JPH0717159Y2 - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPH0717159Y2
JPH0717159Y2 JP1985045672U JP4567285U JPH0717159Y2 JP H0717159 Y2 JPH0717159 Y2 JP H0717159Y2 JP 1985045672 U JP1985045672 U JP 1985045672U JP 4567285 U JP4567285 U JP 4567285U JP H0717159 Y2 JPH0717159 Y2 JP H0717159Y2
Authority
JP
Japan
Prior art keywords
layer
resin
semiconductor device
heat
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1985045672U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61162058U (enExample
Inventor
五郎 池上
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP1985045672U priority Critical patent/JPH0717159Y2/ja
Publication of JPS61162058U publication Critical patent/JPS61162058U/ja
Application granted granted Critical
Publication of JPH0717159Y2 publication Critical patent/JPH0717159Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP1985045672U 1985-03-27 1985-03-27 樹脂封止型半導体装置 Expired - Lifetime JPH0717159Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985045672U JPH0717159Y2 (ja) 1985-03-27 1985-03-27 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985045672U JPH0717159Y2 (ja) 1985-03-27 1985-03-27 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS61162058U JPS61162058U (enExample) 1986-10-07
JPH0717159Y2 true JPH0717159Y2 (ja) 1995-04-19

Family

ID=30559381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985045672U Expired - Lifetime JPH0717159Y2 (ja) 1985-03-27 1985-03-27 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPH0717159Y2 (enExample)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4918598U (enExample) * 1972-05-18 1974-02-16
JPS5419375A (en) * 1977-07-14 1979-02-14 Mitsubishi Electric Corp Semiconductor device
JPS55153385A (en) * 1979-05-18 1980-11-29 Nippon Telegr & Teleph Corp <Ntt> Current squeezing type semiconductor device

Also Published As

Publication number Publication date
JPS61162058U (enExample) 1986-10-07

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