JPH0713224Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPH0713224Y2 JPH0713224Y2 JP1988166161U JP16616188U JPH0713224Y2 JP H0713224 Y2 JPH0713224 Y2 JP H0713224Y2 JP 1988166161 U JP1988166161 U JP 1988166161U JP 16616188 U JP16616188 U JP 16616188U JP H0713224 Y2 JPH0713224 Y2 JP H0713224Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- fuse
- wedge
- semiconductor device
- passivation film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 27
- 238000002161 passivation Methods 0.000 claims description 16
- 229920002379 silicone rubber Polymers 0.000 claims description 15
- 239000004945 silicone rubber Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988166161U JPH0713224Y2 (ja) | 1988-12-21 | 1988-12-21 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988166161U JPH0713224Y2 (ja) | 1988-12-21 | 1988-12-21 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0286139U JPH0286139U (enrdf_load_stackoverflow) | 1990-07-09 |
| JPH0713224Y2 true JPH0713224Y2 (ja) | 1995-03-29 |
Family
ID=31453302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988166161U Expired - Lifetime JPH0713224Y2 (ja) | 1988-12-21 | 1988-12-21 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0713224Y2 (enrdf_load_stackoverflow) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56146268A (en) * | 1980-04-15 | 1981-11-13 | Fujitsu Ltd | Manufacture of semiconductor memory unit |
| JPS58206144A (ja) * | 1982-05-26 | 1983-12-01 | Hitachi Ltd | 半導体装置の製造方法 |
| JPS62194641A (ja) * | 1986-02-20 | 1987-08-27 | Fujitsu Ltd | ウエ−ハスケ−ル集積回路装置 |
-
1988
- 1988-12-21 JP JP1988166161U patent/JPH0713224Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0286139U (enrdf_load_stackoverflow) | 1990-07-09 |
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