JPH0329307B2 - - Google Patents

Info

Publication number
JPH0329307B2
JPH0329307B2 JP59271839A JP27183984A JPH0329307B2 JP H0329307 B2 JPH0329307 B2 JP H0329307B2 JP 59271839 A JP59271839 A JP 59271839A JP 27183984 A JP27183984 A JP 27183984A JP H0329307 B2 JPH0329307 B2 JP H0329307B2
Authority
JP
Japan
Prior art keywords
mold layer
support plate
thickness
semiconductor element
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59271839A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61150354A (ja
Inventor
Takao Emoto
Hiroshi Matsumoto
Toshihiro Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP59271839A priority Critical patent/JPS61150354A/ja
Publication of JPS61150354A publication Critical patent/JPS61150354A/ja
Publication of JPH0329307B2 publication Critical patent/JPH0329307B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/111—
    • H10W40/778—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5449—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP59271839A 1984-12-25 1984-12-25 樹脂封止型半導体装置 Granted JPS61150354A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59271839A JPS61150354A (ja) 1984-12-25 1984-12-25 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59271839A JPS61150354A (ja) 1984-12-25 1984-12-25 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS61150354A JPS61150354A (ja) 1986-07-09
JPH0329307B2 true JPH0329307B2 (enExample) 1991-04-23

Family

ID=17505581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59271839A Granted JPS61150354A (ja) 1984-12-25 1984-12-25 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS61150354A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5287144A (en) * 1989-07-05 1994-02-15 Canon Kabushiki Kaisha Image forming apparatus having transfer charger which is controlled according to ambient conditions
ATE154990T1 (de) * 1991-04-10 1997-07-15 Caddock Electronics Inc Schichtwiderstand
US5252944A (en) * 1991-09-12 1993-10-12 Caddock Electronics, Inc. Film-type electrical resistor combination
US8269338B2 (en) 2006-08-10 2012-09-18 Vishay General Semiconductor Llc Semiconductor device having improved heat dissipation capabilities

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59152654A (ja) * 1983-02-21 1984-08-31 Nec Corp 絶縁形半導体装置

Also Published As

Publication number Publication date
JPS61150354A (ja) 1986-07-09

Similar Documents

Publication Publication Date Title
US4849803A (en) Molded resin semiconductor device
US4620215A (en) Integrated circuit packaging systems with double surface heat dissipation
US7449774B1 (en) Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same
JP2509607B2 (ja) 樹脂封止型半導体装置
JPS6139555A (ja) 放熱板付樹脂封止形半導体装置
US20030011054A1 (en) Power module package having improved heat dissipating capability
JP4262453B2 (ja) 電力半導体装置
JPS61241959A (ja) 半導体モジユ−ル
JPH09260550A (ja) 半導体装置
JPH0732215B2 (ja) 半導体装置
US20030011053A1 (en) Semiconductor device
JPS60137042A (ja) 樹脂封止形半導体装置
JPH0329307B2 (enExample)
JPS61144855A (ja) 半導体回路のためのパツケージ
JPH04249353A (ja) 樹脂封止型半導体装置
JPS62229961A (ja) 樹脂封止型半導体装置
JPH0645504A (ja) 半導体装置
JPH0758746B2 (ja) 樹脂封止型半導体装置
KR20190085587A (ko) 고열전도성 반도체 패키지
CN221805509U (zh) 一种双面冷却功率模块及功率模组
JP2713141B2 (ja) 半導体装置
JP3502511B2 (ja) 半導体装置
JP3368742B2 (ja) 半導体装置
JPH0363822B2 (enExample)
JPS6057655A (ja) 半導体装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term