JPH0713230Y2 - 電子部品 - Google Patents

電子部品

Info

Publication number
JPH0713230Y2
JPH0713230Y2 JP13272788U JP13272788U JPH0713230Y2 JP H0713230 Y2 JPH0713230 Y2 JP H0713230Y2 JP 13272788 U JP13272788 U JP 13272788U JP 13272788 U JP13272788 U JP 13272788U JP H0713230 Y2 JPH0713230 Y2 JP H0713230Y2
Authority
JP
Japan
Prior art keywords
soldering
flat lead
side wall
package
wall surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP13272788U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0252451U (en, 2012
Inventor
正勝 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP13272788U priority Critical patent/JPH0713230Y2/ja
Publication of JPH0252451U publication Critical patent/JPH0252451U/ja
Application granted granted Critical
Publication of JPH0713230Y2 publication Critical patent/JPH0713230Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP13272788U 1988-10-11 1988-10-11 電子部品 Expired - Lifetime JPH0713230Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13272788U JPH0713230Y2 (ja) 1988-10-11 1988-10-11 電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13272788U JPH0713230Y2 (ja) 1988-10-11 1988-10-11 電子部品

Publications (2)

Publication Number Publication Date
JPH0252451U JPH0252451U (en, 2012) 1990-04-16
JPH0713230Y2 true JPH0713230Y2 (ja) 1995-03-29

Family

ID=31389956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13272788U Expired - Lifetime JPH0713230Y2 (ja) 1988-10-11 1988-10-11 電子部品

Country Status (1)

Country Link
JP (1) JPH0713230Y2 (en, 2012)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6589132B2 (ja) * 2015-08-24 2019-10-16 パナソニックＩｐマネジメント株式会社 電子部品

Also Published As

Publication number Publication date
JPH0252451U (en, 2012) 1990-04-16

Similar Documents

Publication Publication Date Title
JP3310499B2 (ja) 半導体装置
JPH11354769A (ja) 固体撮像装置及びその製造方法
JPH0713230Y2 (ja) 電子部品
JP2907127B2 (ja) マルチチップモジュール
JP2807944B2 (ja) 混成集積回路装置及びその製造方法
JP2711075B2 (ja) 受光装置の製造方法
JP2906756B2 (ja) 電子部品搭載用基板
JPS5882555A (ja) ２つ以上の集積回路を収納するボツクスの製造方法
JPH08250542A (ja) 電子部品および電子部品の実装構造
JPH0631736Y2 (ja) プリント回路基板
JPH03209793A (ja) ガラス基板の半田接続構造
JPH0150100B2 (en, 2012)
JP2639342B2 (ja) 電子部品搭載用パッド並びにパッド及び電子部品の検査方法
JP3006075B2 (ja) リードの長さばらつき検出方法およびリード先端部の半田の外観検査方法
JPH0769267B2 (ja) 裏面点検鏡
JP2996090B2 (ja) 半導体装置
JPH09232714A (ja) プリント基板及びプリント基板の製造方法
JP2001244481A (ja) 半導体トランスデューサ
JPH1167829A (ja) 電子部品の実装方法及び該方法に用いる電子部品と配線基板
JP2001102888A (ja) 電子部品の製造方法
JPH0447255A (ja) 電子部品の微細接続検査装置
JPS5927061Y2 (ja) 混成集積回路装置
JP2002313998A (ja) 半導体装置
JPH04237155A (ja) 電子部品
JPH043454A (ja) 半導体パッケージ