc. Spear gun tip assembly and method of use thereof
JPH01226157A (ja) * 1988-03-07 1989-09-08 Kyushu Electron Metal Co Ltd 半導体基板の乾燥方法
JPH01238022A (ja) * 1988-03-17 1989-09-22 Marine Instr Co Ltd 半導体処理装置
JPH01261829A (ja) * 1988-04-13 1989-10-18 Sumitomo Electric Ind Ltd 有機金属気相エピタキシー用基板の前処理方法

Also Published As

Publication number Publication date
US5191908A (en) 1993-03-09
JPH0492633U (https=) 1992-08-12
JPH071796Y2 (ja) 1995-01-18

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