JPH0710497Y2 - リードフレームの部分メッキ用治具 - Google Patents

リードフレームの部分メッキ用治具

Info

Publication number
JPH0710497Y2
JPH0710497Y2 JP1988086408U JP8640888U JPH0710497Y2 JP H0710497 Y2 JPH0710497 Y2 JP H0710497Y2 JP 1988086408 U JP1988086408 U JP 1988086408U JP 8640888 U JP8640888 U JP 8640888U JP H0710497 Y2 JPH0710497 Y2 JP H0710497Y2
Authority
JP
Japan
Prior art keywords
lead frame
plating
jig
partial plating
holding plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988086408U
Other languages
English (en)
Japanese (ja)
Other versions
JPH028149U (cs
Inventor
智明 古閑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui High Tec Inc
Original Assignee
Mitsui High Tec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui High Tec Inc filed Critical Mitsui High Tec Inc
Priority to JP1988086408U priority Critical patent/JPH0710497Y2/ja
Publication of JPH028149U publication Critical patent/JPH028149U/ja
Application granted granted Critical
Publication of JPH0710497Y2 publication Critical patent/JPH0710497Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
JP1988086408U 1988-06-28 1988-06-28 リードフレームの部分メッキ用治具 Expired - Lifetime JPH0710497Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988086408U JPH0710497Y2 (ja) 1988-06-28 1988-06-28 リードフレームの部分メッキ用治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988086408U JPH0710497Y2 (ja) 1988-06-28 1988-06-28 リードフレームの部分メッキ用治具

Publications (2)

Publication Number Publication Date
JPH028149U JPH028149U (cs) 1990-01-19
JPH0710497Y2 true JPH0710497Y2 (ja) 1995-03-08

Family

ID=31311046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988086408U Expired - Lifetime JPH0710497Y2 (ja) 1988-06-28 1988-06-28 リードフレームの部分メッキ用治具

Country Status (1)

Country Link
JP (1) JPH0710497Y2 (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2581342B2 (ja) * 1991-04-30 1997-02-12 株式会社村田製作所 リードフレームの保持具

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5569290A (en) * 1978-11-13 1980-05-24 Mitsubishi Electric Corp Method and apparatus for production of partially plated metal material
JPS62135446U (cs) * 1986-02-19 1987-08-26

Also Published As

Publication number Publication date
JPH028149U (cs) 1990-01-19

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