JPS61150354A - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS61150354A
JPS61150354A JP59271839A JP27183984A JPS61150354A JP S61150354 A JPS61150354 A JP S61150354A JP 59271839 A JP59271839 A JP 59271839A JP 27183984 A JP27183984 A JP 27183984A JP S61150354 A JPS61150354 A JP S61150354A
Authority
JP
Japan
Prior art keywords
support plate
thickness
layer
mold layer
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59271839A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0329307B2 (enExample
Inventor
Takao Emoto
江本　孝朗
Hiroshi Matsumoto
博 松本
Toshihiro Kato
加藤　俊博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59271839A priority Critical patent/JPS61150354A/ja
Publication of JPS61150354A publication Critical patent/JPS61150354A/ja
Publication of JPH0329307B2 publication Critical patent/JPH0329307B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP59271839A 1984-12-25 1984-12-25 樹脂封止型半導体装置 Granted JPS61150354A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59271839A JPS61150354A (ja) 1984-12-25 1984-12-25 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59271839A JPS61150354A (ja) 1984-12-25 1984-12-25 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS61150354A true JPS61150354A (ja) 1986-07-09
JPH0329307B2 JPH0329307B2 (enExample) 1991-04-23

Family

ID=17505581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59271839A Granted JPS61150354A (ja) 1984-12-25 1984-12-25 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS61150354A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5252944A (en) * 1991-09-12 1993-10-12 Caddock Electronics, Inc. Film-type electrical resistor combination
US5287144A (en) * 1989-07-05 1994-02-15 Canon Kabushiki Kaisha Image forming apparatus having transfer charger which is controlled according to ambient conditions
US5291178A (en) * 1991-04-10 1994-03-01 Caddock Electronics, Inc. Film-type resistor assembly with full encapsulation except at the bottom surface
EP2057679A4 (en) * 2006-08-10 2012-08-01 Vishay Gen Semiconductor Llc Semiconductor device having improved heat dissipation capabilities

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59152654A (ja) * 1983-02-21 1984-08-31 Nec Corp 絶縁形半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59152654A (ja) * 1983-02-21 1984-08-31 Nec Corp 絶縁形半導体装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5287144A (en) * 1989-07-05 1994-02-15 Canon Kabushiki Kaisha Image forming apparatus having transfer charger which is controlled according to ambient conditions
US5291178A (en) * 1991-04-10 1994-03-01 Caddock Electronics, Inc. Film-type resistor assembly with full encapsulation except at the bottom surface
US5252944A (en) * 1991-09-12 1993-10-12 Caddock Electronics, Inc. Film-type electrical resistor combination
EP2057679A4 (en) * 2006-08-10 2012-08-01 Vishay Gen Semiconductor Llc Semiconductor device having improved heat dissipation capabilities
US8269338B2 (en) 2006-08-10 2012-09-18 Vishay General Semiconductor Llc Semiconductor device having improved heat dissipation capabilities

Also Published As

Publication number Publication date
JPH0329307B2 (enExample) 1991-04-23

Similar Documents

Publication Publication Date Title
US6479326B1 (en) Heat sink for microchip application
US4620215A (en) Integrated circuit packaging systems with double surface heat dissipation
US5751552A (en) Semiconductor device balancing thermal expansion coefficient mismatch
US7061080B2 (en) Power module package having improved heat dissipating capability
US5703398A (en) Semiconductor integrated circuit device and method of producing the semiconductor integrated circuit device
JPS6139555A (ja) 放熱板付樹脂封止形半導体装置
US4924351A (en) Recessed thermally conductive packaged semiconductor devices
JPH0732215B2 (ja) 半導体装置
EP0069390B1 (en) Lead frame for plastic encapsulated semiconductor device
US7221055B2 (en) System and method for die attach using a backside heat spreader
US4057825A (en) Semiconductor device with composite metal heat-radiating plate onto which semiconductor element is soldered
US20200312735A1 (en) Cooling of electronic devices
JPS61150354A (ja) 樹脂封止型半導体装置
JPS60137042A (ja) 樹脂封止形半導体装置
JP2002110867A (ja) 半導体装置及びその製造方法
JPS62229961A (ja) 樹脂封止型半導体装置
JPH02307251A (ja) 樹脂封止型半導体装置
JPH04249353A (ja) 樹脂封止型半導体装置
JP2004335493A (ja) 半導体装置の実装構造
US6846697B2 (en) Integrated circuit packages and the method for making the same
JP3010924B2 (ja) 半導体装置
JPH0758746B2 (ja) 樹脂封止型半導体装置
KR900001833B1 (ko) 수지봉합형 반도체장치
JP2508567B2 (ja) 半導体装置の製造方法
JPH04168753A (ja) 半導体装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term